1991 proceedings: May 11 - 16, 1991, The Westin Peachtree Plaza, Atlanta, Georgia
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Inst. of Electrical and Electronics Engineers
1991
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| 245 | 1 | 0 | |a 1991 proceedings |b May 11 - 16, 1991, The Westin Peachtree Plaza, Atlanta, Georgia |c 41st Electronic Components & Technology Conference |
| 264 | 1 | |a New York, NY |b Inst. of Electrical and Electronics Engineers |c 1991 | |
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Datensatz im Suchindex
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| adam_text | Contents
Session
I
.....Advanced
Inorganic
Materials
and Processes
Chairman:
S.K. Ray, IBM Corporation
Co-Chairman: W.R.
Bratschun, Motorola, Inc.
The Synthesis, Properties
and Applications
of
Diamond
Ceramic
Materials ............1
A.M. Altshuler and J.L. Sprague, John L. Sprague Associates, Inc.
Cofiring Process for Glass-Ceramic/Copper Multilayer Ceramic Substrate
............ 5
R.N. Master, L.W.
Herron
and R.R. Tummala, IBM Corporation
A Thin Films on MLC Application
..........................................10
G.B. Leung and
S.A.
Sands, IBM Corporation
Copper Polyimide Multilayer Substrate for High Speed Signal Transmission
..........14
R. Kambe, M. Kuroda, R. Imai and Y. Kimura, NGK Spark Plug Co., Ltd.
Microwave Dielectric Constant of a Low Temperature Co-Fired Ceramic
.............20
J.W. Gipprich,
KA.
Leahy,
AJ.
Martin, E.L. Rich, III and K.W. Sparks,
Westinghouse
Electric Corporation
Electroless Gold Plating for High Density Packages
.............................26
C.Y. Xia,
Hebel
Semiconductor Research Institute
Session II
...
Opto-electronic Packaging and Passive Devices
Chairman: William L. Emkey, AT&T Bell Laboratories
Co-Chairman: William E. Stephens, Bellcore
High Gain
(21 dB)
Packaged Semiconductor Optical Amplifiers
....................30
R. Boudreau, R. Morrison, R. Sargent, R.
Holmstrom,
and W. Powazinik,
GTE Laboratories Incorporated
Performance and Reliability of Redundant Thermoelectric Coolers
..................34
S.Y. Huang and K.A. Yanushefski, AT&T Bell Laboratories
A Molded Polymeric Resin-Filled Coupler
....................................38
L.L. Blyler, Jr.,
G J.
Grimes, R*M. Lien, and E. Ysebaert, AT&T Bell Laboratories
Concatenated High Wavelength Isolation WDM and
4x4
Wavelength-Flattened Coupler
. . 44
J.S. Xu, Y. Zhang, and X. Zhang, Shanghai Transmission Lines Research Institute
Fused
3x3
Single-Mode Fiber Optic Couplers for Fiber
Interferometrie
Sensors
and Coherent Communications
............................................46
T. Xie» Shanghai Transmission Lines Research Institute
Session
Ш
......
Packaging Modeling and Characterization
Chairman: John L. Prince, University of Arizona
Co-Chairman: Tom Poulin, DuPont Electronics
The Design of ES/9000 Module
............................................50
E.E. Davidson, P.W. Hardin, G.A. Katopis, M.G. Neaion and L.L. Wu, IBM Corporation
The Per-Unit-Length Capacitance Matrix of Flaring VLSI Packaging Interconnections
... 55
A.A.
Omer,
A.C.
Cangellaris, M.M. Mechaik and J.L. Prince, University of Arizona
Electrical Characterization of VLSI Packages
..................................62
F. Perezalonso, R. Crawford, R. Bernard, R.
Kaw,
and S. Thomas,
Hewlett-Packard Company
Session
III
..........
Packaging
Modeling and Characterization (continued)
3-D
Electromagnetic Field Analysis of Interconnections in Copper-Polyimide
Multiehip Modules
......................,..............................70
S. Sasaki, R.
Konno,
H.
Tomimuro and T. Ohsaki,
Nippon Telegraph and Telephone Corporation
Electrical Characteristics of 25-mil Pitch JEDEC PQFP Surface Mount Lead Frames
for Multi-Chip Modules
.................................................77
J.L.
Brandner
and S.R.
Hofmann, A T&T
Bell Laboratories
Experimental Electrical Characterization of High Speed Interconnects
...............85
S.B. Goldberg, M.B. Steer,
P.D.
Franzon and J.S.
Kasten,
North Carolina State University
Combination of Numerical and Experimental Methods for Stress Analysis
of Small Electronic Components
...........................................89
J. Villain and
H. Borner,
Siemens
Nixdorf Informationssysteme
AG
Session
IV
... Hybrid
Applications and Advanced Substrates
Chairman: Joseph W. Soucy, GTE Government Systems
Co-Chairman: Mark Neider,
Northern Telecom
High Density Microelectronic Packaging with Thick Film Hermetic Packages
..........96
F.A.
Lindberg,
Westinghouse
Electric Corporation
Hybrid Technologies for High Frequency Switching Power Supplies
................103
Y. Belopolsky, DuPont Electronics; R. Dassatti, Digital Equipment Corporation
Failure Analysis of a Hybrid Device Exhibiting Copper
Dendrite
Growth
on Thick Film Resistors
................................................109
J.B. Dixon, M.R. Northrap and D.T. Rooney, Oneida Research Services, Inc.
Advanced Ceramic Substrates for Multichip Modules with Multilevel
Thin Film Interconnects
................................................120
B.C. Foster, FJ. Bachner, E.S. Tormey, M.A. Occhionero, and
P.A.
White,
Ceramics Process Systems Corporation
A Low Temperature Cofired Multilayer Ceramic Delay Line with Copper Conductors
. . . 127
H.
Mandai,
Y.
Chigodo and
A. Tojo,
Fukui
Murata
Manufacturing Company, Ltd.
Investigation of the Adhesion Mechanism of NiCr Layers on A12O3 and A1N Substrates
. 134
M.
Feil, Fraunhofer-Institut für Festkörpertechnologie;
W.
Mader, Max-Planck-Institut für Metallforschung
Session
V
................... Opto-electronic
Packaging
Chairman:
Robert
Ku,
AT&T Bell Laboratories
Co-Chairman: Jean-Claude Fouere, IBM Corporation
Package
Technology
for
STM-16
Optical
Tx/Rx and IC s........................141
A. Takai, C. Kamada, Y. Hatta, S. Aoki,
A. Murata
and K.
Nagano,
Hitachi, Ltd.
