Modeling and application of flexible electronics packaging:
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Beijing
Science Press
[2019]
Singapore Springer [2019] |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis Inhaltsverzeichnis |
| Beschreibung: | xvii, 287 Seiten Illustrationen, Diagramme |
| ISBN: | 9789811336263 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV046785147 | ||
| 003 | DE-604 | ||
| 005 | 20200903 | ||
| 007 | t | ||
| 008 | 200629s2019 cc a||| |||| 00||| eng d | ||
| 015 | |a 20,A25 |2 dnb | ||
| 016 | 7 | |a 1209282119 |2 DE-101 | |
| 020 | |a 9789811336263 |c Festeinband |9 978-981-13-3626-3 | ||
| 035 | |a (OCoLC)1192523659 | ||
| 035 | |a (DE-599)DNB1209282119 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 044 | |a cc |c XB-CN |a si |c XB-SG | ||
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| 082 | 0 | |a 621.381046 |2 23/ger | |
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 084 | |a ZN 4120 |0 (DE-625)157353: |2 rvk | ||
| 084 | |a 621.3 |2 sdnb | ||
| 100 | 1 | |a Huang, YongAn |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Modeling and application of flexible electronics packaging |c YoungAn Huang, Zhouping Yin, Xiaodong Wan |
| 264 | 1 | |a Beijing |b Science Press |c [2019] | |
| 264 | 1 | |a Singapore |b Springer |c [2019] | |
| 300 | |a xvii, 287 Seiten |b Illustrationen, Diagramme | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 0 | 7 | |a Dünne Schicht |0 (DE-588)4136925-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Chip |0 (DE-588)4197163-2 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Verbindungstechnik |0 (DE-588)4129183-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Flexible Leiterplatte |0 (DE-588)4317748-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Polymerelektronik |0 (DE-588)7735306-7 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Polymerelektronik |0 (DE-588)7735306-7 |D s |
| 689 | 0 | 1 | |a Verbindungstechnik |0 (DE-588)4129183-9 |D s |
| 689 | 0 | 2 | |a Flexible Leiterplatte |0 (DE-588)4317748-7 |D s |
| 689 | 0 | 3 | |a Chip |0 (DE-588)4197163-2 |D s |
| 689 | 0 | 4 | |a Dünne Schicht |0 (DE-588)4136925-7 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Yin, Zhoupng |e Verfasser |4 aut | |
| 700 | 1 | |a Wan, Xiaodong |e Verfasser |4 aut | |
| 776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe |t Modeling and Application of Flexible Electronics Packaging |b 1st edition 2019 |d Singapore : Springer Singapore, 2019 |z 978-981-13-3627-0 |
| 856 | 4 | 2 | |m B:DE-101 |q application/pdf |u https://d-nb.info/1209282119/04 |3 Inhaltsverzeichnis |
| 856 | 4 | 2 | |m DNB Datenaustausch |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=032194215&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-032194215 | ||
Datensatz im Suchindex
| _version_ | 1804181569930264576 |
|---|---|
| adam_text | CONTENTS
1
ADVANCED
ELECTRONIC
PACKAGING
..............................................................
1
1.1
INTRODUCTION
..........................................................................................
1
1.2
ADHESIVELY
BONDED
MULTILAYER
STRUCTURE
..........................................
5
1.3
INTERFACIAL
PEELING-OFF
..........................................................................
6
1.3.1
NEEDLE
EJECTING
FOR
THIN
CHIPS
............................................
6
1.3.2
CONFORMAL
PEELING
FOR
LARGE-AREA
DEVICES
.......................
8
1.3.3
LLO
FOR
LARGE-AREA
FLEXIBLE
ELECTRONICS
............................
9
1.4
VACUUM-BASED
CHIP
PICKING-UP
.......................................................
12
1.5
VACUUM-BASED
CHIP
PLACING-ON
.......................................................
13
1.6
COMPETING
FRACTURE
............................................................................
16
1.6.1
COMPETING
FRACTURE
BEHAVIOR
..............................................
16
1.6.2
FRACTURE
STRENGTH
AND
ADHESIVE
FRACTURE
ENERGY
..............
16
REFERENCES
......................................................................................................
17
2
INTERFACIAL
MODELING
OF
FLEXIBLE
MULTILAYER
STRUCTURES
.......................
29
2.1
INTRODUCTION
..........................................................................................
29
2.2
MODELING
OF
CHIP-ON-SUBSTRATE
STRUCTURE
..........................................
29
2.2.1
MECHANICAL
MODEL
.................................................................
29
2.2.2
ANALYTICAL
EVALUATION
ON
ERR
OF
INTERFACIAL
PEELING
....
31
2.2.3
VIRTUAL
CRACK
CLOSURE
TECHNIQUE
(VCCT)
..........................
33
2.2.4
NUMERICAL
MODEL
...................................................................
34
2.3
MODELING
OF
CHIP-ADHESIVE-SUBSTRATE
ADHESIVELY
BONDED
JOINTS
......................................................................................................
