Metallization: performance and reliability issues for VLSI and ULSI ; 12 - 13 September 1991, San Jose, California
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
Bellingham, Wash.
SPIE
1991
|
| Series: | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE
1596 |
| Subjects: | |
| Online Access: | Inhaltsverzeichnis |
| Item Description: | Literaturangaben |
| Physical Description: | VII, 159 S. Ill., graph. Darst. |
| ISBN: | 0819407275 |
Staff View
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Record in the Search Index
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|---|---|
| adam_text | METALLIZATION:
PERFORMANCE AND RELIABILITY ISSUES
FOR VLSI AND ULSI
Volume
1596
CONTENTS
Conference Committee
..................................................................
v
Introduction
.........................................................................
vii
SESSION
1
PROCESSING ISSUES
1596-01
Some fundamental issues on metallization in VLSI (Invited Paper)
D. K. Ferry, M.
N.
Kozicki, G. B. Raupp, Arizona State Univ
................................... 2
1596-02
Unframed via interconnection of nonplanar device structures (Invited Paper)
M. J. Kim, Philips Labs
................................................................. 12
1596-03
Selective low-temperature chemical vapor deposition of copper from new copper(I)
compounds (Invited Paper)
A. Jain, H. K. Shin, K. Chi, M. J. Hampden-Smith,
T. T. Kodas,
J.
Farkas, Univ.
of
New Mexico; M. F. Paffett,
J. D.
Farr, Los Alamos National Lab
...............................23
1596-05
Improved penalization techniques applied to a low dielectric constant polyimide used
in multilevel metal ICs (Invited Paper)
L. Chang, R. Goodner, Motorola Advanced Technology Ctr
...................................34
1596-06
Laser-induced metal deposition and laser cutting techniques for fixing
1С
design
errors (Invited Paper)
D. C. Shaver, S. P.
Doran,
M.
Rothschild, J. H.
Sedlaček,
Lincoln Lab./MIT
....................46
SESSION
2
RELIABILITY AND FAILURE MODES
1596-07
Technique of assessing contact
ohmický
and their relevance to heterostructure
devices (Invited Paper)
H. B.
Harrison, Griffith Univ. (Australia);
G. K.
Reeves, Royal Melbourne Institute of Technology
(Australia)
...........................................................................52
1596-09
Electromigration in VLSI metallization (Invited Paper)
T. Y. Kwok, BM/Thomas J. Watson Research Ctr
..........................................60
1596-11
Effect of Cu at
Al
grain boundaries on electromigration behavior in
Al
thin films
(Invited Paper)
D. R. Frear, J. R. Michael,
Sandia
National Labs.; C. Kim, Univ. of California/Berkeley;
A. D.
Romig,
Jr.,
Sandia
National Labs.; J. W. Morris, Jr., Univ. of California/Berkeley
...........72
1596-12
Stress-induced voiding in aluminum alloy metallizations (Invited Paper)
T. D. Sullivan, J. G. Ryan, J. R. Riendeau, D. P. Bouldin, IBM/General Technology
Div
............83
1596-
1
3
Spin-on glasses in the silicon
1С:
plague or panacea? (Invited Paper)
N.
Lifshitz, M. R. Pinto, AT&T Bell Labs
..................................................96
1596-14
Electromigratiori physical modeling of failure in thin, film structures (Invited Paper)
J. R. Lloyd, Digital Equipment Corp
.....................................................106
(continued)
SPIE
Vol.
1596
Metallization: Performance and Reliability issues for VLSI and ULSI
(1991) /
METALLIZATION:
PERFORMANCE AND RELIABILITY ISSUES
FOR VLSI AND ULSI
Volume
1596
SESSION
3
CHARACTERIZATION
1596-15
Application of thermal wave technology to thickness and grain size monitoring
of aluminum films (Invited Paper)
J. L.
Opsal,
Therma-Wave, he
..........................................................120
1596-18
Observation of stress voids and grain structure in laser-annealed aluminum using focused
ion-beam microscopy (Invited Paper)
D. Pramanik, V. Jain, VLSI Technology he
...............................................132
1596-19
Interfacial
adhesive strength measurement in a multilayered two-level metal device
structure (Invited Paper)
H. R. Siddiqui, V. Ryan, J. A. Shimer, AT&T Bell Labs
..................................... 139
Addendum
..........................................................................158
Author hdex
........................................................................ 159
iv /
SPIE
Vol.
