Proceedings: May 18 - 20, 1992 ; The Sheraton Harbor Island Hotel, San Diego, California
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| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
New York
IEEE
1992
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| Subjects: | |
| Online Access: | Inhaltsverzeichnis |
| Physical Description: | XVIII, 1094 S. Ill., graph. Darst. |
| ISBN: | 0780301676 0780301684 0780301692 |
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| 245 | 1 | 0 | |a Proceedings |b May 18 - 20, 1992 ; The Sheraton Harbor Island Hotel, San Diego, California |c 42nd Electronic Components & Technology Conference 1992 |
| 264 | 1 | |a New York |b IEEE |c 1992 | |
| 300 | |a XVIII, 1094 S. |b Ill., graph. Darst. | ||
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| adam_text | Contents
Session
I
...................
Trade-Off/
Advanced
Packaging
Chairman: John Kelly, IBM Corporation
Co-Chairman: Jack
Balde,
Interconnect Decision Consultants
Multichip Packaging Technologies in IBM for Desktop to Mainframe Computers
.........1
R.R. Tummala and B.T. Clark, IBM Corporation
Equations for Selection of Cost-Efficient Interconnection Designs
....................10
G.
Messner,
AMP-AKZO Corporation; W.
Smit, AKZO
Electronic Products
Cost Analysis of a High-Performance CMOS Multichip Module
.....................17
G. Thornberg, NCR Corporation
Surface Laminar Circuit Packaging
.........................................22
Y. Tsukada, S. Tsuchida and Y. Mashimoto, IBM Japan
VLSI Packaging Requirements for New and Evolving Workstations
...................28
H.L. Davidson, Sun Microsystems
Multichip Modules vs High-Density Printed Wiring Boards: A Trade-Off Study
..........31
D.E.
O Brien, B.M.
Hahne
and J.P. Krusius, Cornell University
High-Density Packaging: Future Outlook
......................................36
L.R.
Buda,
R.W. Gedney
and
T.F. Kelley,
IBM
Corporation
Session II
.....................
Manufacturing Technology I
Chairman
:
Tom Poulin, DuPont Electronics
Co-Chairman: Tony Suppelsa,
Motorola, Inc.
Welding of Plated, Dissimilar Metals for RF/EMI Shielding
........................42
W.R. Bratschun and J.L.
Leicht,
Motorola, Inc.
Water Soluble Paste Survey for Fine Pitch SMT Attach
...........................49
B. Carpenter, K. Pearsall and R. Raines, IBM Corporation
Development of Laser Soldering Process for a Tape Carrier Package
..................57
M. Namatame, K. Murakami, J. Hirota, O. Hayashi and S. Hoshinouchi,
Mitsubishi Electric Corporation
New Twist to Water Cleaning Guarantees Reliability
.............................62
J.G. Ameen, IBM Corporation
Correlation of Solderability Failures of Tin-Plated Parts with Dissolved Metal Build-Up
in Preclean Bath
.......................................................66
F.L.
Trabado
and E.M. Ratilla, Intel Philippines Manufacturing, Incorporated
Correlation of Thickness Measurements Obtained from Cross-Sectioning and
from
Х
-Ray Fluorescence Spectrometry
......................................72
F.L.
Trabado
and J.S.
Mendoza,
Intel Philippines Manufacturing, Incorporated
vi
Session
III
............Optoelectronics
I (Array Technology)
Chairman
:
L. Watkins, AT&T Bell Laboratories
Co-Chairman: W. Young, Bell Communications Research
Optical Parallel Interconnection Characteristics of 4-Channel 2-Gbit/s Bit Synchronous
Data Transmission Module
...............................................77
F. Shimizu, H. Furuyama, H. Hamasaki, F. Kuroda, M. Nakamura and T. Tamura,
Toshiba Corporation
Short Distance
б-Спаппеі
Parallel Optical Link for Data Communications
.............83
H. Karstensen and H.W. Schneider, Siemens
AG;
J.
Wieland,
Swiss Federal Institute of Technology
Thermal/Electrical Behavior of 1300-nm Quad Laser Arrays
in Various Packaging Arrangements
........................................88
P.D.
Hoh, R.J.S. Bates, R. Strijek, G. Costrini, A. Antreasyan, S.
Scontras, J. Ferrano,
E. Cahoon
and A. Behfar-Rad,
IBM Corporation
A Compact Multichannel Transceiver Module Using Planar-Processed Optical Waveguides
and Flip-Chip Optoelectronic Components
...................................93
K.P.
Jackson, E.B. Flint, M.F.
Cina,
D.
Lacey,
J.M.
Trewhella,
T. Caulfield
and
S. Sibley, IBM Corporation
Packaging of High-Density Fiber/ Laser Modules Using Passive Alignment Techniques
.... 98
M.S. Cohen, M.F.
Cina,
E. Bassous, M.M.
Oprysko, J.L. Speidell, F.J.
Canora
and
M.J. Defranza, IBM Corporation
Four-Channel, Long-Wavelength Transmitter Arrays
Incorporating Passive Laser/Singlemode-Fiber Alignment on Silicon Waferboard
......108
C.A.
Anniento,
AJ.
Negri,
M.J. Tabasky, R.A. Boudreau, M.A. Rothman,
T.W. Fitzgerald and P.O. Haugsjaa, GTE Laboratories Incorporated
Subsystem Optical Interconnections Using Long-Wavelength LD
and Singlemode-Fiber Arrays
............................................115
A. Takai, H. Abe and T.
Kato,
Hitachi, Ltd.