34
2.3.1
ADHESIVE
MODEL
ON
OVERLAPPED
JOINTS
..............................
34
2.3.2
EQUILIBRIUM
EQUATIONS
..........................................................
36
2.3.3
ESTABLISHMENT
OF
DIFFERENTIAL
EQUATION
SET
.........................
38
2.3.4
SOLUTIONS
FOR
INTERNAL
FORCES
AND
DISPLACEMENTS
...............
40
2.3.5
RELATIONSHIPS
AMONG
INTEGRATION
CONSTANTS
........................
44
2.3.6
THEORETICAL
CALCULATION
OF
ERR
OF
INTERFACIAL
PEELING
.
...
46
XI
XII
CONTENTS
2.4
SUMMARY
................................................................................................
46
REFERENCES
.......................................................................................................
47
3
MEASUREMENT
OF
FRACTURE
STRENGTH
OF
ULTRA-THIN
SILICON
CHIP
AND
ADHESIVE
FRACTURE
ENERGY
.................................................................
49
3.1
INTRODUCTION
...........................................................................................
49
3.2
FRACTURE
STRENGTH
OF
ULTRA-THIN
SILICON
CHIP
.....................................
50
3.2.1
EXPERIMENTAL
PROCEDURE
........................................................
50
3.2.2
NONLINEAR
MECHANICAL
CHARACTERIZATION
IN
BENDING
TEST
...........................................................................................
51
3.2.3
ESTIMATION
OF
FRACTURE
STRENGTH
............................................
58
3.3
ESTIMATION
OF
ADHESIVE
FRACTURE
ENERGY
OF
ADHESIVE
TAPE
............
62
3.3.1
THEORETICAL
FOUNDATION
..........................................................
62
3.3.2
EXPERIMENTAL
PROCEDURE
........................................................
64
3.3.3
ESTIMATION
OF
ADHESIVE
FRACTURE
ENERGY
............................
64
3.3.4
ANGLE
DEPENDENCE
OF
PEEL
FORCE
........................................
65
3.3.5
RATE
DEPENDENCE
OF
ADHESIVE
FRACTURE
ENERGY
..................
67
3.4
SUMMARY
................................................................................................
69
REFERENCES
.......................................................................................................
70
4
TENSION-ASSISTED
PEELING
.............................................................................
73
4.1
INTRODUCTION
...........................................................................................
73
4.2
THEORETICAL
DETERMINATION
OF
INTEGRATION
CONSTANTS
..........................
73
4.2.1
STIFFENED
PLATE
JOINT
UNDER
AXIAL
TENSION
AND
BENDING
MOMENT
.............................................................
74
4.2.2
SINGLE-STRAP
JOINT
UNDER
TENSION
........................................
76
4.2.3
SINGLE-LAP
JOINT
UNDER
TENSION
..........................................
79
4.3
MODELING
OF
ADHESIVELY
BONDED
CHIP
ARRAY
...................................
82
4.3.1
MECHANICAL
MODEL
DESCRIPTION
............................................
82
4.3.2
BOUNDARY
AND
CONTINUITY
CONDITIONS
...................................
84
4.3.3
SOLUTION
FOR
INTERNAL
FORCES
AND
DISPLACEMENTS
................
85
4.3.4
DETERMINATION
OF
INTEGRATION
CONSTANTS
..............................
86
4.4
ADHESIVE
STRESSES
FOR
ADHESIVELY
BONDED
JOINTS
............................
87
4.4.1
ANALYSIS
OF
BALANCED
ADHESIVELY
BONDED
JOINTS
..............
87
4.4.2
ANALYSIS
OF
UNBALANCED
ADHESIVELY
BONDED
JOINTS
......... 90
4.4.3
DISCUSSION
OF
RESULTS
.............................................................
92
4.5
PEELING
BEHAVIOR
FOR
CHIP
ARRAY
ON
STRETCHED
SUBSTRATE
.................
93
4.5.1
ADHESIVE
STRESSES
.................................................................
93
4.5.2
EFFECT
OF
GEOMETRIC
DIMENSIONS
..........................................
95
4.5.3
EFFECT
OF
MATERIAL
PROPERTIES
.................................................
98
4.5.4
PROCESS
OPTIMIZATION
.............................................................
100
4.6
SUMMARY
................................................................................................
101
REFERENCES
.......................................................................................................
102
CONTENTS
XIII
5
SINGLE-NEEDLE
PEELING
....................................................................................
105
5.1
INTRODUCTION
..........................................................................................
105
5.2
A
CASE
FOR
CHIP-ON-SUBSTRATE
STRUCTURE
.............................................
107
5.2.1
EFFECT
OF
CRACK
LENGTH
..........................................................
108
5.2.2
EFFECT
OF
GEOMETRIC
DIMENSIONS
..........................................
108
5.2.3
EFFECT
OF
ELASTIC
MISMATCH
...................................................
110
5.3
A
CASE
FOR
CHIP-ADHESIVE-SUBSTRATE
STRUCTURE
.................................