Packaging of Fibre-Optic Communication Lasers for the Gb/s Range
...............147
H. van
Tongeren,
J.
Driessen,
J.T.M. Kluitmans
and
J.W.
Kokkelink,
Philips Optoelectronics Centre
Qualification and Reliability of Thermoelectric Coolers for Use in Laser Modules
.....150
T.A.
Corser, AT&T
Bell Laboratories
Packaging of a Polarization Independent Optical Isolator
.......................157
С
A. Jack and W.L. Emkey, AT&T Bell Laboratories
Session
V
....................... Opto-electronic
Packaging
(continued)
Optoelectronics Packaging Needs for Data Communications
......................161
R. Warren, R. Lasky, J. Radcliffe and D. Stigliani, IBM Corporation
A Connectorized Single-Mode Laser Module with Optical Trimming
................169
J.A. DeMeritt and CD. Burton, Corning Incorporated
An Isolated Laser Module Based on a Modularity Concept
.......................172
G.M. Chaoui, W.R. Holbrook, G.S.
Barski,
Jr.,
CE.
Gaebe, R.S. Jameson,
TJ.
Miller,
CM.
Schwenk, P.D.
Smeltz, G.T. Wiand,
Х
-L.
Yeh, and
CE.
Young, A T&T Bell Laboratories
Session VI
.....................
Single Chip Packaging
Chairman: Paul Van Loan, Hewlett-Packard Company
Co-Chairman: Dick
Landis,
Martin Marietta
Overmolded Plastic Pad Array Carriers (OMPAC): A Low Cost, High Interconnect Density
1С
Packaging Solution for Consumer and Industrial Electronics
..................176
B. Freyman and R.
Perniisi,
Motorola, Inc.
High Reliability and Low Cost Design in Plastic PGA Package with High Performance
. . 183
T. Miwa, K. Otsuka, Y. Shirai, T. Matsunaga and T. Tsuboi, Hitachi, Ltd.
Molding Compounds for Thin Surface Mount Packages and Large Chip
Semiconductor Devices
.................................................190
S.
Ito, Nitto
Denko
America, Inc.;
T. Nishioka, S. Oizumi, K. Ikemura and K. Igarashi, Nitto
Denko
Corporation
Sealed Chip-on-board Circuit Protection
....................................198
L.E. Gates and T.G. Ward, Hughes Aircraft Company
Stress Analysis of Metal Seal Ring A1N Packages
..............................203
W.K. Jones, W. Jiang, R.W. Harshbarger and R. Zhuge,
The State University of Florida in Miami
Development of Leadframe for COL and
LOC
Package
.........................210
T. Suzumura and T. Kawamura, Hitachi Cable Ltd.; K. Tubosaki, Hitachi, Ltd.
Session
VII
.............................
Connectors
Chairman: Cliff Winings, AT&T
Вей
Laboratories
Co-Chairman: Alan Knight, IBM Corporation
Environmental Effects on Connector Reliability
...............................215
S. Koford, Koford Engineering
Metallurgical Changes in Tin-Lead Platings Due to Heat Aging
...................218
R
J. GeeHe, AMP Incorporated
Solderability Performance of Tin Coated Copper Alloy Strip for Connector Components
. 229
J.C Fister and S.P. Zariingo, Olbt Corporation
I/O Options for MCNC MuMehip Package
..........,....................... 234
N.G.
Koopman, MCNC
Center for Microelectronics
A Design Review of a 2-mm Pitch High Density Connector System
.................245
J.M.B. van Woensel, DuPont Electronics
Dost Test Results on Multicontact» Circuit Board Connectors
.....................249
D.G. DeNure and E.S. Sproles, Jr., AT&T Bell Laboratories
A
Hign-Deasity Mwltipin
Connector for High-Speed Signal Transmission
іи
a Rack System
.....................................................256
N.
Sugiura and K. Yasuda, Nippon Telegraph and Telephone Corporation
Session
VIII......................
Poster Presentations
Chairman: Daiyl Ann Doane, DAD Technologies, Inc.
Co-Chairman: Praveen Jain, Intel Corporation
MATERIALS
1
New Kind of Humidity Sensitive Ceramic with Linear Property
..................261
Y.D.
Lu,
J-L. Zhang, and B-R.
Ii,
Huazhong University of Science and Technology;
W-Y. Pan, New Mexico Institute of Mining and Technology
2
Local Flux on Breakdown of Ferroelectric Relaxor Ceramics
....................264
Z. Zhou, Y. Wu, and Z. Tang, Tsinghua University
3
Microwave Properties of Ceramic Materials
.................................267
D.I.
Amey and J.P.
Cimila, DuPont
Electronics
4
Thermal Stress Singularities in Microelectronics
.............................273
MM. Michael, National Semiconductor,
R J.
Hartranft, Lehigh
University
PACKAGES
5
A Study of Electrical Performance for Next Generation Plastic Packages
...........278
D. Stys and B.K. Bhattacharyya, Intel Corporation
6
Electrical Measurement and Modeling of Co-Fired Ceramic Multi-Chip Substrates
for High Speed Application
.............................................283
Y. Wen and K.
Kolden,
Alcoa Electronic Packaging, Inc.
SOLDER JOINTS
7 Multiaxial
Mechanical Behavior of
бЗЅп-ЗТРо
Solder
.........................292
S.R. Low,
ΠΙ
and
R J.
Fields, National Institute of Standards and Technology;
G.K. Lucey, Jr., Harry Diamond Laboratories
8
Compliance Metrics for the Inclined Gull-Wing, Spider J-Bend, and Spider Gull-Wing
Lead Designs for Surface Mount Components
...............................299
R.W.
Koûomtz,
AT&T Bell Laboratories; L.R. Taylor, Princeton University
9
Fatigue Damage Evaluation of SMT Interconnections Using Straddle Boards
.......313
TJ. Kilinski, Battelle; D.P. Goetsch and B.I.
Sándor,
University of Wisconsin
COMPONENTS
10
Use of Highly Accelerated Life Test (HALT) to Determine Reliability
of Multilayer Ceramic Capacitors
........................................320
R. Confer, J.
Canner
and T. Trostle,
Murata
Erie North America, Inc.;
S. Kurtz, Penn State University
11
The Reliability Study of Laser Trimmed Resistor Components
...................323
Y. Huang, R.F. Cook and W.F. Smith, IBM Corporation
12
High Fire Multilayer Ceramic Capacitor Electrode Technology
.................. 328
J.G.