Session IV
...................
Hybrid/MCM-C Applications
Chairman: Steve
Gallo, DuPont
Electronics
Co-Chairman: Joseph W. Soucy, GTE Government Systems Corp.
A Low-Cost Manufacturing Process for High-Density Hybrid Components,
Based on Multilayer Polyimide/ Ceramic Structures
............................120
M. Tudanca, R.Glz.
Luna, A. Fraile,
J.
Triana,
J.M.
Gonzalvez and I. Vincueria,
Area
Componentes y Tecnologías,
TELETTRA SPAIN;
С.
Domínguez, Centro Nacional de Microelectronica (CSIC)
Stress
Analysis of
Polyimide
Copper Thin Film Structure
on Glass Ceramic/ Copper Multilevel Substrate
...............................129
S. Kapur, IBM Corporation
Multichip Module Technologies for Workstation Applications
......................134
V.K. Nagesh and D. Miller, Hewlett-Packard Company
High-Frequency Performance of GE High-Density Interconnect Modules
..............136
T.R.
Haller
and B.S. Whitmore, GE; P.J. Zabinski and B.K. Gilbert, Mayo Foundation
High-Reliability Silver-Bearing Thick Film Conductors for Automotive Applications
.....144
K. Yamamoto, S.
Abou
and S. Uchida, Toyota Motor Corporation; H.
Kojo,
HY.
Hara,
Y. Yamamoto and B.E.
Taylor,
DuPont
Japan
Ltd.; M.H. LaBranche, DuPont
VII
Session
IV
........................Hybrid/MCM-C Applications
(continued)
A Thick Film Package for Microwave ICs
.....................................151
R. Gutierrez, Phoenix Microwave Corporation;
H.M. Olson and D.R. Decker, Lehigh University
A SiC Hybrid Operational Amplifier for 350°C Operation
.........................157
M.
Tomana, R.W.
Johnson and R.C. Jaeger, Auburn University;
J. Palmour,
Cree
Research
Session V
........................
Test and Failure Analysis
Chairman: David W. Bushmire,
Sandia
National Laboratories
Co-Chairman: Paul Englert, AT&T Bell Laboratories
Propagation Mechanism and Metallurgical Characterization
of First Bond Brittle Heel Cracks in AISi Wire
................................162
R.T. Fitzsimmons, Raytheon Company; H.
Chia,
American Fine Wire
Development of Mechanical Fatigue Test Method for Flip-Chip Solder Joints
..........167
H.
Doi,
К.
Kawano,
R.
Minamitani,
T.
Hatsuda and T. Hayashida, Hitachi, Ltd.
Stress Transfer Across Polyimide Passivation Layers
............................171
L.S. Schadler and I.C. Noyan, IBM Corporation
A Study of Failures Identified During Board Level Environmental Stress Testing
........177
T.P. Parker and C.W. Webb, A T&
T
Relative Effectiveness of Thermal Cycling versus Burn-In: A Case Study
..............185
F. LoVasco and K.
Lo,
AT&T Bell Laboratories
Reliability Evaluation of High-Pincount Hermetic Ceramic
1С
Packages
for Space Applications
.................................................190
J. Barrett, T. Hayes, R. Doyle, C. O Mathuna and T. Yamada, National Microelectronics
Research Centre; A. Boetti, European Space Research and Technology Centre
Substantiation of Aging Characteristics of PCM Timing Detect
&
Tuning Circuit
for
20
Years
.........................................................200
M.
Saita,
K. Ono
and
T.
Shozi, Hitachi, Ltd.
Session
VI
....................................
Adhesives
Chairman:
Rajen
Chanchani,
Sandia
National Laboratories
Co-Chairman: J.E. Billigmeier, 3M Company
Effects
of Materials
and Processing on the Reliability of Silver-Glass Die Attach Pastes
. . . 208
S.M. Dershem and
CE. Hoge,
Quantum Materials, Inc.
New Type Film-Adhesives for Microelectronics Application
........................215
Y. Sakamoto,
N.
Takeda, T. Takeda and A. Tokoh, Sumitomo
Bakelite
Co., Ltd.
;
D.Y. Tang, Occidental Chemical Corporation
Prediction and Measurement of Thermal Conductivity of Diamond Filled Adhesives
.....219
J.C. Bolger, Emerson
&
Cuming, Inc.
Silver-Induced Volatile Species Generation from Conductive Die Attach Adhesives
......225
Т.Е.
Phillips,
N. deHaas, P.G.
Goodwin and R.C. Benson, The Johns Hopkins University
Low-Temperature Die Attach Material
......................................234
С
Smith,
K. Le, T. Herrington,
J.S. Jeng and M. Akhtar, Johnson Matthey Inc.
l
Session
VI
.........................................Adhesives
(continued)
Low Moisture Polymer Adhesive for Hermetic Packages
..........................239
M.N. Nguyen and
M.B. Grosse,
Johnson Matthey Inc.
Process Characterization of a Low-Temperature, Silver-Glass Die Attach Material
Using Thermo Gravimetric Analysis
.......................................245
S. J. Corbett, Alpha Metals Inc.
Session
VII
..................................