ILL
5.3.1
GEOMETRIC
MODEL
DESCRIPTION
...............................................
ILL
5.3.2
THEORETICAL
CALCULATION
OF
ERR
..........................................
115
5.3.3
EFFECT
OF
CRACK
LENGTH
..........................................................
116
5.3.4
EFFECT
OF
GEOMETRIC
DIMENSIONS
..........................................
117
5.3.5
EFFECT
OF
MATERIAL
PROPERTIES
................................................
118
5.3.6
ANALYSIS
ON
TUNABILITY
OF
PEELING
MODE
...........................
119
5.4
ANALYSIS
OF
FRACTURE
MODE
BASED
ON
COMPETING
INDEX
...................
121
5.4.1
TYPICAL
FRACTURE
MODES
........................................................
121
5.4.2
COMPETING
FRACTURE
MODEL
...................................................
123
5.4.3
BASIC
FRACTURE
PARAMETERS
.....................................................
124
5.4.4
EFFECT
OF
GEOMETRIC
DIMENSIONS
..........................................
125
5.4.5
DISCUSSION
ON
RESULTS
..........................................................
127
5.5
IMPACT
EFFECT
OF
NEEDLE
PEELING-OFF
PROCESS
......................................
130
5.5.1
FAILED
SAMPLE
OBSERVATION
...................................................
130
5.5.2
NUMERICAL
MODEL
...................................................................
130
5.5.3 EFFECT
OF
IMPACT
SPEED
..........................................................
132
5.5.4
EFFECT
OF
SUBSTRATE
PENETRATION
............................................
134
5.6
SUMMARY
...............................................................................................
135
REFERENCES
......................................................................................................
137
6
MULTI-NEEDLE
PEELING
....................................................................................
139
6.1
INTRODUCTION
..........................................................................................
139
6.2
MECHANICAL
MODEL
OF
MULTI-NEEDLE
PEELING-OFF
................................
140
6.2.1
MODEL
DESCRIPTION
.................................................................
140
6.2.2
BOUNDARY
AND
CONTINUITY
CONDITIONS
......................................
142
6.2.3
DETERMINATION
OF
INTEGRATION
CONSTANTS
..............................
144
6.3
COMPETING
FRACTURE
MODEL
OF
CHIP-ADHESIVE-SUBSTRATE
STRUCTURE
...............................................................................................
147
6.3.1
MODELING
OF
COMPETING
FRACTURE
BEHAVIOR
.......................
147
6.4
ANALYSIS
OF
BENDING
NORMAL
STRESS
AND
ERR
OF
INTERFACIAL
PEELING
.................................................................................................
151
6.4.1
ANALYSIS
OF
BENDING
NORMAL
STRESS
.....................................
151
6.4.2
ANALYSIS
OF
ERR
OF
INTERFACIAL
PEELING
..............................
154
6.5
EFFECT
OF
CHIP
GEOMETRY
ON
COMPETING
FRACTURE
BEHAVIOR
............
156
6.5.1
EFFECT
OF
CHIP
THICKNESS
.....................................................
156
6.5.2
EFFECT
OF
CHIP
LENGTH
............................................................
158
XIV
CONTENTS
6.6
EXPERIMENTAL
VALIDATION
......................................................................
160
6.6.1
EXPERIMENTAL
SYSTEM
.............................................................
160
6.7
SUMMARY
................................................................................................
162
REFERENCES
.......................................................................................................
163
7
CONFORMAL
PEELING
......................................................................................
165
7.1
INTRODUCTION
...........................................................................................
165
7.2
MODELING
OF
CONFORMAL
PEELING
FOR
MULTILAYER
STRUCTURE
................
166
7.3
EFFECT
OF
MATERIAL
PROPERTIES
AND
GEOMETRIC
SIZE
............................
174
7.3.1
EFFECT
OF
YOUNG
S
MODULUS
OF
DEVICE
LAYER
......................
174
7.3.2
EFFECT
OF
YOUNG
S
MODULUS
OF
ADHESIVE
LAYER
..................
176
7.3.3
EFFECT
OF
DEVICE
THICKNESS
...................................................
179
7.3.4
EFFECT
OF
SUBSTRATE
THICKNESS
...............................................
181
7.3.5
SELECTION
OF
DEVICE
THICKNESS
............................................
183
7.3.6
SELECTION
OF
SUBSTRATE
THICKNESS
..........................................
185
7.4
EFFECTS
OF
PROCESS
PARAMETERS
.............................................................
186
7.4.1
EFFECT
OF
PEEL
RADIUS
.............................................................
186
7.4.2
EFFECT
OF
CONFORMAL
ANGLE
...................................................
186
7.4.3
EFFECT
OF
SUBSTRATE
TENSION
...................................................
187
7.5
EXPERIMENTAL
DETERMINATION
OF
ADHESIVE
FRACTURE
ENERGY
..............
189
7.6
DESIGN
OF
PEEL
BLADE
AND
ITS
APPLICATION
..........................................