Pepin,
DuPont Electronics
13
High Frequency Performance of Capacitors
................................. 335
A.T. Murphy and
F
J. Young, DuPont Electronics
INTERCONNECTION
14
Z-Axis Conductive Adhesive for TAB and Fine Pitch Interconnects
...............345
K. Chung, G.
Dreier,
P. Fitzgerald, A. Boyle,
M. lin,
and J. Sager, AI Technology, Inc.
INTERCONNECnON
(continued)
15
Interconnection Method of Liquid Crystal Driver LSIs by Tab-on-Glass and Board to Glass
Using
Anisotropie
Conductive Film and Monosotropic Heat Seal Connectors
.......355
R.R. Reinke, Elform, Incorporated
16
Fabrication and Performance Studies of Multilayer Polymer/Metal Interconnect Structures
for Packaging Applications
.............................................362
J. Paraszczak, J. Cataldo, E. Galligan, W. Graham, R. McGouey, S.
Nunes,
R. Serino,
D.
Y.
Shih,
E.
Babich, A.
Deutsch,
G.
Kopcsay,
R.
Goldblatt, D. Hofer,
J. Labadie,
J.
Hedrick,
С.
Narayan,
К.
Saenger,
J.
Shaw,
V. Ranieri, J. Ritsko, L.
Rothman,
W.
Volksen,
J.
Wilczynski,
D.
Witman, and
H. Yeh,
IBM Corporation
17
Practical Design for Controlled Impedance
.................................370
R.E. Canright, Jr., Martin Marietta
18
A Wire Bond Reliability Model
..........................................378
T.L. Heleine, R.M. Murcko and
S
-С.
Wang, IBM Corporation
PRINTED WIRING BOARDS
19
Experimental and Analytical Investigation of Thermally Induced Warpage
for Printed Wiring
Boards.............................................382
СР.
Yeh,
К.
Banerjee,
T. Martin, C. Umeagukwu
and R. Fulton,
Georgia Institute of Technology; J. Stafford and K. Wyatt, Motorola, Inc.
20
Nonlinear Dynamic Response of a Flexible Printed Circuit Board
to a Shock Load Applied to its Support Contour
............................388
E. Sunir,
AT&T Bell Laboratories
ALTERNATIVE CLEANING TECHNIQUES
21
Eliminating CFC Usage for Multichip Module Cleaning:
A Users Experience in Choosing an Alternate Solution
........................400
D.P. Johnson, Tandem Computers,
Ina
22
HCFC Cleaning Agents as Alternatives for Chlorofluorocarbons (CFCs)
in the Electronics Industry
.............................................404
B.C. Smiley and
DJ. Heden,
ЕЛ.
du Pont de Nemours & Co., Inc.
MANUFACTURING
23
Predicting
Plated-Through-Hole
Reliability in High Temperature
Manufacturing Processes
..............................................410
R. IannuzzelH,
Digital Equipment
Corporaňon
24
Automatic Chip Placement; One Solution, User-Benefits, and Future Development
.... 422
MJ.
Chaisen,
Micro Robotics Systems,
Ina
Session IX
............................
Components I
Chairman: Robert J. Spearman, KEMET Electronics Corporation
Co-Chairman: Barry P. litoer,
AT&T
Bell Laboratories
Tfcin
Film Surface Mount Fuses
........................................ 428
B.
Breen,
A VX
Israel Ltd.
MHz
ЋгшвСогпшш
tor High Density Power Conversion
.........................431
AJ.
Yerman,
W.A. Roshen, RJ. Charles and R.P. Alley, General Electric Corporation ,
KJD.T. Ngo, University of Florida
Session
IX
...............................
Components I (continued)
The Influence of Termination Properties on the Thermal Shock
and Thermal Cycle Performance of Surface Mount Multilayer Ceramic Capacitors
.... 437
L.A. Mann, S.P. Gupta and L.G. Jones,
REMET
Electronics Corporation
Advances in High
С
-V
Multilayer Ceramic Chip Capacitors
......................442
J. Borzych and H. Harada, TDK
Multilayer Electroactive Ceramic Actuators
..................................446
J. Galvagni and B. Rawal, AVX Corporation
Mechanical Integrity of the
1С
Device Package
-
A Key Factor in Achieving Failure Free Product Performance
....................450
S. Witzman and Y. Giroux, Bell-Northern Research Ltd.
Mechanical Behavior of Ceramic Capacitors
.................................457
C.R. Koripella, KEMET Electronics Corporation
Session X
......
Opto-eiectronic Devices and Interconnects
Chairman: William Young, Bellcore
Co-Chairman: Frank V.
Di
Marcello,
AT&T Bell
Laboratories
Use of Guided Wave Optics for Board Level and Mainframe Level Interconnects
......463
D.H. Hartman,
Bellcore
Compact Multi-Channel LED/PD Array Modules Using New Assembly Techniques for
Hundred Mb/s/ch Parallel Optical Transmission
.............................475
M. Itoh, T. Nagahori, H. Kohashi, H. Kaneko, H. Honmou, I. Watanabe, T.
Uji
and
M. Fujiwara, NEC Corporation
New Packaging Technology for High-Speed Photoreceivers using Micro-Solder Bumps
. . 479
H. Tsunetsugu, K. Katsura, T. Hayashi, F. Ishitsuka, S.
Hata,
and
N.
Takachio,
Nippon Telegraph and Telephone Corporation
High-Silica Guided-Wave Optical Devices
....................................483
K.
Imoto,
H.
Uetsuka and
S.
Kashimura, Hitachi Ltd.
Characteristics and Applications of High Performance, Tunable, Fiber
Fabry-Perot Filters
....................................................489
CM. Miller, Micron Optics, Inc.
Biréfringent
Crystal Enclosure Fiber-Optic Polarizer
...........................493
D.G. Wang, G.H. Qin, H.Chen, and Z. Yan, Shanghai University of Science and Technology
Session XI
..................
Tab and Wire Interconnect
Chairman: Dennis B. Miller, Motorola, Inc.
Co-Chairman: Ben Cranston, AT&T Bell Laboratories
Investigations of Laser Soldered TAB Inner Lead Contacts
.......................497
E. Zakel, G. Azdasht and H.
Reichl, Technische Universität
Berlin
HAT Tool for Fluxless OLB and TAB
.......................................507
M
J. Palmer, R.R.
Horton,
H.R. Bickford and I.C. Noyan, IBM
Fine Pitch Wire Bonding Development Using a New Multipurpose,
Multi-pad Pitch Test Die
...............................................511
B. Shu, VLSI Technology, Inc.
Development of Ultra Fine Wire for Fine Pitch Bonding
.........................519
Y. Ohno and Y. Ohzeki, Nippon Steel Corporation; T. Yamashita and Y. Iguchi,
Oki
Electric Industry Co., Ltd.; T. Kanamori and Y. Arao, Mfyagi OM Electric Co., Ltd.