Connectors
Chairman: Frank Almquist, IBM Corporation
Co-Chairman: Alan Knight, IBM Corporation
Multichip Module Connector Evaluation at Unisys
..............................252
RJ. Kuntz, Unisys Corporation
Leaded Multichip Module Connector
........................................258
M.F.
Laub,
AMP, Incorporated
Solderless High-Density Interconnects for Burn-In Applications
....................263
F.J. Guarin and
A.A.
Katsetos, IBM Corporation
High-Density, Zero-Insertion-Force, Microcoaxial Cable Interconnection Technology
.... 268
R. Rothenberger and R.S. Mroczkowski, AMP Incorporated
Optimizing Force and Geometry Parameters in Design of Reduced-Insertion Force
Connectors
..........................................................273
I. Sawchyn and E.S. Sproles, AT&T Bell Laboratories
Analysis of the
С
-Shaped Compliant Section
..................................282
H.S. Fluss, AT&T Bell Laboratories
Optimization of
Futurebus
+
Backplane Structures
.............................287
V. Florescu, Digital Equipment of Canada Ltd.
;
R.C. Lupien, Digital Equipment Corporation
Session
VIII.........................
Poster Presentations
Chairman: Daryl Ann Doane, DAD Technologies, Inc.
Co-Chairman: Praveen Jain, Intel Corporation
NEW MATERIALS AND PROCESSES
1
Dielectric and Piezoelectric Properties of PZT Ceramics Doped with 4PbO-B2O3
.....293
L. Wu and
C
-Н.
Wang, National Cheng-Kung University
2
Spring Metals for Terminals and Connectors in Harsh Environments
............297
D. Bender and S.P. Zarlingo, Olin Brass
3
Ceramic
Varistor
Fabricated by Surface Diffusion
...........................306
S-L.
Fu,
Kaohsiung Polytechnic Institute; K-Y.
Chao,
National Cheng-Kung University
4
Influence of Pre-Synthetic Spinels on Electrical Properties of ZnO
Varistors........311
Q.
Zou
and Z-Y.
Meng,
Xián Jiaotong
University
MCM
AND PACKAGING APPLICATIONS
5
Elastomeric Sockets for Chip Carriers and MCMs
..........................316
L.S. Buchoff, Elastomeric Technologies, Inc.
6
A Readily Pretestable, Reworkable
MCM
.................................321
L.
Hanlon,
C.C.
Chang and R. Bernard, Hewlett-Packard Company
ix
MCM
AND PACKAGING APPLICATIONS (continued)
7
Package Architecture Design and Optimization Tool AUDiT:
Version
4.2
for Inhomogeneous Systems
.................................326
B.M.
Hahne, D.E.
O Brien and J.P. Krusius, Cornell University
8
Thermal Analysis of Plastic QFP with High Thermal Dissipation
................332
M. Tanaka and Y. Takeuchi, Shinko Electric Industries Co., Ltd.
9
The
3D
Stack in Short Form
...........................................340
J.A. Minahan,
A. Pepe,
R.
Some and
M. Suer,
Irvine Sensors Corporation
SURFACE-MOUNT TECHNOLOGIES
10
Compliance Metrics for the Generalized S-Bend Lead Design for Surface-Mount
Components
.....................................................345
R.W. Kotiowitz, AT&T Bell Laboratories; G. Gosen, Stevens Institute of Technology
11
Correlation of
Uniaxial
Tension-Tension, Torsion,
and
Multiaxial
Tension-Torsion Fatigue Failure in a 63Sn-37Pb Solder Alloy
......354
R. Cortez, E.C. Cutiongco and M.E. Fine, Northwestern University;
D.A. Jeannotte, IBM Corporation
INTERCONNECTIONS
12
Au-Sn Bonding Metallurgy of TAB Contacts and its Influence on the Kirkendall Effect
in the Ternary Cu-Au-Sn System
.......................................360
E. Zakel and H. Reichl, Technical University Berlin
13
High-Leadcount, Single-
&
Multi-Metal-Layer TAB: Design Considerations
........372
K.A. Mabin, Rogers Corporation
14
Practical Transmission Line Analysis
....................................377
R.E. Canright, Martin Marietta Electronics Systems
RELIABILITY ISSUES
15
Reliability Qualification Test for Circuit Boards Exposed to Airborne
Hygroscopic Dust
..................................................384
F.S. Sandroff and W.H. Burnett, Bellcore
16
An Improved Method of Parameter Estimation for the Application Having
High Reliability
...................................................390
W.
Jun,
The Research Institute of Mechanical Science and Technology
OPTOELECTRONICS
17
Design Driven LED Degradation Model for
Opto
Isolators
.....................394
J. Keller, Motorola, Inc.
18
A Novel 850-nm Surface-Emitting LED with 131-nm Spectral Width
............. 399
H.K. Nettelbladt and M.K. Widman, ABB HAFO
19
Wide Dynamic Range PIN-GaAs
1С
Optical Receiver Module for
622
Mbit/s
.......406
Y.
Mikamura,
S.
Inano,
К.
Murata, E. Tsumura and
T.
Suzuki,
Sumitomo Electric Industries, Ltd.
Session
IX
.........................Single-Chip
Packaging
Chairman: John
Segelken,
AT&T Bell Laboratories
Co-Chairman: Paul VanLoan, Hewlett-Packard Company
Packaging a 150-W Bipolar ECL Microprocessor
...............................412
W.R.
