Semiconductor wafer bonding: science and technology
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York [u.a.]
Wiley
1999
|
| Schriftenreihe: | The Electrochemical Society series
A Wiley-Interscience publication |
| Schlagworte: | |
| Beschreibung: | XVIII, 297 S. graph. Darst. |
| ISBN: | 0471574813 |
Internformat
MARC
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| 245 | 1 | 0 | |a Semiconductor wafer bonding |b science and technology |c Q.-Y. Tong ; U. Gösele |
| 264 | 1 | |a New York [u.a.] |b Wiley |c 1999 | |
| 300 | |a XVIII, 297 S. |b graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a The Electrochemical Society series |v A Wiley-Interscience publication | |
| 650 | 7 | |a Materiais e dispositivos semicondutores |2 larpcal | |
| 650 | 4 | |a Semiconductor wafers | |
| 650 | 4 | |a Semiconductors |x Bonding | |
| 650 | 0 | 7 | |a Bonden |0 (DE-588)4232594-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Silicium |0 (DE-588)4077445-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Wafer |0 (DE-588)4294605-0 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Silicium |0 (DE-588)4077445-4 |D s |
| 689 | 0 | 1 | |a Wafer |0 (DE-588)4294605-0 |D s |
| 689 | 0 | 2 | |a Bonden |0 (DE-588)4232594-8 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Gösele, Ulrich |d 1949-2009 |e Verfasser |0 (DE-588)108522024 |4 aut | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-008490827 | ||
Datensatz im Suchindex
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| any_adam_object | |
| author | Tong, Qin-Yi Gösele, Ulrich 1949-2009 |
| author_GND | (DE-588)108522024 |
| author_facet | Tong, Qin-Yi Gösele, Ulrich 1949-2009 |
| author_role | aut aut |
| author_sort | Tong, Qin-Yi |
| author_variant | q y t qyt u g ug |
| building | Verbundindex |
| bvnumber | BV012510066 |
| callnumber-first | T - Technology |
| callnumber-label | TK7871 |
| callnumber-raw | TK7871.85 |
| callnumber-search | TK7871.85 |
| callnumber-sort | TK 47871.85 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4150 |
| ctrlnum | (OCoLC)633008640 (DE-599)BVBBV012510066 |
| dewey-full | 621.3815/2 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815/2 |
| dewey-search | 621.3815/2 |
| dewey-sort | 3621.3815 12 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV012510066 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:28:49Z |
| institution | BVB |
| isbn | 0471574813 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-008490827 |
| oclc_num | 633008640 |
| open_access_boolean | |
| owner | DE-29T DE-703 DE-1050 |
| owner_facet | DE-29T DE-703 DE-1050 |
| physical | XVIII, 297 S. graph. Darst. |
| publishDate | 1999 |
| publishDateSearch | 1999 |
| publishDateSort | 1999 |
| publisher | Wiley |
| record_format | marc |
| series2 | The Electrochemical Society series |
| spelling | Tong, Qin-Yi Verfasser aut Semiconductor wafer bonding science and technology Q.-Y. Tong ; U. Gösele New York [u.a.] Wiley 1999 XVIII, 297 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier The Electrochemical Society series A Wiley-Interscience publication Materiais e dispositivos semicondutores larpcal Semiconductor wafers Semiconductors Bonding Bonden (DE-588)4232594-8 gnd rswk-swf Silicium (DE-588)4077445-4 gnd rswk-swf Wafer (DE-588)4294605-0 gnd rswk-swf Silicium (DE-588)4077445-4 s Wafer (DE-588)4294605-0 s Bonden (DE-588)4232594-8 s DE-604 Gösele, Ulrich 1949-2009 Verfasser (DE-588)108522024 aut |
| spellingShingle | Tong, Qin-Yi Gösele, Ulrich 1949-2009 Semiconductor wafer bonding science and technology Materiais e dispositivos semicondutores larpcal Semiconductor wafers Semiconductors Bonding Bonden (DE-588)4232594-8 gnd Silicium (DE-588)4077445-4 gnd Wafer (DE-588)4294605-0 gnd |
| subject_GND | (DE-588)4232594-8 (DE-588)4077445-4 (DE-588)4294605-0 |
| title | Semiconductor wafer bonding science and technology |
| title_auth | Semiconductor wafer bonding science and technology |
| title_exact_search | Semiconductor wafer bonding science and technology |
| title_full | Semiconductor wafer bonding science and technology Q.-Y. Tong ; U. Gösele |
| title_fullStr | Semiconductor wafer bonding science and technology Q.-Y. Tong ; U. Gösele |
| title_full_unstemmed | Semiconductor wafer bonding science and technology Q.-Y. Tong ; U. Gösele |
| title_short | Semiconductor wafer bonding |
| title_sort | semiconductor wafer bonding science and technology |
| title_sub | science and technology |
| topic | Materiais e dispositivos semicondutores larpcal Semiconductor wafers Semiconductors Bonding Bonden (DE-588)4232594-8 gnd Silicium (DE-588)4077445-4 gnd Wafer (DE-588)4294605-0 gnd |
| topic_facet | Materiais e dispositivos semicondutores Semiconductor wafers Semiconductors Bonding Bonden Silicium Wafer |
| work_keys_str_mv | AT tongqinyi semiconductorwaferbondingscienceandtechnology AT goseleulrich semiconductorwaferbondingscienceandtechnology |