Session XII..........................
Components II
Chairman: Dr. Larry Burton, Perm State University
Co-Chairman: Dr. Rama Munikoti, Northern Telecom
A Novel Manufacturing Technology of Buried RuOj-Based
Thick Film Resistors in Copper-Polyimide Substrate
...........................524
E. Gofuku, Y. Kawasnima, M. Takada, M. Kohara and M. Nunoshita,
Mitsubishi Electric Corporation
An Electric Double-Layer Capacitor with High Capacitance and Low Resistance
......531
A. Yoshida, K.
Imoto,
A. Nishino and H. Yoneda, Matsushita Electric Industrial Co., Ltd.
Thermal Stability of Polysilicon Resistors
....................................537
J.E. Suarez, B.E. Johnson, and B. El-Kareh, IBM Corporation
Low-Temperature CMOS
-
A Brief Review
...................................544
W.F. Clark and B. El-Kareh, IBM Corporation , R.G.
Pires,
S.L. Titcomb and R.L. Anderson,
University of Vermont
Multi-Layer Inductor for High Frequency Applications
..........................551
B.
Breen,
A VX
Israel Ltd.
Determination of PLCC Socket Contact Normal Force and Reliability
..............555
K. Felske, J. Moss and D.
Plante,
Bell Northern Research
Preparation of Pb(Zr^)O3 Ferroelectric Thin Films
by a Pulsed Laser Ablation Technique
......................................560
J.P. Xu,
T.C. Bai,
C.W.
An and XJ. Li, University of Science and Technology
Session
XIII .....
Polyimides and Other Organic Materials
Chairman: Albert W. Lin, AT&T Bell Laboratories
Co-Chairman: Peter
Siota, IBM
Corporation
Positive Working Photosensitive Polymers for Semiconductor Surface Coating
........564
T. Banba, E. Takeucni, A. Tokoh and T. Takeda, Sumitomo
Bakelite
Co., Ltd.
Acetylene-Terminated Low-Stress Polyimide Oligomer
for Interlayer Dielectric Applications
.......................................568
P.G.
Jobe,
С.
Puglisi, J. McMahon and R.D. Rossi, National Starch and Chemical Company
Polyamic
Alkyl
Esters: Versatile Polyimide Precursors for Improved Dielectric Coatings
. 572
W. Volksen, D.Y. Yoon, and J. Hedrick, IBM Corporation
A Process for Surface Texturing of Kapton Polyimide to Improve Adhesion to Metals
... 580
N.L.D. Somasiri, R.L.D. Zenner and J.C Houge, 3M Company
High Density Multilayer Printed Circuit Board for
HITAC M-880
.................585
A. Takahashi,
N.
OoM,
A Nagąi,
H.
Akahoshi, A. Mukoh, and M. Wajima, Hitachi, Ltd.
A Multilevel
Eposy
Substrate for Flip-Chip Hybrid Multichip Module Applications
.... 593
E.
ТѕшшѕШта,
Matsushita Electronics Corporation; A. Okimo, Japan
Rec
Co., Ltd.
The
Application
of Computerized Processing Techniques to Manipulate and Enhance the Flow
of Non-Newtonian Viscoelastic Thixotropic Materials in a Production Environment
.... 597
ΨΛ,
D Ambra
and C.P. Wong, AT&T Bell Laboratories
Session XIV......
Manufacturing Processes and Technology
Chairman: Paul
Winkler,
IBM Corporation
Co-Chairman: Tony Suppelsa,
Motorola, Inc.
Making Total Quality Management Work for the Manufacturers
and Users of Semiconductors
.............................................605
R. Thomas, Ph.D, Rome Air Development Center (USAF);
N.
Khory, Ph.D and J. Giacobazzi, Motorola Inc.
Hermetic Sealing Process with Atmospheric Pressure Vibration for LSI Packages
......611
Y. Fujita, M. Tokuda and K. Mizuishi, Hitachi, Ltd.
Development of Damage Detection System for Surface Mount Packages
During Reflow Soldering
................................................615
M. Kitano, A. Nishimura and R. Kohno, Hitachi, Ltd.
Analysis of Total Dose Exposure to Integrated Circuits
Resulting from Laminographic Inspection of Surface-Mount-Package Solder Joints
.... 621
F. Poblenz, D.R. Brown and B. Willits, Texas Instruments
Solder Interconnections for SMT Selective Line Coupling
........................629
A. Parla, G.
Procopio
and
K. Posivy,
IBM
Corporation
Microelectronics Packaging Processing Using Focused High Power Electron Beams
.... 636
Y-W Yau, M.A. Booke, N.S. Sandhu and J.J. Fulton, IBM Corporation
Environmental Advantages of the Closed-Loop, Semi-Aqueous Cleaning Process
as a CFC Replacement
.................................................639
H.L. Fritz, DuPont Company
Session XV
.........................
Solder Material
Chairman: J.
Lau,
Hewlett-Packard Company
Co-Chairman:
Rajen
Chanchani,
Sandia
National Labs
Composite Solders
.....................................................647
J.L. Marshall, J.
Calderón,
D.
Müller,
M.
DeSimone
and J. Sees, University of North Texas ,
G. Lucey, Harry Diamond Laboratories;
J. Hwang, International Electronic
Materìah
Corporation
Microstructural
Evolution in Sn/Pb Solder and Pd/Ag Thick Film
Conductor Metallization
................................................653
J.G.
Duh
and K.C. Liu, National
Tsing Hua
University
Crack Initiation and Growth During Low Cycle Fatigue of Pb-Sn Solder Joints
.......658
Z. Guo, A.F.
Sprecher
and H. Conrad, North Carolina State University
Complications in Life Prediction Estimates at Elevated Temperatures
in Lead/Tin Solders During Accelerated Cycling
..............................667
J.K. Tien and
AJ. Attarwala,
The University of Texas at Austin
Energy-Based Methodology for the Fatigue-Life Prediction of Solder Materials
........ 671
S. Vaynman, Northwestern University;
S.A.
McKeown, GE Aerospace
A Model for Low-Cycle Fatigue of Surface Mount Solder Joints
................... 677
CG.
Schmidt, SRI International
Session XVI............
Packaging for Advanced Systems
Chairman: John W.