Hamburgen
and J.S. Fitch, Digital Equipment Corporation
The Technology for over 300-pin QFPs
.......................................423
Y. Shirai, K. Otsuka, T. Okinaga, H. Suzuki, G. Murakami, K.
Arai,
Y. Satuu, T. Emata
and T. Matsunaga, Hitachi, Ltd.
Thin QFP
Design and Development
.........................................429
A. Woosley, F. Djennas, M. McShane, F. Primeaux, D. Kraft, R.
Reinhardt, J.
Bigler
and J.
Casto,
Motorola, Inc.
High-Performance Tape Package
...........................................438
L. Fox, C. Davidson, S.
Hansen,
К.
Brown and A. Oscilowski,
Digital Equipment Corporation
Multimetal DTAB Packages for a 125-MHz Computer
...........................450
R.
Kaw,
D.
Yanaga and F.
Matta,
Hewlett-Packard Company
New Design for a Leadframe Used for High-Speed Transmission
and High-Power LSI Package
............................................458
M. Mita, S.
Takagi,
T. Kumakura, K.
Yamaguchi and H. Tanaka, Hitachi Cable, Ltd.
Investigation of Thermo-Mechanically Induced Stress in a PQFP
160
Using Finite Element Techniques
..........................................467
G. Kelly, C. Lyden, C. O Mathuna and J.S. Campbell,
National Microelectronics Research Centre
Session X
..
Interconnections I (Polymeric, Flip-Chip, Optical)
Chairman:
Les Fox,
Digital Equipment Corporation
Co-Chairman: Ben Cranston, AT&T Bell Laboratories
An Overview of Elastomeric Conductive Polymer Interconnection Materials
and Their Use in
MCM
Technology
........................................473
J.A. Fulton,
D.D.
Chang, J.R.
Nis
and M.B. Schmidt, AT&
T Bell
Laboratories
Percolation Constraints in the Use of Conductor-Filled Polymers for Interconnects
......481
G.R. Ruschau, S. Yoshikawa and R.E. Newnham, Pennsylvania State University
Direct Chip Interconnect with Adhesive-Connector Films
.........................487
N.R. Basavanhally,
D.D.
Chang, B.H. Cranston and S.G.
Seger,
AT&TBell Laboratories
Palladium Enhanced Dry Soldering Process
...................................492
H.L. Yeh, IBM Corporation; S. Strickman, University of Pennsylvania
A Eutectic Bonding Technology at a Temperature Below the Eutectic Point
............502
C.Y. Wang and C.C. Lee, University of California
Precision Flip-Chip Solder Bump Interconnects for Optical Packaging
...............508
B. Imler, K.
Scholz,
M.
Cobarruviaz,
R.
Haitz, V.K. Nagesh and
С
Chao,
Hewlett-Packard Co.
Holographic Optical Interconnects for VLSI Multichip Modules
....................513
M.R. Feldman, J.E. Morris,
N.
Hangzó
and W.H. Welch, University of North Carolina;
I. Turlik and G.M.
Adema, MCNC
Session
XI
.......................................
Solder
Chairman: Harry Charles, The Johns Hopkins University
Co-Chairman: Ron Thiel,
General Dynamics /Electronics
Solder Joint Reliability of a Thin Small Outline Package (TSOP)
...................519
J.
Lau,
D.
Rice and
S.
Erasmus, Hewlett-Packard Company;
S. Golwalkar, P. Boysan, R. Surratt and R. Foehringer, Intel Corporation
Reliability Modeling of Soldered Interconnections
..............................533
J.F. Prosser and
N.T.
Panousis, IBM Corporation
Constitutive Relations for Tin-Based-Solder Joints
..............................538
R. Darveaux and K. Banerji, Motorola, Inc.
Effect of the Specimen Size in Predicting the Mechanical Properties
of PbSn Solder Alloys
..................................................552
N.R.
Bonda
and I.C. Noyan, IBM Corporation
Torsionai
Stiffness and Fatigue Study of Surface-Mounted Compliant Leaded Systems
. . . 557
P.A. Engel,
State University of New York at Binghamton; T.M. Miller, Dresser-Rand
Mechanical Behavior and Reliability of Solder Joint Interconnections
in Thermally Matched Assemblies
.........................................563
E. Suhir, AT&T Bell Laboratories
Session
XII................................
Components I
Chairman: Ramachandra Munikoti, Northern Telecom, Inc.
Co-Chairman: Larry Burton, Pennsylvania State University
The Close Attached Capacitor A Solution to Switching Noise Problems
...............573
H. Hashemi and
P.A. Sandborn,
Microelectronics and Computer Technology Corporation;
D.
Disko,
Advanced MicroDevices; R. Evans, Digital Equipment Corporation
Design of Precision Capacitors for Analog Applications
..........................583
S.A.
St Onge, S.G. Franz, A.F. Puttlitz, A. Kalinoski, B.E. Johnson and B. El-Kareh,
IBM Corporation
High-Frequency Design and Performance of Tubular Capacitors
....................591
A.T. Murphy and F.J. Young, DuPont Electronics
High-Permittivity Ceramic Dielectrics for Tuning Transmission
in Power Electronic Converters
...........................................601
W.A. Cronje, J.D. van
Wyk
and M.F.K. Holm, Rand Afrikaans University
Steady-State and Transient
С
-V
Response of a High-Voltage Nonlinear Barium Titanate
Ceramic-Disc Power-Snubber Capacitor
....................................607
C.K. Campbell, J.D. van
Wyk,
M.F.K. Holm, J.J.R. Prinsloo and J.J. Schoeman,
Rand Afrikaans University
Characterization and Reliability of Electrolytic Capacitors
Exposed to Halogenated Solvents
..........................................611
R.L. MaSaitis,
AJ.