1596
Metallization: Performance and Reliability Issues for VLSI and ULSI
(1991)
|
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| genre_facet | Konferenzschrift 1991 San Jose Calif. |
| id | DE-604.BV006145883 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T16:41:02Z |
| institution | BVB |
| isbn | 0819407275 |
| language | English |
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| physical | VII, 159 S. Ill., graph. Darst. |
| publishDate | 1991 |
| publishDateSearch | 1991 |
| publishDateSort | 1991 |
| publisher | SPIE |
| record_format | marc |
| series | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |
| series2 | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |
| spelling | Metallization performance and reliability issues for VLSI and ULSI ; 12 - 13 September 1991, San Jose, California Gennady S. Gildenblat ... Bellingham, Wash. SPIE 1991 VII, 159 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE 1596 Literaturangaben Integrated circuits Very large scale integration Reliability Congresses Integrated circuits Very large scale integration Testing Congresses Metallic films Congresses Metallizing Congresses Vapor-plating Congresses Halbleitertechnologie (DE-588)4158814-9 gnd rswk-swf Metallisieren (DE-588)4169599-9 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1991 San Jose Calif. gnd-content Metallisieren (DE-588)4169599-9 s Halbleitertechnologie (DE-588)4158814-9 s DE-604 Gildenblat, Gennady S. Sonstige oth Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE 1596 (DE-604)BV000010887 1596 Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=003885527&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Metallization performance and reliability issues for VLSI and ULSI ; 12 - 13 September 1991, San Jose, California Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE Integrated circuits Very large scale integration Reliability Congresses Integrated circuits Very large scale integration Testing Congresses Metallic films Congresses Metallizing Congresses Vapor-plating Congresses Halbleitertechnologie (DE-588)4158814-9 gnd Metallisieren (DE-588)4169599-9 gnd |
| subject_GND | (DE-588)4158814-9 (DE-588)4169599-9 (DE-588)1071861417 |
| title | Metallization performance and reliability issues for VLSI and ULSI ; 12 - 13 September 1991, San Jose, California |
| title_auth | Metallization performance and reliability issues for VLSI and ULSI ; 12 - 13 September 1991, San Jose, California |
| title_exact_search | Metallization performance and reliability issues for VLSI and ULSI ; 12 - 13 September 1991, San Jose, California |
| title_full | Metallization performance and reliability issues for VLSI and ULSI ; 12 - 13 September 1991, San Jose, California Gennady S. Gildenblat ... |
| title_fullStr | Metallization performance and reliability issues for VLSI and ULSI ; 12 - 13 September 1991, San Jose, California Gennady S. Gildenblat ... |
| title_full_unstemmed | Metallization performance and reliability issues for VLSI and ULSI ; 12 - 13 September 1991, San Jose, California Gennady S. Gildenblat ... |
| title_short | Metallization |
| title_sort | metallization performance and reliability issues for vlsi and ulsi 12 13 september 1991 san jose california |
| title_sub | performance and reliability issues for VLSI and ULSI ; 12 - 13 September 1991, San Jose, California |
| topic | Integrated circuits Very large scale integration Reliability Congresses Integrated circuits Very large scale integration Testing Congresses Metallic films Congresses Metallizing Congresses Vapor-plating Congresses Halbleitertechnologie (DE-588)4158814-9 gnd Metallisieren (DE-588)4169599-9 gnd |
| topic_facet | Integrated circuits Very large scale integration Reliability Congresses Integrated circuits Very large scale integration Testing Congresses Metallic films Congresses Metallizing Congresses Vapor-plating Congresses Halbleitertechnologie Metallisieren Konferenzschrift 1991 San Jose Calif. |
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