Balde,
Interconnection Decision Consulting
Co-Chairman: Bert Daniels, Boeing
Packaging Technology for IBM s Latest Mainframe Computers (S/390/ES9000)
.......682
R.R. Tummala, H.R. Potts, and S. Ahmed, IBM Corporation
Polyimide Copper Thin Film Redistribution
on Glass Ceramic/Copper Multilevel Substrates
..............................689
T.F. Redmond,
С
Prasad
and G.A. Walker, IBM Corporation
Hardware Technology for HITACHI M-880 Processor Group
.....................693
F. Kobayashi, Y. Watanabe, M. Yamamoto, A. Anzai, A. Takahashi, T. Daikoku
and T. Fujita, Hitachi, Ltd.
Micro Carrier for LSI Chip Used in the
HITAC
M-880 Processor Group
............704
T. Inoue, H. Matsuyama, E. Matsuzaki, Y. Narizuka, M. Ishino,
M. Tanaka and T. Takenaka, Hitachi, Ltd.
CMOS Multichip Module Test Vehicle with TAB d Components
...................712
P. Wesling, J. Shiao, T. Chung, T. Pan and D.
de Simone,
Tandem Computers, Inc.
Electrical Design Technology for Low Dielectric Constant
Multilayer Ceramic Substrate
............................................719
A. Sasaki and Y. Shimada, NEC Corporation
A
36
Chip Multiprocessor Multichip Module made with the General Electric
High Density Interconnect Technology
......................................727
M. Gdula, K.B. Welles II,
R
J. Wojnarowski, C.A. Neugebauer, and J.F. Burgess,
General Electric Company
Session
XVII....................
Packaging Reliability
Chairman: Darvin Edwards, Texas Instruments
Co-Chairaian: Robert T. Howard, Consultant
Evaluation of Chip Passivation and Coatings Using Special Purpose Assembly Test Chips
and Porous Silicon Moisture Detectors
.....................................731
J.N. Sweet,
D.W.
Peterson, M.R. Tuck, M.J. Kelly and T.R. Guillinger,
Sandia
National Laboratories
PECVD Silicon Nitride
Postbond
Films for Protecting Bondpads, Bonds and Bondwires
from Corrosion Failure
.................................................738
R.
Ulrich,
W.D. Brown,
S.S.
Ang,
and S. Yi, University of Arkansas;
J. Sweet and D. Peterson,
Sandia
National
Laboratories
Moisture Sensitivity of Thin Small Outline Packages
........................... 745
S. Goiwalkar, P. Boysan and R. Foehringer, Intel Corporation;
J. Jacobs, University of California at Berkeley
The Role of Plastic Package Adhesion in
1С
Performance
....................... . 750
S. Kim, Rohm and Haas Company
Thin Film Cracking in Plastic Packages
-
Analysis, Model and Improvements
........ 759
R. Foehringer,
S. Goiwalkar,
S. Eskildsen and S.
Altimari,
Intel Corporation
Causes of Cracks in SMD and Type-Specific Remedies
..........................766
S.
Omi,
1С
Fujita, T. Tsuda and T. Maeda, SHARP Corporation
Session XVIII ..............
Flip Chip/Solder Reliability
Chairman: Nicholas T. Panousis, IBM Corporation
Co-Chairman: Buck Winchell, Motorola Inc.
Flip-Chip Interconnection Technology for Advanced Thermal Conduction Modules
.....772
S.K. Ray, K.
Beckham
and R. Master, IBM Corporation
Flip Chip Repair Process
................................................779
N.R. Basavanhally,
S.A.
Gahr and H.N. Nguyen, AT&T Bell Laboratories;
J.J. Liu, Motorola, Inc.
Modeling of Self-Alignment Mechanism in Flip-Chip Soldering
-
Part II: Multichip Solder Joints
..........................................783
S.K.
Patra
and Y.C. Lee, University of Colorado
Thermal Cycling Induced Plastic Deformation in Solder Joints
-
Part II: Accumulated Deformation in Through-Hole Joints
......................789
Tsung-Yu Pan, Ford Motor Company
Fatigue Analysis of Flip Chip Assemblies Using Thermal Stress Simulations
and a Coffin-Manson Relation
...........................................797
R. Darveaux and K. Banerji, Motorola, Inc.
Influence of Environment on the Fatigue of Pb-Sn Solder Joints
...................806
Z. Guo, A.F.
Sprecher
and H. Conrad, North Carolina State University;
D.Y. Jung, IBM Corporation
Session
XIX......................
Multi-chip Modules
Chairman: John H. Kelly, IBM Corporation
Co-Chairman: James E.
Billigmeier, 3M
Industrial Electronics
Hermetic Passivation of Chip-on-Board Circuits
...............................813
LE.
Gates,
G.G.
Bakhit and T.G. Ward, Hughes Aircraft Co.
;
R.M. Kubacki, Ionic Systems
Encapsulant
for Non-hermetic Multichip Packaging Applications
..................820
A.W. Lin and C.P. Wong, AT&T Bell Laboratories
Via Processing Options for MCM-D Fabrication:
Excimer Laser Ablation vs. Reactive Ion Etching
..............................827
T.G. Tessier, W.F. Hoffman and J.W. Stafford, Motorola, Inc.
Improved Thermal Conductivity in Microelectronic
Encapsulants
..................835
P. Procter, Dexter Electronic Materials; J. Sole, Dow Chemical Company
New Packaging of Chip On Board By Unique Printing Method
....................843
A. Okuno, K. Nagai, K. Ikeda, T. Tsukazaki,
N.
Oyama, K. Nakahira and T. Hashimoto,
Japan
Rec
Co., Ltd.
Session XX
....................
Interconnect Reliability
Chairman: Ron
Thiel,
General Dynamics
Co-Chairman: Jim Lynch, GEC
Marroni
Materials Research
Fatigue Properties of Base Copper Materials Used in the Fabrication of Tab Leads
.... 848
T.A.
Scharr,
Motorola, Inc.
Brittle Cracks Induced in AISi Wire by the Ultrasonic Bonding Tool
...............854
R.T. Fitzsimmons, Raytheon Company; C.E. Miller, Massachusetts Institute of Technology
Session
XX
....................... Interconnect
Reliability (continued)
Resistance Drift in Aluminum to Gold Ultrasonic Wire Bonds
....................859
R.M. Murcko, R.A. Susko and J.M. Lauffer, IBM Corporation
Reliability of Thermally Aged
Au
and Sn Plated Copper Leads
for TAB Inner Lead Bonding
............................................866
E. Zakel, R.
Leutenbauer
and H.