194
7.6.1
OPTIMAL
DESIGN
OF
PEEL
BLADE
...............................................
194
7.6.2
EXPERIMENTAL
VALIDATION
........................................................
195
7.7
SUMMARY
................................................................................................
198
REFERENCES
.......................................................................................................
199
8
LASER
LIFT-OFF
..................................................................................................
201
8.1
INTRODUCTION
...........................................................................................
201
8.2
LASER-INDUCED
INTERFACIAL
REACTION
(LIIR)
........................................
202
8.2.1
BAND
GAP
...............................................................................
203
8.2.2
LASER
WAVELENGTH
.................................................................
204
8.2.3
LASER
FLUENCE
........................................................................
204
8.2.4
LASER
IRRADIATION
TIME
..........................................................
205
8.2.5
LASER
SCANNING
OVERLAP
........................................................
205
8.2.6
PHYSICAL
AND
CHEMICAL
PROPERTIES
OF
MATERIAL
....................
206
8.3
EXPERIMENTAL
STUDY
OF
LLO
MECHANISM
OF
ULTRA-THIN
PI
FILM
FROM
GLASS
CARRIER
...............................................................................
206
8.3.1
EXPERIMENTAL
PROCEDURE
.........................................................
206
8.3.2
OPTICAL
PHENOMENA
OBSERVED
AFTER
LASER
IRRADIATION
....
208
8.3.3
EFFECTS
OF
ART
AND
PI
FILM
THICKNESS
ON
THRESHOLD
FLUENCE
....................................................................................
210
8.3.4
TYPICAL
SEM
IMAGES
OF
PI/GLASS
INTERFACE
........................
212
8.3.5
EFFECTS
OF
LASER
FLUENCE
AND
ART
ON
INTERFACE
ADHESION
STRENGTH
....................................................................................
214
CONTENTS
XV
8.3.6
ANALYSIS
OF
SEPARATION
MODE
...............................................
216
8.3.7
ANALYSIS
OF
BUBBLE
HEIGHT
....................................................
219
8.3.8
ANALYSIS
OF
PROCESS
WINDOW
...............................................
221
8.4
SUMMARY
...............................................................................................
221
REFERENCES
......................................................................................................
222
9
VACUUM-BASED
PICKING-UP
AND
PLACING-ON
.............................................
227
9.1
INTRODUCTION
...........................................................................................
227
9.2
VACUUM-BASED
CHIP
PICKING-UP
PROCESS
..........................................
228
9.2.1
MECHANICAL
MODEL
.................................................................
228
9.2.2
BOUNDARY
AND
CONTINUITY
CONDITIONS
....................................
232
9.2.3
DETERMINATION
OF
INTEGRATION
CONSTANTS
...............................
234
9.2.4
DETERMINATION
OF
PICKING-UP
CRITERION
.................................
235
9.2.5
EFFECT
OF
RATIO
OF
ADHESIVE
LENGTH
TO
CHIP
LENGTH
..........
236
9.2.6
EFFECT
OF
RATIO
OF
VAP
BELOW
SUBSTRATE
.............................
238
9.2.7
EFFECT
OF
CRACK
PROPAGATION
.................................................
240
9.2.8
EFFECTS
OF
PROPERTIES
OF
CHIP
AND
SUBSTRATE
LAYERS
............
242
9.2.9
PREDICTION
OF
CHIP
PICKING-UP
..............................................
245
9.2.10
DESIGN
OF
CHIP
PICKING-UP
...................................................
246
9.3
R2R
PROCESS
WITH
LOW
INTERFACIAL
RESIDUAL
STRESS
..........................
248
9.3.1
TEMPERATURE
AND
FORCE-INDUCED
MISFITS
IN
R2R
PROCESSING
...............................................................................
248
9.3.2
INTERFACIAL
STRESS
RELATED
TO
STRUCTURES
AND
PROCESSES
....
251
9.3.3
MATERIAL
SELECTION
AND
STRUCTURAL
OPTIMIZATION
OF
FILM-ON-SUBSTRATE
SYSTEM
.................................................
255
9.3.4
CO-OPTIMIZATION
ON
MATERIAL,
STRUCTURE,
AND
PROCESS
.........
260
9.4
THERMAL-PRESSING
CONSOLIDATION
IN
CHIP
PLACING-ON
PROCESS
.........
262
9.4.1
LWT-BASED
MECHANICAL
MODEL
............................................
262
9.4.2
EQUILIBRIUM
EQUATIONS
AND
SOLUTION
STRATEGY
.....................
265
9.4.3
BOUNDARY
CONDITIONS
............................................................
268
9.4.4
NUMERICAL
APPROACH
............................................................
268
9.4.5
MECHANISM
OF
ULTRA-THIN
CHIP
WARPAGE
............................
271
9.4.6
EFFECTS
OF
STRUCTURE
DIMENSIONS
AND
MATERIALS
...................
271
9.4.7
EXPERIMENTAL
VERIFICATION
.....................................................
