Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York
Van Nostrand Reinhold
1989
|
| Ausgabe: | 2. pr. |
| Schlagworte: | |
| Beschreibung: | XXII, 456 S. Ill., zahlr. graph. Darst. |
| ISBN: | 0442207549 |
Internformat
MARC
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| 001 | BV002102235 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | t | ||
| 008 | 891023s1989 ad|| |||| 00||| eng d | ||
| 020 | |a 0442207549 |9 0-442-20754-9 | ||
| 035 | |a (OCoLC)18716280 | ||
| 035 | |a (DE-599)BVBBV002102235 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-91 | ||
| 050 | 0 | |a TK7868.P7 | |
| 082 | 0 | |a 621.381/74 |2 19 | |
| 084 | |a ELT 009f |2 stub | ||
| 100 | 1 | |a Hwang, Jennie S. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Solder paste in electronics packaging |b technology and applications in surface mount, hybrid circuits, and component assembly |
| 250 | |a 2. pr. | ||
| 264 | 1 | |a New York |b Van Nostrand Reinhold |c 1989 | |
| 300 | |a XXII, 456 S. |b Ill., zahlr. graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 4 | |a Printed circuits |x Design and construction | |
| 650 | 4 | |a Solder pastes | |
| 650 | 4 | |a Surface mount technology | |
| 650 | 0 | 7 | |a Lötpaste |0 (DE-588)4236072-9 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Lötpaste |0 (DE-588)4236072-9 |D s |
| 689 | 0 | |5 DE-604 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-001378206 | ||
Datensatz im Suchindex
| _version_ | 1804116555531812864 |
|---|---|
| any_adam_object | |
| author | Hwang, Jennie S. |
| author_facet | Hwang, Jennie S. |
| author_role | aut |
| author_sort | Hwang, Jennie S. |
| author_variant | j s h js jsh |
| building | Verbundindex |
| bvnumber | BV002102235 |
| callnumber-first | T - Technology |
| callnumber-label | TK7868 |
| callnumber-raw | TK7868.P7 |
| callnumber-search | TK7868.P7 |
| callnumber-sort | TK 47868 P7 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_tum | ELT 009f |
| ctrlnum | (OCoLC)18716280 (DE-599)BVBBV002102235 |
| dewey-full | 621.381/74 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/74 |
| dewey-search | 621.381/74 |
| dewey-sort | 3621.381 274 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | 2. pr. |
| format | Book |
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| id | DE-604.BV002102235 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T15:40:22Z |
| institution | BVB |
| isbn | 0442207549 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-001378206 |
| oclc_num | 18716280 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | XXII, 456 S. Ill., zahlr. graph. Darst. |
| publishDate | 1989 |
| publishDateSearch | 1989 |
| publishDateSort | 1989 |
| publisher | Van Nostrand Reinhold |
| record_format | marc |
| spelling | Hwang, Jennie S. Verfasser aut Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly 2. pr. New York Van Nostrand Reinhold 1989 XXII, 456 S. Ill., zahlr. graph. Darst. txt rdacontent n rdamedia nc rdacarrier Printed circuits Design and construction Solder pastes Surface mount technology Lötpaste (DE-588)4236072-9 gnd rswk-swf Lötpaste (DE-588)4236072-9 s DE-604 |
| spellingShingle | Hwang, Jennie S. Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly Printed circuits Design and construction Solder pastes Surface mount technology Lötpaste (DE-588)4236072-9 gnd |
| subject_GND | (DE-588)4236072-9 |
| title | Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly |
| title_auth | Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly |
| title_exact_search | Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly |
| title_full | Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly |
| title_fullStr | Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly |
| title_full_unstemmed | Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly |
| title_short | Solder paste in electronics packaging |
| title_sort | solder paste in electronics packaging technology and applications in surface mount hybrid circuits and component assembly |
| title_sub | technology and applications in surface mount, hybrid circuits, and component assembly |
| topic | Printed circuits Design and construction Solder pastes Surface mount technology Lötpaste (DE-588)4236072-9 gnd |
| topic_facet | Printed circuits Design and construction Solder pastes Surface mount technology Lötpaste |
| work_keys_str_mv | AT hwangjennies solderpasteinelectronicspackagingtechnologyandapplicationsinsurfacemounthybridcircuitsandcomponentassembly |