Reichl, Technische Universität
Berlin
A Numerical and Experimental Study of Temperature Cycle Wire Bond Failure
.......877
N.V. Chidambaram, Cypress Semiconductor
A Reliability Study of Laser Trimmed NiCr Kerfs
.............................883
J.H. Linn, D.B. LaFontaine, R.W. Belcher, M.G. Shlepr and W.R. Wade, Harris Corporation
High Mechanical Reliability of Back-Ground GaAs LSI Chips
with Low Thermal Resistance
............................................890
M. Nishiguchi,
A. Miki,
N.
Goto, M. Fujihira and H. Nishizawa,
Sumitomo Electric Industries, Ltd.
Author Index
A
Ahmed,
S
......... 682
Akahoshi,
H
....... 585
Alley, R.P
......... 431
Altimari,
S
........ 759
Altshułer,
AM
.......1
Amey,
DJ......... 267
An,
С.
W..........
560
Anderson, R.L
..... 544
Ang,
S.S
.......... 738
Anzai,
A
......... 693
Aoki,
S
........... 141
Arao,
Y
.......... 519
Attarwala,
AI
...... 667
Azdasht,
G
........ 497
В
Babich,
E
.........362
Bachner, FJ....... 120
Bai, T.C.
......... 560
Bakhit, G.G
.......813
Bánba, T.
......... 564
Banerjee, K.
....... 382
Banerji, K.
........ 797
Barski, G.S
........ 172
Basavanhaily, N.R.
.. 779
Beckham,
К. ......
772
Belcher,
R.W
......883
Belopolsky,
Y
...... 103
Bernard,
R.
........62
Bhattacharyya, B.K.
. 278
Bickford, H.R
......507
Bïyier,
L.L.
........38
Booke, M.A
..____ 636
Bomer,
H.
......... 89
Borzych,
J
......... 442
Boudreau,
R
........30
Boyle,
Α.
......... 345
Boysan, P
......... 745
Brandner,
JJL
____.. 77
Breen,
В
.......428, 551
Brown, D.R
........ 621
Brown, WJD.
..____ 738
Burgess, J.F
........ 727
Burton, CD.
...... 169
С
Calderón, J
........ 647
Cangełlaris, A.C
.....55
Canner, J
......... 320
Canright, R.E
...... 370
Cataldo,
J.........
362
Chaisen,
MJ
....... 422
Chaoui,
G.M
....... 172
Charles,
RJ.......
431
Chen,
H
.......... 493
Chidambaram,
N.
V.
. 877
Chigodo, Y
........ 127
Chung,
K
......... 345
Chung,
T
.......... 712
Clark, W.F
........ 544
Confer,
R
......... 320
Conrad,
H
......658, 806
Cook, R.F......... 323
Corser, T.A
........ 150
Crawford,
R
........62
Curilla, J.P
........ 267
D
D Ambra, P.A
...... 597
Daikoku, T.
....... 693
Darveaux, R
....... 797
Dassattí, R
........ 103
Davidson, E.E
.......50
de Simone,
D
...... 712
DeMeritt, J.A
...... 169
DeNure, D.G
...... 249
DeSimone,
M
...... 647
Deutsch,
A
....... 362
Dixon, J.B......... 109
Dreier,
G
......... 345
Driessen, J
........ 147
Duh, J.G
.......... 653
E
El-Kareh, B
.....537, 544
Emkey, W.L. ...... 157
Eskildsen, S
....... 759
F
Feil,
M
........... 134
Felske, K
......... 555
Fields,
RJ.........
292
Fister,
J.C
......... 229
Fitzgerald,
P
....... 345
Fitzsimmons, R.T.
. . 854
Foehringer,
R.
. . 745, 759
Foster,
B.C
........ 120
Franzon, P.D
........ 85
Freyman,
В
........ 176
Fritz, H.L
......... 639
Fujíhira, M
........ 890
Fujita, K.
......... 766
Fujita, T
.......... 693
Fujita, Y
.......... 611
Fujiwara, M
....... 475
Fulton, J.J
......... 636
Fulton,
R
......... 382
G
Gaebe, CE
........ 172
Gahr, S.A
......... 779
Galligan, E
........ 362
Galvagni, J
........ 446
Gates, L.E
.....198, 813
Gdula, M
......... 727
Geckle, R.J
........ 218
Giacobazzi, J
....... 605
Gipprich, J.
W
.......20
Giroux, Y
......... 450
Goetsch, D.P
....... 313
Gofuku, E
......... 524
Goldberg,
S.B
....... 85
Goldblatt,
R
.......362
Golwalkar, S.
... 745, 759
Goto, N
.......... 890
Graham,
W
........ 362
Grimes, GJ
........38
Guillinger, T.R
.....731
Guo, Z.
...____658, 806
Gupta, S.P
........437
8Θβ
H
Harada, H
......... 442
Hardin, P.
W
........50
Harshbarger, R.W.
. . 203
Hartman, D.H......
463
Hartranft,
RJ
...... 273
Hashimoto,
Τ
...... 843
Hata,
S
........... 479
Hatta, Y
.......... 141
Hayashi,
Τ........
479
Heden, DJ........ 404
Hedrick,
J......
362, 572
Heleine,
TX.......
378
Herron,
L.
W.........
5
Hofer,
D
.......... 362
Hoffman, W.F
...... 827
Hofmann, S.R
....... 77
Holbrook, W.R
..... 172
Holmstrom,
R
.......30
Honmou,
H
........ 475
Horton, R.R
....... 507
Houge, J.C
........ 580
Huang, S.Y
.........34
Huang,
Y.........
323
Hwang, J
.......... 647
I
Iannuzzelli, R
......410
Igarashi, K
........ 190
Iguchi, Y
.......... 519
Ikeda, K
.......... 843
Ikemura, K.
....... 190
Imai, R
............ 14
Imoto,
K
.......483, 531
Inoue, T.
......... 704
Ishino, M
......... 704
Ishitsuka, F
........ 479
Ito,
S
............ 190
Itoh, M
........... 475
J
Jack, CA
......... 157
Jacobs,
J
.......... 745
Jameson, R.S
...... 172
Jiang,
W.
____.____ 203
Jobe,
P.G
......... 568
Johnson, B.E
....... 537
Johnson, D.P
....... 400
Jones, L.G........ 437
Jones, W.K........ 203
Jung,
D.Y
......... 806
К
Kamada,
С
........ 141
Kambe, R
.......... 14
Kanamori, T
....... 519
Kaneko, H
........475
Kashimura, S
....... 483
Kasten, J.S.........85
Katopis, G.A
........ 50
Katsura, K
........479
Kaw,
R
............ 62
Kawamura, T
......210
Kawashima, Y
...... 524
Kelly, M.J
......... 731
Khory, N
.......... 605
Kilinski, TJ
........ 313
Kim,
S
........... 750
Kimura, Y
.......... 14
Kitano, M
......... 615
Kluitmans, J.T.M.