Muller,
R.L.
Opila,
L.A. Psota-Kelty and S. Daoud,
AT&T Bell Laboratories
Acceleration Coefficient of The Molded Electric Double Layer Capacitor
..............617
Y. Kobayashi, NEC Corporation
XII
Session
XIII...........................
Optoelectronics II
(Low-Cost Packaging
&
Connectors)
Chairman: Mark
Beranek,
Boeing High Technology Center
Co-Chairman: F. DiMarcello, AT&T Bell Laboratories
Design Manufacture and Performance of Receptacle (Connectorised) Laser Diode Packages
for
1.3-μΐη
and
1.55-μηι
Fibre Systems
......................................624
A.J.N. Houghton and G. Jones, Northern Telecom Optoelectronics
Connectorized Integrated Star Couplers on Silicon
..............................630
H.M. Presby, AT&T Bell Laboratories
Factors Affecting Fiber Optic Connector Pluggability
............................633
O. Paz, H.B.
Schwartz,
D.E.
Smith and E.B. Flint, IBM Corporation
A New Type of Fiber Optic Connector Designed for Military Optical Backplanes
........643
R.J.
Pimpinella, A T&
T Bell
Laboratories
Plastic Optical Fiber Based Components for LAN
and Data Communication Applications
.....................................648
J. Cirillo, K. Jennings, M. Lynn and R. Steele, Packard Electric Division of General
Motors Corporation
Polymeric Resin-Filled Optical Couplers with Mode Mixing
and Polarization Scrambling Microparticles
.................................652
GJ. Grimes and L.L. Blyler, AT&TBell Laboratories
Use of Low Cost Plastic DIPs and Injection Molded Parts
in Packaging of Optical Data Links
........................................661
M.S. Acarlar, S.L. Moyer and
S.D.
Robinson, AT&TBell Laboratories
Session
XIV......
Dielectric and Multichip Module Materials
Chairman: Raj Master, IBM Corporation
Co-Chairman: W. R. Bratschun, Motorola, Inc.
Manufacture, Behaviour and Modelling of BaTiO3 Nonlinear Ceramic Disc Capacitors
for High-Voltage Applications
............................................667
J.J.R. Prinsloo, J.D. van
Wyk,
R.
Swanepoel, M.F.K. Holm and C.K. Campbell,
Rand Afrikaans University
Ceramic Greensheet Technology for Glass-Ceramic/ Copper Multilevel Substrates
(ES9000 System)
......................................................673
R.W. Nufer, IBM Corporation
Sinterable Glass-Ceramics for High-Performance Substrates
......................678
A.H. Kumar, S. Knickerbocker and R.R. Tummala, IBM Corporation
Polyimide for Thin Film Redistribution on Glass-Ceramic/Copper Multilevel Substrates
(ES9000 System)
......................................................682
G.
Czornyj, K.R.
Chen, G. Prada-Silva, A. Arnold, H. Souleotis, S. Kim, M.
Ree,
W.
Volksen,
D.
Dawson and R.
DiPietro, IBM
Corporation
Nanopore Foams of High-Temperature Polymers
...............................688
J.W. Labadie, J.L. Hedrick, V. Wakharkar, D.C. Hofer and T.P. Russell,
IBM Corporation
Thick Film Metallization of A1N Substrate with Cu Conductive Pastes
................692
B.S.
Chiou,
National Chiao Tung University; CD. Young, National
Tsing Hua
University
XIII
Session
XV
........................Performance
Modeling
Chairman: John Prince, University of Arizona
Co-Chairman: Wulf Knausenberger,
A T&TBell Laboratories
Relative Figures of Merit for Potential Chip-to-MCM Substrate Interconnection Methods
for CMOS and ECL Multichip Packaging
...................................700
U.A.
Shrivastava, Intel Corporation; W. Valentine and M. Mahalingam, Motorola, Inc.
Design Optimization of Wiring Substrate for a CMOS-Based Multichip Module
........710
T.
Sudo,
N.
Hirano, K.
Kato,
Y.
Hiruta and Y. Fuchida, Toshiba Corporation
Signal Propagation Over Perforated Reference Planes
in
Stripline
Interconnect Structures
........................................717
R. Senthinathan and J.L. Prince, University of Arizona; W.E. Pence and
N.
Raver,
IBM Corporation
Electrical Characteristics of Multichip Module Interconnects
with Perforated Reference Planes
..........................................725
A.C.
Cangellaris, M. Gribbons and J.L. Prince, University of Arizona
Equivalent Circuit Modeling of Interconnects from Time Domain Measurements
........730
J.M. Jong and V.K. Tripathi, Oregon State University;
B. Janko,
Tektronix Inc.
Short-Pulse Propagation Technique for Characterizing Resistive Package
Interconnections
......................................................736
A.
Deutsch,
G.
Arjavalingam and G.V. Kopcsay, IBM Corporation;
M. Degerstrom, Supercomputer Systems Inc.
Package Inductance Measurement at High Frequencies
..........................740
C
-Т.
Tsai, Motorola, Inc.
Session
XVI......