273
9.5
SUMMARY
...............................................................................................
276
REFERENCES
......................................................................................................
277
APPENDIX
..............................................................................................................
281
|
| adam_txt |
CONTENTS
1
ADVANCED
ELECTRONIC
PACKAGING
.
1
1.1
INTRODUCTION
.
1
1.2
ADHESIVELY
BONDED
MULTILAYER
STRUCTURE
.
5
1.3
INTERFACIAL
PEELING-OFF
.
6
1.3.1
NEEDLE
EJECTING
FOR
THIN
CHIPS
.
6
1.3.2
CONFORMAL
PEELING
FOR
LARGE-AREA
DEVICES
.
8
1.3.3
LLO
FOR
LARGE-AREA
FLEXIBLE
ELECTRONICS
.
9
1.4
VACUUM-BASED
CHIP
PICKING-UP
.
12
1.5
VACUUM-BASED
CHIP
PLACING-ON
.
13
1.6
COMPETING
FRACTURE
.
16
1.6.1
COMPETING
FRACTURE
BEHAVIOR
.
16
1.6.2
FRACTURE
STRENGTH
AND
ADHESIVE
FRACTURE
ENERGY
.
16
REFERENCES
.
17
2
INTERFACIAL
MODELING
OF
FLEXIBLE
MULTILAYER
STRUCTURES
.
29
2.1
INTRODUCTION
.
29
2.2
MODELING
OF
CHIP-ON-SUBSTRATE
STRUCTURE
.
29
2.2.1
MECHANICAL
MODEL
.
29
2.2.2
ANALYTICAL
EVALUATION
ON
ERR
OF
INTERFACIAL
PEELING
.
31
2.2.3
VIRTUAL
CRACK
CLOSURE
TECHNIQUE
(VCCT)
.
33
2.2.4
NUMERICAL
MODEL
.
34
2.3
MODELING
OF
CHIP-ADHESIVE-SUBSTRATE
ADHESIVELY
BONDED
JOINTS
.
34
2.3.1
ADHESIVE
MODEL
ON
OVERLAPPED
JOINTS
.
34
2.3.2
EQUILIBRIUM
EQUATIONS
.
36
2.3.3
ESTABLISHMENT
OF
DIFFERENTIAL
EQUATION
SET
.
38
2.3.4
SOLUTIONS
FOR
INTERNAL
FORCES
AND
DISPLACEMENTS
.
40
2.3.5
RELATIONSHIPS
AMONG
INTEGRATION
CONSTANTS
.
44
2.3.6
THEORETICAL
CALCULATION
OF
ERR
OF
INTERFACIAL
PEELING
.
.
46
XI
XII
CONTENTS
2.4
SUMMARY
.
46
REFERENCES
.
47
3
MEASUREMENT
OF
FRACTURE
STRENGTH
OF
ULTRA-THIN
SILICON
CHIP
AND
ADHESIVE
FRACTURE
ENERGY
.
49
3.1
INTRODUCTION
.
49
3.2
FRACTURE
STRENGTH
OF
ULTRA-THIN
SILICON
CHIP
.
50
3.2.1
EXPERIMENTAL
PROCEDURE
.
50
3.2.2
NONLINEAR
MECHANICAL
CHARACTERIZATION
IN
BENDING
TEST
.
51
3.2.3
ESTIMATION
OF
FRACTURE
STRENGTH
.
58
3.3
ESTIMATION
OF
ADHESIVE
FRACTURE
ENERGY
OF
ADHESIVE
TAPE
.
62
3.3.1
THEORETICAL
FOUNDATION
.
62
3.3.2
EXPERIMENTAL
PROCEDURE
.
64
3.3.3
ESTIMATION
OF
ADHESIVE
FRACTURE
ENERGY
.
64
3.3.4
ANGLE
DEPENDENCE
OF
PEEL
FORCE
.
65
3.3.5
RATE
DEPENDENCE
OF
ADHESIVE
FRACTURE
ENERGY
.
67
3.4
SUMMARY
.
69
REFERENCES
.
70
4
TENSION-ASSISTED
PEELING
.
73
4.1
INTRODUCTION
.
73
4.2
THEORETICAL
DETERMINATION
OF
INTEGRATION
CONSTANTS
.
73
4.2.1
STIFFENED
PLATE
JOINT
UNDER
AXIAL
TENSION
AND
BENDING
MOMENT
.
74
4.2.2
SINGLE-STRAP
JOINT
UNDER
TENSION
.
76
4.2.3
SINGLE-LAP
JOINT
UNDER
TENSION
.
79
4.3
MODELING
OF
ADHESIVELY
BONDED
CHIP
ARRAY
.
82
4.3.1
MECHANICAL
MODEL
DESCRIPTION
.
82
4.3.2
BOUNDARY
AND
CONTINUITY
CONDITIONS
.
84
4.3.3
SOLUTION
FOR
INTERNAL
FORCES
AND
DISPLACEMENTS
.