... 147
Kobayashi, F
....... 693
Koford, S
......... 215
Kohara, M
........524
Kohashi, H
........ 475
Kohno, R
......... 615
Kokkelink, J.W
..... 147
Kolden,
К.........
283
Konno, R
..........70
Koopman, N.G
.....234
Kopcsay,
G
........ 362
Koripella,
CR......
457
Kotlowitz,
R.
W.....
299
Kubacki, R.M
......813
Kuroda,
M.........
14
Kurtz,
S
.......... 320
L
Labadie,
J
......... 362
LaFontaine,
D.B.
... 883
Lásky, R
.......... 161
Lauffer, J.M
....... 859
Leahy, K.A
.........20
Lee, Y.C
.......... 783
Leung,
G.B.........
10
Leutenbauer,
R
..... 866
Li, B-R
........... 261
Li,
XJ
...........560
Lien,
R.M
..........38
Lin, M
........... 345
Lin, A.W
.......... 820
Lindberg, F.A
.......96
Linn, J.H
......... 883
Liu,
K.C
.......... 653
Liu, J.J
........... 779
Low, S.R
.......... 292
Lu, Y-D
.......... 261
Lucey, G.K
.....292, 647
M
Mader, W......... 134
Maeda,
T
.........766
Mandai, H
........ 127
Mann, L.A........437
Marshall, J.L
....... 647
Martin, A.J
.........20
Martin,
T
.........382
Master, R.N
.....5, 772
Matsunaga, T.
..... 183
Matsuyama, H
...... 704
Matsuzaki,
E
....... 704
McGouey, R.
..____ 362
McKeown, S.A
.....671
McMahon,
J
.......568
Mechaik, M.M
......55
Michael, M.M
......273
Müller,
D.........
647
Miki,
A
........... 890
Miller, CM
........ 489
Miller,
CE
........ 854
Miller, TJ
......... 172
Miwa, T.
......... 183
Mizuishi,
К
........ 611
Morrison,
R
........30
Moss,
J
........... 555
Mukoh, A.
........ 585
Murata,
A
......... 141
Murcko, R.M.
.. 378, 859
Murphy, A.T
....... 335
Ν
Nagahori,
T.
....... 475
Nagai, A
.......... 585
Nagai,
К
.......... 843
Nagano,
К
......... 141
Nakahira,
К
....... 843
Narayan,
С
........ 362
Narizuka,
Y
....... 704
Nealon, M.G
........50
Neugebauer,
CA. ... 727
Ngo, K.D.T
........ 431
Nguyen, H.N
....... 779
Nishiguchi,
M
...... 890
Nishinmra, A
...... 615
Nishino, A
........ 531
Nishioka,
Τ
........ 190
Nishizawa,
Η
....... 890
Northrop, M.R
..... 109
Noyan, I.C
........ 507
Nunes,
S..........
362
Nunoshita,
M......
524
О
Occhionero, M.A.
. . . 120
Ohno, Y
.......... 519
Ohsaki,
T.
......... 70
Ohzeki, Y
......... 519
Oizumi, S.
........ 190
Okuno, A.
.....593, 843
Orner,
A.A. ........ 55
Omi,
S
........... 766
Ooki,
N........... 585
Otsuka, K.
........ 183
Oyama,
N......... 843
Ρ
Palmer,
MJ
....... 507
Pan,
Τ,
.......... 712
Pan, T-Y
.......... 789
Pan, W-Y
......... 261
Paraszczak,
J
....... 362
Parla, A.
......... 629
Patra, S.K
......... 783
Permisi, R
......... 176
Pepin, J.G
......... 328
Perezalonso, F
......62
Peterson,
D.W. . . 731, 738
Pires, R.G
......... 544
Plante, D
......... 555
Poblenz, F
......... 621
Posivy, K
.......... 629
Potts, H.R
......... 682
Powazinik,
W
.......30
Prasad,
С
......... 689
Prince, J.L.
.........55
Procopio,
G
....... 629
Procter,
P
......... 835
Puglisi,
С
......... 568
Q
Qin, G.H
......... 493
R
Radcliffe,
J........
161
Ranieri, V
......... 362
Rawal,
В..........
446
Ray, S.K.
......... 772
Redmond,
T.F
...... 689
Reich!,
H
......497, 866
Reinke, R.R....... 355
Rich,
EJL
.........20
Ritsko, J.......... 362
Rooney, D.T.
...... 109
Rosnen,
W.A.
..... 431
Rossi, R.D
........ 568
Rothman, L.
...... 362
S
Saenger,
К
........362
Sager,
J
........... 345
Sandhu, N.S
.......636
Sándor,
BI
........ 313
Sands, S.A.......... 10
Sargent,
R
..........
ЗО
Sasaki, A
.......... 719
Sasaki,
S
...........70
Scharr,
T.A
........ 848
Schmidt, CG...... 677
Schwenk,
CM
...... 172
Sees,
J
........... 647
Serino,
R
......... 362
Shaw,
J
........... 362
Shiao,
J
........... 712
Shih,
D.Y
......... 362
Shimada, Y
........ 719
Shirai, Y
.......... 183
Shlepr, M.G
....... 883
Shu,
В
............ 511
Smeltz, P.D
........ 172
Smiley,
B.C........
404
Smith, W.F
........323
Sole,
J
............ 835
Somasiri, N.L.D.
... 580
Sparks,
К.
W........
20
Sprague, J.L
.........1
Sprecher, A.F. . . 658, 806
Sproles, E.S
........ 249
Stafford,
J.W. .
. . 382, 827
Steer, M.B
.........85
Stigliani,
D
........ 161
Stys,
D
........... 278
Suarez, J.E
........ 537
Sugiura, N
......... 256
Suhir,
E
..........388
Suško, R.A
........ 859
Suzumura, T.
...... 210
Sweet, J.N
......731, 738
900
τ
Takachio,
Ν
....... 479
Takada,
M
........ 524
Takahashi, A
____585, 693
Такаі, А
.......... 141
Takeda,
Τ
......... 564
Takenaka,
Τ
....... 704
Takeuchi, E
....... 564
Tanaka, M
........ 704
Tang,
Ζ
........... 264
Taylor, L.R........ 299
Tessier, T.G....... 827
Thomas,
S
.......... 62
Thomas,
R
........ 605
Tien, J.K
.......... 667
Titcomb, S.L....... 544
Tojo, A...........