MCM
Materials and Packaging Technology
Chairman: Gary Thornberg, NCR Corporation
Co-Chairman: Albert Lin, AT&T Bell Laboratories
Packaging Technology for the NEC ACOS System
3900..........................745
M. Yamada, M. Nishiyama, T. Tokaichi and M. Okano, NEC Corporation
A Shape Optimal Design Methodology for Packaging Design
.......................752
S.D.
Rajan,
Arizona State University; B. Nagaraj and M. Mahalingam, Motorola, Inc.
Repair of Thin Film Wiring with Laser-Assisted Processes
........................759
T. A. Wassick, IBM Corporation
Compatibility of Common MCM-D Dielectrics
with Scanning Laser Ablation Via Generation Processes
.........................763
T.G. Tessier, Motorola, Inc.
;
G. Chandler, XMR Inc.
Rapid Thermal Curing of BCB Dielectric
.....................................770
P.E.
Garrou,
R.H. Heistand,
M. Dibbs, T.A. Maniai,
С.
Mohler, T. Stokich and
P.H. Townsend, Dow Chemical; G.M.
Adema,
M.J.
Berry and I. Turlik, MCNC
Passivation Schemes for Copper/Polymer Thin Film Interconnections
Used in Multichip Modules
..............................................776
G.M.
Adema,
L-T.
Hwang, G.A.
Rinne
and I. Turlik, MCNC
Printing Encapsulation Systems
(PES)
of Advanced Multichip Module
&
COB Device
____783
A. Okuno, K. Nagai,
N.
Oyama and T. Hashimoto, Japan
Rec
Co., Ltd.
;
T. Onishi, S. Wakamoto and K. Masui, Sharp Corporation
KIV
Session XVII..............................
Components II
Chairman
:
James
E
.
Murphy, A T&
Τ
Technologies, Inc.
Co-Chairman: William Clark, IBM Corporation
Guidelines for Thermal Management of Multichip Modules
.......................787
L. Liang and A. Hamzehdoost, VLSI Technology, Inc.
Component Management: Evolution from Traffic Cops to Value-added Function
........792
R.A. Friedenson, W.R. Barrett and L.J.
Kiszka,
AT&T Bell Laboratories
Silicon Field Emission
Triodes
and Diodes
....................................800
G.W. Jones and C.T.
Sune,
MCNC; H.F. Gray, Naval Research Laboratory
Optoelectronic Chips and Multichip Modules
.................................804
T. Jannson, R. Chen and F. Lin, Physical Optics Corporation
Integral Heatsink Polysilicon Semiconductor Packaging
..........................807
M.L. McGeary, Digital Equipment Scotland Ltd.
Effective Low-Power CMOS Terminating Circuit for Coupled Transmission Lines
.......814
R. Igarashi, T. Morikawa and
N.
Mii,
IBM Japan Ltd.
Microwave Characterisation of
Microstrip
Lines and Spiral Inductors
in MCM-D Technology
.................................................823
R.G. Arnold, GEC-Marconi Materials Technology Ltd.
;
D.J. Pedder, GEC Plessey Semiconductors
Session
XVIII....
Optoelectronics III (Packaging Technology)
Chairman: R. Boudreau, GTE
Co-Chairman: Venkata A. Bhagavatula, Corning, Inc.
Design and Performance of a 10-Gbit/s Optical Transmitter Module
.................830
M. Goto, K. Hironishi,
A. Sugata,
К.
Mori,
T.
Horimatsu and
M.
Sasaki,
Fujitsu Laboratories Ltd.
A 6-GHz Lightwave Transceiver Module for Microwave Fiber-Optic Communications
.... 838
R.E.
Scotti,
W.
MacDonald and J.V. Gates, AT&T Bell Laboratories;
E. Ackerman, S. Wanuga, J. Komiak and D.
Kasernset, GE
Electronics Laboratory
Packaging Technology for High-Power, Singlemode-Fiber-Pigtailed Pump Laser Modules
for Er-Doped Fiber Amplifiers
............................................842
V. Shah, L. Curtis,
D.D.
Mahoney, N.C. Andreadakis, F. Favire, B. Pathak,
С
Căneau,
R.
Bhat,
C.E. Zah and
W.C.
Young, Bellcore
Thermal Aspects of Pump-Laser Packaging
...................................848
H. van
Tongeren
and P.J.A. Thijs, Philips Optoelectronics Centre
A New Assembly Architecture for Multichannel Singlemode-Fiber-Pigtail
LD/PD Modules
......................................................853
T.
Kato,
F.
Yuuki,
К.
Tanaka,
T. Habu, T. Shimura, A. Takai, K. Mizuishi and
Y. Motegi, Hitachi, Ltd.; T. Teraoka, Hitachi Cable, Ltd.
Low-Cost, Low-Reflection, Receptacles for Active Devices
.........................861
G. Billet, L. Rittener-Ruff and H.B. Yin,
Radiall;
H.L. Althaus, Siemens
AG;
A.J.N. Houghton,
Northern Telecom Optoelectronics
Qualification of a Robust Fiber Termination
..................................867
K.A.W. Miller, B.
Caras,
B.A. Dean, T.F. Eltringham and R.T. Ku,
AT&T Bell Laboratories
xv
Session
XIX
.....Interconnections
II (Tab and Wire Bonding)
Chairman: Dennis
Olsen,
Motorola, Inc.
Co-Chairman
:
James Burgess, General Electric Company
Gold-to-Aluminum Bonding for TAB Applications
..............................