85
4.3.4
DETERMINATION
OF
INTEGRATION
CONSTANTS
.
86
4.4
ADHESIVE
STRESSES
FOR
ADHESIVELY
BONDED
JOINTS
.
87
4.4.1
ANALYSIS
OF
BALANCED
ADHESIVELY
BONDED
JOINTS
.
87
4.4.2
ANALYSIS
OF
UNBALANCED
ADHESIVELY
BONDED
JOINTS
. 90
4.4.3
DISCUSSION
OF
RESULTS
.
92
4.5
PEELING
BEHAVIOR
FOR
CHIP
ARRAY
ON
STRETCHED
SUBSTRATE
.
93
4.5.1
ADHESIVE
STRESSES
.
93
4.5.2
EFFECT
OF
GEOMETRIC
DIMENSIONS
.
95
4.5.3
EFFECT
OF
MATERIAL
PROPERTIES
.
98
4.5.4
PROCESS
OPTIMIZATION
.
100
4.6
SUMMARY
.
101
REFERENCES
.
102
CONTENTS
XIII
5
SINGLE-NEEDLE
PEELING
.
105
5.1
INTRODUCTION
.
105
5.2
A
CASE
FOR
CHIP-ON-SUBSTRATE
STRUCTURE
.
107
5.2.1
EFFECT
OF
CRACK
LENGTH
.
108
5.2.2
EFFECT
OF
GEOMETRIC
DIMENSIONS
.
108
5.2.3
EFFECT
OF
ELASTIC
MISMATCH
.
110
5.3
A
CASE
FOR
CHIP-ADHESIVE-SUBSTRATE
STRUCTURE
.
ILL
5.3.1
GEOMETRIC
MODEL
DESCRIPTION
.
ILL
5.3.2
THEORETICAL
CALCULATION
OF
ERR
.
115
5.3.3
EFFECT
OF
CRACK
LENGTH
.
116
5.3.4
EFFECT
OF
GEOMETRIC
DIMENSIONS
.
117
5.3.5
EFFECT
OF
MATERIAL
PROPERTIES
.
118
5.3.6
ANALYSIS
ON
TUNABILITY
OF
PEELING
MODE
.
119
5.4
ANALYSIS
OF
FRACTURE
MODE
BASED
ON
COMPETING
INDEX
.
121
5.4.1
TYPICAL
FRACTURE
MODES
.
121
5.4.2
COMPETING
FRACTURE
MODEL
.
123
5.4.3
BASIC
FRACTURE
PARAMETERS
.
124
5.4.4
EFFECT
OF
GEOMETRIC
DIMENSIONS
.
125
5.4.5
DISCUSSION
ON
RESULTS
.
127
5.5
IMPACT
EFFECT
OF
NEEDLE
PEELING-OFF
PROCESS
.
130
5.5.1
FAILED
SAMPLE
OBSERVATION
.
130
5.5.2
NUMERICAL
MODEL
.
130
5.5.3 EFFECT
OF
IMPACT
SPEED
.
132
5.5.4
EFFECT
OF
SUBSTRATE
PENETRATION
.
134
5.6
SUMMARY
.
135
REFERENCES
.
137
6
MULTI-NEEDLE
PEELING
.
139
6.1
INTRODUCTION
.
139
6.2
MECHANICAL
MODEL
OF
MULTI-NEEDLE
PEELING-OFF
.
140
6.2.1
MODEL
DESCRIPTION
.
140
6.2.2
BOUNDARY
AND
CONTINUITY
CONDITIONS
.
142
6.2.3
DETERMINATION
OF
INTEGRATION
CONSTANTS
.
144
6.3
COMPETING
FRACTURE
MODEL
OF
CHIP-ADHESIVE-SUBSTRATE
STRUCTURE
.
147
6.3.1
MODELING
OF
COMPETING
FRACTURE
BEHAVIOR
.
147
6.4
ANALYSIS
OF
BENDING
NORMAL
STRESS
AND
ERR
OF
INTERFACIAL
PEELING
.
151
6.4.1
ANALYSIS
OF
BENDING
NORMAL
STRESS
.
151
6.4.2
ANALYSIS
OF
ERR
OF
INTERFACIAL
PEELING
.
154
6.5
EFFECT
OF
CHIP
GEOMETRY
ON
COMPETING
FRACTURE
BEHAVIOR
.
156
6.5.1
EFFECT
OF
CHIP
THICKNESS
.
156
6.5.2
EFFECT
OF
CHIP
LENGTH
.
158
XIV
CONTENTS
6.6
EXPERIMENTAL
VALIDATION
.
160
6.6.1
EXPERIMENTAL
SYSTEM
.
160
6.7
SUMMARY
.
162
REFERENCES
.
163
7
CONFORMAL
PEELING
.
165
7.1
INTRODUCTION
.
165
7.2
MODELING
OF
CONFORMAL
PEELING
FOR
MULTILAYER
STRUCTURE
.