127
Tokoh,
A
......... 564
Tokuda, M
........ 611
Tomimuro, H
.......70
Tormey, E.S
....... 120
Trostle,
T
......... 320
Tsuboi,
T
......... 183
Tsuda,
T
.......... 766
Tsukazaki, T
....... 843
Tsunashima,
E
..... 593
Tsunetsugu, H
...... 479
Tubosaki,
К
....... 210
Tuck, M.R
........ 731
Tummala, R.R.
. . 5, 682
U
Uetsuka, H
........ 483
Uji,
T.
........... 475
Ulrich,
R
......... 738
Umeagukwu,
С
..... 382
V
van Tongeren,
H.
... 147
van Woensel, J.M.B.
. 245
Vaynman, S
........ 671
Villain,
J...........
89
Volksen,
W.....
362, 572
W
Wade, W.R
........ 883
Wajima,
M
........ 585
Walker, G.A
....... 689
Wang, D.G
........ 493
Wang, S.C
......... 378
Ward, T.G
.....198, 813
Warren,
R
......... 161
Watanabe,
1
....... 475
Watanabe,
Y
....... 693
Welles, K.B
........ 727
Wen,
Y
........... 283
Wesling,
P
......... 712
White, P.A
........ 120
Wiand, G.T
........ 172
Wilczynski,
J
....... 362
Willits,
В
.......... 621
Witman,
D
........ 362
Witzman,
S
........ 450
Wojnarowski,
RJ.
. . 727
Wong,
CP.....
597, 820
Wu, L.L
...........50
Wu,
Y
............ 264
Wyatt,
К
.......... 382
X
Xia, C.Y
...........26
Xie, T.L.
.......... 46
Xu, J.S
............44
Xu, J.P
........... 560
Y
Yan,
Z
........... 493
Yamamoto, M
...... 693
Yamashita,
T
....... 519
Yanushefski, K.A.
... 34
Yasuda,
К
......... 256
Yau, Y-W
......... 636
Yeh, C.P
.......... 382
Yeh, H
........... 362
Yeh, X-L
......... 172
Yerman, A.J
....... 431
Yi,
S
............. 738
Yoneda, H
........ 531
Υοοη,
D.Y
........ 572
Yoshida, A
........ 531
Young,
CE
........ 172
Young, F.J
........ 335
Ysebaert,
E
......... 38
Ζ
Zakel, E
.......497, 866
Zarlingo, S.P
....... 229
Zenner, R.L.D
.....580
Zhang J-L
......... 261
Zhang, X
..........44
Zhang,
Y
..........44
Zhou,
Ζ
.......... 264
Zhuge,
R
.........203
|
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| author_corporate | Electronic Components and Technology Conference Atlanta, Ga |
| author_corporate_role | aut |
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| building | Verbundindex |
| bvnumber | BV005929159 |
| classification_tum | ELT 296f ELT 235f |
| ctrlnum | (OCoLC)489791949 (DE-599)BVBBV005929159 |
| discipline | Elektrotechnik |
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| genre | (DE-588)1071861417 Konferenzschrift 11.05.1991-16.05.1991 Atlanta, Ga. gnd-content |
| genre_facet | Konferenzschrift 11.05.1991-16.05.1991 Atlanta, Ga. |
| id | DE-604.BV005929159 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T16:37:01Z |
| institution | BVB |
| institution_GND | (DE-588)5059524-6 |
| isbn | 0780300122 0780300130 0780300149 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-003713033 |
| oclc_num | 489791949 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | XV, 900 S. Ill., zahlr. graph. Darst. |
| publishDate | 1991 |
| publishDateSearch | 1991 |
| publishDateSort | 1991 |
| publisher | Inst. of Electrical and Electronics Engineers |
| record_format | marc |
| spelling | Electronic Components and Technology Conference 41 1991 Atlanta, Ga. Verfasser (DE-588)5059524-6 aut 1991 proceedings May 11 - 16, 1991, The Westin Peachtree Plaza, Atlanta, Georgia 41st Electronic Components & Technology Conference New York, NY Inst. of Electrical and Electronics Engineers 1991 XV, 900 S. Ill., zahlr. graph. Darst. txt rdacontent n rdamedia nc rdacarrier Literaturangaben Composants électroniques - Congrès ram Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Elektronische Baugruppe (DE-588)4014350-8 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 11.05.1991-16.05.1991 Atlanta, Ga. gnd-content Elektronische Baugruppe (DE-588)4014350-8 s DE-604 Gehäuse (DE-588)4156307-4 s Elektronisches Bauelement (DE-588)4014360-0 s Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=003713033&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | 1991 proceedings May 11 - 16, 1991, The Westin Peachtree Plaza, Atlanta, Georgia Composants électroniques - Congrès ram Elektronisches Bauelement (DE-588)4014360-0 gnd Elektronische Baugruppe (DE-588)4014350-8 gnd Gehäuse (DE-588)4156307-4 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4014350-8 (DE-588)4156307-4 (DE-588)1071861417 |
| title | 1991 proceedings May 11 - 16, 1991, The Westin Peachtree Plaza, Atlanta, Georgia |
| title_auth | 1991 proceedings May 11 - 16, 1991, The Westin Peachtree Plaza, Atlanta, Georgia |
| title_exact_search | 1991 proceedings May 11 - 16, 1991, The Westin Peachtree Plaza, Atlanta, Georgia |
| title_full | 1991 proceedings May 11 - 16, 1991, The Westin Peachtree Plaza, Atlanta, Georgia 41st Electronic Components & Technology Conference |
| title_fullStr | 1991 proceedings May 11 - 16, 1991, The Westin Peachtree Plaza, Atlanta, Georgia 41st Electronic Components & Technology Conference |
| title_full_unstemmed | 1991 proceedings May 11 - 16, 1991, The Westin Peachtree Plaza, Atlanta, Georgia 41st Electronic Components & Technology Conference |
| title_short | 1991 proceedings |
| title_sort | 1991 proceedings may 11 16 1991 the westin peachtree plaza atlanta georgia |
| title_sub | May 11 - 16, 1991, The Westin Peachtree Plaza, Atlanta, Georgia |
| topic | Composants électroniques - Congrès ram Elektronisches Bauelement (DE-588)4014360-0 gnd Elektronische Baugruppe (DE-588)4014350-8 gnd Gehäuse (DE-588)4156307-4 gnd |
| topic_facet | Composants électroniques - Congrès Elektronisches Bauelement Elektronische Baugruppe Gehäuse Konferenzschrift 11.05.1991-16.05.1991 Atlanta, Ga. |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=003713033&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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