87°
S.K. Kang, IBM Corporation
Novel TAB Inner Lead Bonding Technology Eliminating Bump Formation Process
......876
Y. Otsuka, H. Kaneko, J. Sasaki, M. Itoh, K. Takekawa, A. Yoshigai and M. Urushima,
NEC Corporation
Gold-Gold (Au-Au) Thermocompression (TC) Bonding of Very Large Arrays
...........883
B.K.
Furman
and S.G.
Mita, IBM
Corporation
Wire Bond Development for High-Pincount Surface-Mount Thin Plastic Packages
.......890
B. Shu, VLSI Technology, Inc.
Factors Governing the Loop Profile in
Au
Bonding Wire
..........................899
Y. Ohno, Y. Ohzeki, T.
Aso
and O. Kitamura, Nippon Steel Corporation
Wire Bonding-Towards
6σ
Yield and Fine Pitch
................................903
G.G.
Hárman,
National Institute of Standards and Technology
Session XX
.............................
Plastic Packaging
Chairman: Robert T. Howard, Consultant
Co-Chairman: Darvin Edwards, Texas Instruments, Inc.
Novel Technique for the Evaluation of Adhesive Strength of Molding Compounds
Used in Plastic Packaging
...............................................911
E. Suhir, AT&T Bell Laboratories; T.M. Sullivan, Warner-Lambert Co.
On the Role of Adhesion in Plastic Packaged Chips Under Thermal Cycling Stress
......926
P. Alpern, O.
Selig
and R. Tilgner, Siemens
AG
Effects of Die Pad Anchoring on Package
Interfacial
Integrity
......................930
L.T. Nguyen and M.M. Michael, National Semiconductor Corp.
Degradation Effects of Humidity and Storage on Anhydride Cured Epoxies
............939
J.G. Ameen, K.K. Nair and
D.W.
Sissenstein, IBM Corporation
Role of Design Factors for Improving Moisture Performance of Plastic Packages
........945
S.
Altimari,
S.
Golwalkar, P. Boysan and R. Foehringer, Intel Corporation
HAST Evaluation of Organic Liquid
1С
Encapsulants
Using Sandia s Assembly Test Chips
.......................................951
J.A. Emerson,
D.W.
Peterson and J.N. Sweet,
Sandia
National Laboratories
Reliability Assessment of High-Leadcount TAB Package
..........................957
J. Ling, H. Teoh, D. Sorrells and J. Jones, Digital Equipment Corporation
Session
XXI.........................
MCM
Developments
Chairman
:
Phil
Garrou, Dow
Chemical
Co-Chairman: Sudipta Ray, IBM Corporation
A Thin Film Multichip Module for Workstation Applications
......................968
M.F. Bregman, A. Kimura, T. Matsui, H. Nishida, K. Nishiyama, H. Ohkuma and
.....
A. Tanaka, IBM Japan Ltd.;
С
Kovac and D. McQueeney, IBM Corporation
Multichip Module Technology using A1N Substrate
forž-Gbit/s
High-Speed Switching Module
..................................973
Y. Iseki, F. Shimizu and T.
Sudo,
Toshiba Corporation
XVI
Session XXI...............................
MCM
Developments (continued)
High-Density Interconnect Substrate with Low Thermal Resistance
for GaAs LSI Multichip Modules
..........................................979
A. Miki,
M.
Nishiguchi and H. Nishizawa, Sumitomo Electric industries, Ltd.
An ATM Switch Hardware Technologies using Multichip Packaging
.................984
Y. Doi, H. Yamada, S.
Sasaki,
T.
Kishimoto and H. Tomimuro, NTT
A Multichip Package for High-Speed Logic Die
................................991
E.G.
Myszka,
A. Casey and J. Trent, Motorola, Inc.
The Thermal Management of IBM s
ES
/9000
Advanced Thermal Conduction Module
____997
G.S. Hopper, D.L. Edwards and S.P. Young, IBM Corporation
Factors Affecting the Interconnection Resistance and Yield
in the Fabrication of Multilayer Poly
im
¡de/Metal
Thin Film Structures
.............1002
D-Y. Shih, H.L. Yeh,
С
Narayan, J. Lewis, W. Graham, S.
Nunes,
J.
Paraszczak,
R.
McGouey,
E.
Galligan,
J. Cataldo, R. Serino, E. Perfecto,
C
-А.
Chang,
A.
Deutsch,
L. Rothman, J. Ritsko and J. Wilczynski,
IBM
Corporation
Session
XXII........
Encapsulants
and Molding Compounds
Chairman:
Denise
Barnes, AT&TBell Laboratories
Co-Chairman: J.C. Bolger, Emerson
&
Cuming, Inc.
A New Liquid
Encapsulant
for
1С
Packaging
.................................1015
R. Pennisi and G. Gold, Motorola, Inc.
A New Moisture Resistant Liquid
Encapsulant
................................1018
J.K. Bard and R.L. Brady, Hercules Incorporated
Development of High-Reliability Epoxy Molding Compounds
for Surface-Mount Devices
.............................................1023
N.
Mogi
and H. Yasuda, Sumitomo
Bakelite
Co., Ltd.
Liquid Dropping Resin for
1С
Encapsulant
..................................1030
S.
Ozawa and M. Mizuno, Sumitomo
Bakelite
Co., Ltd.
