VLSI metallization: physics and technologies
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Boston u.a.
Artech House
1991
|
| Schriftenreihe: | The Artech House materials science library
|
| Schlagworte: | |
| Beschreibung: | Literaturangaben |
| Beschreibung: | X, 529 S. Ill., graph. Darst. |
| ISBN: | 0890065012 |
Internformat
MARC
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| 035 | |a (OCoLC)22508209 | ||
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| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
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| 245 | 1 | 0 | |a VLSI metallization |b physics and technologies |c Krishna Shenai ed. |
| 264 | 1 | |a Boston u.a. |b Artech House |c 1991 | |
| 300 | |a X, 529 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a The Artech House materials science library | |
| 500 | |a Literaturangaben | ||
| 650 | 7 | |a Circuitos integrados |2 larpcal | |
| 650 | 7 | |a Metalizacao (semicondutor) |2 larpcal | |
| 650 | 4 | |a Electric contacts | |
| 650 | 4 | |a Metallizing | |
| 650 | 4 | |a Semiconductor-metal boundaries | |
| 650 | 0 | 7 | |a Halbleitergrenzfläche |0 (DE-588)4158802-2 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Metallisieren |0 (DE-588)4169599-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Halbleitertechnologie |0 (DE-588)4158814-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Metall |0 (DE-588)4038860-8 |2 gnd |9 rswk-swf |
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| 700 | 1 | |a Shenai, Krishna |e Sonstige |4 oth | |
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Datensatz im Suchindex
| _version_ | 1804118724883513344 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV004605295 |
| callnumber-first | T - Technology |
| callnumber-label | TK7872 |
| callnumber-raw | TK7872.C68 |
| callnumber-search | TK7872.C68 |
| callnumber-sort | TK 47872 C68 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4950 |
| classification_tum | ELT 280f |
| ctrlnum | (OCoLC)22508209 (DE-599)BVBBV004605295 |
| dewey-full | 621.381/52 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/52 |
| dewey-search | 621.381/52 |
| dewey-sort | 3621.381 252 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| genre | (DE-588)4143413-4 Aufsatzsammlung gnd-content |
| genre_facet | Aufsatzsammlung |
| id | DE-604.BV004605295 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T16:14:51Z |
| institution | BVB |
| isbn | 0890065012 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-002828954 |
| oclc_num | 22508209 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM DE-29T DE-83 |
| owner_facet | DE-91 DE-BY-TUM DE-29T DE-83 |
| physical | X, 529 S. Ill., graph. Darst. |
| publishDate | 1991 |
| publishDateSearch | 1991 |
| publishDateSort | 1991 |
| publisher | Artech House |
| record_format | marc |
| series2 | The Artech House materials science library |
| spelling | VLSI metallization physics and technologies Krishna Shenai ed. Boston u.a. Artech House 1991 X, 529 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier The Artech House materials science library Literaturangaben Circuitos integrados larpcal Metalizacao (semicondutor) larpcal Electric contacts Metallizing Semiconductor-metal boundaries Halbleitergrenzfläche (DE-588)4158802-2 gnd rswk-swf Metallisieren (DE-588)4169599-9 gnd rswk-swf Halbleitertechnologie (DE-588)4158814-9 gnd rswk-swf Metall (DE-588)4038860-8 gnd rswk-swf (DE-588)4143413-4 Aufsatzsammlung gnd-content Metallisieren (DE-588)4169599-9 s Halbleitertechnologie (DE-588)4158814-9 s DE-604 Metall (DE-588)4038860-8 s Halbleitergrenzfläche (DE-588)4158802-2 s Shenai, Krishna Sonstige oth |
| spellingShingle | VLSI metallization physics and technologies Circuitos integrados larpcal Metalizacao (semicondutor) larpcal Electric contacts Metallizing Semiconductor-metal boundaries Halbleitergrenzfläche (DE-588)4158802-2 gnd Metallisieren (DE-588)4169599-9 gnd Halbleitertechnologie (DE-588)4158814-9 gnd Metall (DE-588)4038860-8 gnd |
| subject_GND | (DE-588)4158802-2 (DE-588)4169599-9 (DE-588)4158814-9 (DE-588)4038860-8 (DE-588)4143413-4 |
| title | VLSI metallization physics and technologies |
| title_auth | VLSI metallization physics and technologies |
| title_exact_search | VLSI metallization physics and technologies |
| title_full | VLSI metallization physics and technologies Krishna Shenai ed. |
| title_fullStr | VLSI metallization physics and technologies Krishna Shenai ed. |
| title_full_unstemmed | VLSI metallization physics and technologies Krishna Shenai ed. |
| title_short | VLSI metallization |
| title_sort | vlsi metallization physics and technologies |
| title_sub | physics and technologies |
| topic | Circuitos integrados larpcal Metalizacao (semicondutor) larpcal Electric contacts Metallizing Semiconductor-metal boundaries Halbleitergrenzfläche (DE-588)4158802-2 gnd Metallisieren (DE-588)4169599-9 gnd Halbleitertechnologie (DE-588)4158814-9 gnd Metall (DE-588)4038860-8 gnd |
| topic_facet | Circuitos integrados Metalizacao (semicondutor) Electric contacts Metallizing Semiconductor-metal boundaries Halbleitergrenzfläche Metallisieren Halbleitertechnologie Metall Aufsatzsammlung |
| work_keys_str_mv | AT shenaikrishna vlsimetallizationphysicsandtechnologies |