Microelectronics interconnection and packaging:
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
New York u.a.
McGraw-Hill
1980
|
| Series: | Electronics book series.
|
| Subjects: | |
| Item Description: | Aus: Electronics magazine |
| Physical Description: | VII, 320 S. Ill., graph. Darst. |
| ISBN: | 0076066002 |
Staff View
MARC
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Record in the Search Index
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| building | Verbundindex |
| bvnumber | BV002040168 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874 |
| callnumber-search | TK7874 |
| callnumber-sort | TK 47874 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| ctrlnum | (OCoLC)5495968 (DE-599)BVBBV002040168 |
| dewey-full | 621.381/73 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/73 |
| dewey-search | 621.381/73 |
| dewey-sort | 3621.381 273 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV002040168 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T15:39:20Z |
| institution | BVB |
| isbn | 0076066002 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-001334126 |
| oclc_num | 5495968 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM DE-706 DE-83 |
| owner_facet | DE-91 DE-BY-TUM DE-706 DE-83 |
| physical | VII, 320 S. Ill., graph. Darst. |
| psigel | TUB-nseb |
| publishDate | 1980 |
| publishDateSearch | 1980 |
| publishDateSort | 1980 |
| publisher | McGraw-Hill |
| record_format | marc |
| series2 | Electronics book series. |
| spelling | Microelectronics interconnection and packaging Hrsg. von Jerry Lyman* New York u.a. McGraw-Hill 1980 VII, 320 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electronics book series. Aus: Electronics magazine Integrated circuits Microelectronic packaging Lyman, Jerry Sonstige oth |
| spellingShingle | Microelectronics interconnection and packaging Integrated circuits Microelectronic packaging |
| title | Microelectronics interconnection and packaging |
| title_auth | Microelectronics interconnection and packaging |
| title_exact_search | Microelectronics interconnection and packaging |
| title_full | Microelectronics interconnection and packaging Hrsg. von Jerry Lyman* |
| title_fullStr | Microelectronics interconnection and packaging Hrsg. von Jerry Lyman* |
| title_full_unstemmed | Microelectronics interconnection and packaging Hrsg. von Jerry Lyman* |
| title_short | Microelectronics interconnection and packaging |
| title_sort | microelectronics interconnection and packaging |
| topic | Integrated circuits Microelectronic packaging |
| topic_facet | Integrated circuits Microelectronic packaging |
| work_keys_str_mv | AT lymanjerry microelectronicsinterconnectionandpackaging |