New Analytical Study for Popcorn Phenomenon
...............................1035
H. Kimura, S. Ohizumi, T. Nishioka, M. Nakao and M. Harada,
Nitto
Denko
Corporation
Session
XXIII................
Manufacturing Technology II
Chairman: Connie D Egidio, IBM Corporation
Co-Chairman: Archie Mones, DuPont Electronics
Economic Impact of Processing Technologies on Thin Film MCMs
.................1042
L.H. Ng, IBIS Associates, Inc.
A Computer-Aided, Spatially-Selective Protection Technique for Multichip Module
and Chip-On-Board Devices
............................................1046
J.W. Mann, Bellcore
Partly-Additive Process for Manufacturing High-Density Printed Wiring Boards
.......1053
S. Imabayashi, I. Tanaka, H. Kikuchi, M. Watanabe, H. Oka, S.
Izumi,
Y.
Taniguchi
and S. Fujita, Hitachi Ltd.
Zero-Defect Sputter Deposition Metallization Method for High-Volume Manufacturing
of Grafted Multilayer Thin Film Modules
...................................1060
T. Swirbel, Motorola, Inc.
XVII
Session XXIII.....................
Manufacturing Technology II (continued)
The Application of Laser Process Technology to Thin Film Packaging
...............1066
T.F. Redmond, J.R. Lankard, J.G.
Balz,
G.R.
Proto
and T.A. Wassick, IBM Corporation
Via Formation in Green Ceramic Dielectrics Using a Yag Laser
....................1072
D.M.
D Ambra,
M.C.A. Needes,
C.R.S.
Needes and
C.B.
Wang, DuPont Electronics
AbouttheCHMT
....................................1083
Author Index
........................................1092
|
| any_adam_object | 1 |
| author_corporate | Electronic Components & Technology Conference San Diego, Calif |
| author_corporate_role | aut |
| author_facet | Electronic Components & Technology Conference San Diego, Calif |
| author_sort | Electronic Components & Technology Conference San Diego, Calif |
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| bvnumber | BV009016421 |
| classification_rvk | ZN 1900 |
| classification_tum | ELT 299f |
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| genre | (DE-588)1071861417 Konferenzschrift 1992 San Diego Calif. gnd-content |
| genre_facet | Konferenzschrift 1992 San Diego Calif. |
| id | DE-604.BV009016421 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T17:28:37Z |
| institution | BVB |
| institution_GND | (DE-588)5077790-7 |
| isbn | 0780301676 0780301684 0780301692 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-005961808 |
| oclc_num | 489791939 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM DE-83 |
| owner_facet | DE-91 DE-BY-TUM DE-83 |
| physical | XVIII, 1094 S. Ill., graph. Darst. |
| publishDate | 1992 |
| publishDateSearch | 1992 |
| publishDateSort | 1992 |
| publisher | IEEE |
| record_format | marc |
| spelling | Electronic Components & Technology Conference 42 1992 San Diego, Calif. Verfasser (DE-588)5077790-7 aut Proceedings May 18 - 20, 1992 ; The Sheraton Harbor Island Hotel, San Diego, California 42nd Electronic Components & Technology Conference 1992 New York IEEE 1992 XVIII, 1094 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Composants électroniques - Congrès ram Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf Elektronik (DE-588)4014346-6 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1992 San Diego Calif. gnd-content Elektronisches Bauelement (DE-588)4014360-0 s DE-604 Elektronik (DE-588)4014346-6 s Verbindungstechnik (DE-588)4129183-9 s Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=005961808&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Proceedings May 18 - 20, 1992 ; The Sheraton Harbor Island Hotel, San Diego, California Composants électroniques - Congrès ram Elektronisches Bauelement (DE-588)4014360-0 gnd Verbindungstechnik (DE-588)4129183-9 gnd Elektronik (DE-588)4014346-6 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4129183-9 (DE-588)4014346-6 (DE-588)1071861417 |
| title | Proceedings May 18 - 20, 1992 ; The Sheraton Harbor Island Hotel, San Diego, California |
| title_auth | Proceedings May 18 - 20, 1992 ; The Sheraton Harbor Island Hotel, San Diego, California |
| title_exact_search | Proceedings May 18 - 20, 1992 ; The Sheraton Harbor Island Hotel, San Diego, California |
| title_full | Proceedings May 18 - 20, 1992 ; The Sheraton Harbor Island Hotel, San Diego, California 42nd Electronic Components & Technology Conference 1992 |
| title_fullStr | Proceedings May 18 - 20, 1992 ; The Sheraton Harbor Island Hotel, San Diego, California 42nd Electronic Components & Technology Conference 1992 |
| title_full_unstemmed | Proceedings May 18 - 20, 1992 ; The Sheraton Harbor Island Hotel, San Diego, California 42nd Electronic Components & Technology Conference 1992 |
| title_short | Proceedings |
| title_sort | proceedings may 18 20 1992 the sheraton harbor island hotel san diego california |
| title_sub | May 18 - 20, 1992 ; The Sheraton Harbor Island Hotel, San Diego, California |
| topic | Composants électroniques - Congrès ram Elektronisches Bauelement (DE-588)4014360-0 gnd Verbindungstechnik (DE-588)4129183-9 gnd Elektronik (DE-588)4014346-6 gnd |
| topic_facet | Composants électroniques - Congrès Elektronisches Bauelement Verbindungstechnik Elektronik Konferenzschrift 1992 San Diego Calif. |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=005961808&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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