166
7.3
EFFECT
OF
MATERIAL
PROPERTIES
AND
GEOMETRIC
SIZE
.
174
7.3.1
EFFECT
OF
YOUNG
'
S
MODULUS
OF
DEVICE
LAYER
.
174
7.3.2
EFFECT
OF
YOUNG
'
S
MODULUS
OF
ADHESIVE
LAYER
.
176
7.3.3
EFFECT
OF
DEVICE
THICKNESS
.
179
7.3.4
EFFECT
OF
SUBSTRATE
THICKNESS
.
181
7.3.5
SELECTION
OF
DEVICE
THICKNESS
.
183
7.3.6
SELECTION
OF
SUBSTRATE
THICKNESS
.
185
7.4
EFFECTS
OF
PROCESS
PARAMETERS
.
186
7.4.1
EFFECT
OF
PEEL
RADIUS
.
186
7.4.2
EFFECT
OF
CONFORMAL
ANGLE
.
186
7.4.3
EFFECT
OF
SUBSTRATE
TENSION
.
187
7.5
EXPERIMENTAL
DETERMINATION
OF
ADHESIVE
FRACTURE
ENERGY
.
189
7.6
DESIGN
OF
PEEL
BLADE
AND
ITS
APPLICATION
.
194
7.6.1
OPTIMAL
DESIGN
OF
PEEL
BLADE
.
194
7.6.2
EXPERIMENTAL
VALIDATION
.
195
7.7
SUMMARY
.
198
REFERENCES
.
199
8
LASER
LIFT-OFF
.
201
8.1
INTRODUCTION
.
201
8.2
LASER-INDUCED
INTERFACIAL
REACTION
(LIIR)
.
202
8.2.1
BAND
GAP
.
203
8.2.2
LASER
WAVELENGTH
.
204
8.2.3
LASER
FLUENCE
.
204
8.2.4
LASER
IRRADIATION
TIME
.
205
8.2.5
LASER
SCANNING
OVERLAP
.
205
8.2.6
PHYSICAL
AND
CHEMICAL
PROPERTIES
OF
MATERIAL
.
206
8.3
EXPERIMENTAL
STUDY
OF
LLO
MECHANISM
OF
ULTRA-THIN
PI
FILM
FROM
GLASS
CARRIER
.
206
8.3.1
EXPERIMENTAL
PROCEDURE
.
206
8.3.2
OPTICAL
PHENOMENA
OBSERVED
AFTER
LASER
IRRADIATION
.
208
8.3.3
EFFECTS
OF
ART
AND
PI
FILM
THICKNESS
ON
THRESHOLD
FLUENCE
.
210
8.3.4
TYPICAL
SEM
IMAGES
OF
PI/GLASS
INTERFACE
.
212
8.3.5
EFFECTS
OF
LASER
FLUENCE
AND
ART
ON
INTERFACE
ADHESION
STRENGTH
.
214
CONTENTS
XV
8.3.6
ANALYSIS
OF
SEPARATION
MODE
.
216
8.3.7
ANALYSIS
OF
BUBBLE
HEIGHT
.
219
8.3.8
ANALYSIS
OF
PROCESS
WINDOW
.
221
8.4
SUMMARY
.
221
REFERENCES
.
222
9
VACUUM-BASED
PICKING-UP
AND
PLACING-ON
.
227
9.1
INTRODUCTION
.
227
9.2
VACUUM-BASED
CHIP
PICKING-UP
PROCESS
.
228
9.2.1
MECHANICAL
MODEL
.
228
9.2.2
BOUNDARY
AND
CONTINUITY
CONDITIONS
.
232
9.2.3
DETERMINATION
OF
INTEGRATION
CONSTANTS
.
234
9.2.4
DETERMINATION
OF
PICKING-UP
CRITERION
.
235
9.2.5
EFFECT
OF
RATIO
OF
ADHESIVE
LENGTH
TO
CHIP
LENGTH
.
236
9.2.6
EFFECT
OF
RATIO
OF
VAP
BELOW
SUBSTRATE
.
238
9.2.7
EFFECT
OF
CRACK
PROPAGATION
.
240
9.2.8
EFFECTS
OF
PROPERTIES
OF
CHIP
AND
SUBSTRATE
LAYERS
.
242
9.2.9
PREDICTION
OF
CHIP
PICKING-UP
.
245
9.2.10
DESIGN
OF
CHIP
PICKING-UP
.
246
9.3
R2R
PROCESS
WITH
LOW
INTERFACIAL
RESIDUAL
STRESS
.
248
9.3.1
TEMPERATURE
AND
FORCE-INDUCED
MISFITS
IN
R2R
PROCESSING
.
248
9.3.2
INTERFACIAL
STRESS
RELATED
TO
STRUCTURES
AND
PROCESSES
.
251
9.3.3
MATERIAL
SELECTION
AND
STRUCTURAL
OPTIMIZATION
OF
FILM-ON-SUBSTRATE
SYSTEM
.
255
9.3.4
CO-OPTIMIZATION
ON
MATERIAL,
STRUCTURE,
AND
PROCESS
.
