Showing 1 - 5 results of 5 for search 'Seok, Seonho', query time: 0.02s Refine Results
In addition to media from the THWS, media from other Bavarian libraries are also displayed.
These are marked with the "Interlibrary loan" label and can be ordered by clicking on them.
  1. 1
    Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

    Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method by Seok, Seonho

    Published 2018

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  2. 2
    Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method

    Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method by Seok, Seonho

    Published 2018
    Description
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  3. 3
    Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

    Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method by Seok, Seonho

    Published 2018
    Electronic eBook Interlibrary loan Place Request


    Saved in:
  4. 4
    Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

    Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method by Seok, Seonho

    Published 2018
    Electronic eBook Interlibrary loan Place Request


    Saved in:
  5. 5
    MEMS packaging technologies and 3D integration

    MEMS packaging technologies and 3D integration

    Published 2022
    Other Authors: “…Seok, Seonho…”
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