260
9.4
THERMAL-PRESSING
CONSOLIDATION
IN
CHIP
PLACING-ON
PROCESS
.
262
9.4.1
LWT-BASED
MECHANICAL
MODEL
.
262
9.4.2
EQUILIBRIUM
EQUATIONS
AND
SOLUTION
STRATEGY
.
265
9.4.3
BOUNDARY
CONDITIONS
.
268
9.4.4
NUMERICAL
APPROACH
.
268
9.4.5
MECHANISM
OF
ULTRA-THIN
CHIP
WARPAGE
.
271
9.4.6
EFFECTS
OF
STRUCTURE
DIMENSIONS
AND
MATERIALS
.
271
9.4.7
EXPERIMENTAL
VERIFICATION
.
273
9.5
SUMMARY
.
276
REFERENCES
.
277
APPENDIX
.
281 |
| any_adam_object | 1 |
| any_adam_object_boolean | 1 |
| author | Huang, YongAn Yin, Zhoupng Wan, Xiaodong |
| author_facet | Huang, YongAn Yin, Zhoupng Wan, Xiaodong |
| author_role | aut aut aut |
| author_sort | Huang, YongAn |
| author_variant | y h yh z y zy x w xw |
| building | Verbundindex |
| bvnumber | BV046785147 |
| classification_rvk | ZN 4192 ZN 4120 |
| ctrlnum | (OCoLC)1192523659 (DE-599)DNB1209282119 |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| illustrated | Illustrated |
| index_date | 2024-07-03T14:51:12Z |
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| institution | BVB |
| isbn | 9789811336263 |
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| publisher | Science Press Springer |
| record_format | marc |
| spelling | Huang, YongAn Verfasser aut Modeling and application of flexible electronics packaging YoungAn Huang, Zhouping Yin, Xiaodong Wan Beijing Science Press [2019] Singapore Springer [2019] xvii, 287 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Dünne Schicht (DE-588)4136925-7 gnd rswk-swf Chip (DE-588)4197163-2 gnd rswk-swf Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf Flexible Leiterplatte (DE-588)4317748-7 gnd rswk-swf Polymerelektronik (DE-588)7735306-7 gnd rswk-swf Polymerelektronik (DE-588)7735306-7 s Verbindungstechnik (DE-588)4129183-9 s Flexible Leiterplatte (DE-588)4317748-7 s Chip (DE-588)4197163-2 s Dünne Schicht (DE-588)4136925-7 s DE-604 Yin, Zhoupng Verfasser aut Wan, Xiaodong Verfasser aut Erscheint auch als Online-Ausgabe Modeling and Application of Flexible Electronics Packaging 1st edition 2019 Singapore : Springer Singapore, 2019 978-981-13-3627-0 B:DE-101 application/pdf https://d-nb.info/1209282119/04 Inhaltsverzeichnis DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=032194215&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Huang, YongAn Yin, Zhoupng Wan, Xiaodong Modeling and application of flexible electronics packaging Dünne Schicht (DE-588)4136925-7 gnd Chip (DE-588)4197163-2 gnd Verbindungstechnik (DE-588)4129183-9 gnd Flexible Leiterplatte (DE-588)4317748-7 gnd Polymerelektronik (DE-588)7735306-7 gnd |
| subject_GND | (DE-588)4136925-7 (DE-588)4197163-2 (DE-588)4129183-9 (DE-588)4317748-7 (DE-588)7735306-7 |
| title | Modeling and application of flexible electronics packaging |
| title_auth | Modeling and application of flexible electronics packaging |
| title_exact_search | Modeling and application of flexible electronics packaging |
| title_exact_search_txtP | Modeling and application of flexible electronics packaging |
| title_full | Modeling and application of flexible electronics packaging YoungAn Huang, Zhouping Yin, Xiaodong Wan |
| title_fullStr | Modeling and application of flexible electronics packaging YoungAn Huang, Zhouping Yin, Xiaodong Wan |
| title_full_unstemmed | Modeling and application of flexible electronics packaging YoungAn Huang, Zhouping Yin, Xiaodong Wan |
| title_short | Modeling and application of flexible electronics packaging |
| title_sort | modeling and application of flexible electronics packaging |
| topic | Dünne Schicht (DE-588)4136925-7 gnd Chip (DE-588)4197163-2 gnd Verbindungstechnik (DE-588)4129183-9 gnd Flexible Leiterplatte (DE-588)4317748-7 gnd Polymerelektronik (DE-588)7735306-7 gnd |
| topic_facet | Dünne Schicht Chip Verbindungstechnik Flexible Leiterplatte Polymerelektronik |
| url | https://d-nb.info/1209282119/04 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=032194215&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT huangyongan modelingandapplicationofflexibleelectronicspackaging AT yinzhoupng modelingandapplicationofflexibleelectronicspackaging AT wanxiaodong modelingandapplicationofflexibleelectronicspackaging |
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Inhaltsverzeichnis