Cooling of microelectronic and nanoelectronic equipment: advances and emerging research
Gespeichert in:
Weitere Verfasser: | , , |
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Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Singapore
World Scientific Publishing Company
2015
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Schriftenreihe: | WSPC series in advanced integration and packaging
Volume 3 |
Schlagworte: | |
Beschreibung: | Print version record |
Beschreibung: | 1 online resource (471 pages) illustrations (some color) |
ISBN: | 9789814579797 9814579793 |
Internformat
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245 | 1 | 0 | |a Cooling of microelectronic and nanoelectronic equipment |b advances and emerging research |c Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia, editors |
264 | 1 | |a Singapore |b World Scientific Publishing Company |c 2015 | |
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490 | 0 | |a WSPC series in advanced integration and packaging |v Volume 3 | |
500 | |a Print version record | ||
505 | 8 | |a To celebrate Professor Avi Bar-Cohen''s 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of | |
650 | 7 | |a TECHNOLOGY & ENGINEERING / Mechanical |2 bisacsh | |
650 | 7 | |a Electric machinery / Cooling |2 fast | |
650 | 7 | |a Microelectronics |2 fast | |
650 | 7 | |a Nanoelectronics |2 fast | |
650 | 4 | |a Electric machinery |x Cooling |a Microelectronics |a Nanoelectronics | |
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776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |t Cooling of microelectronic and nanoelectronic equipment : advances and emerging research |d Singapore : World Scientific Publishing Company, 2015 |h x, 460 pages |k WSPC series in advanced integration and packaging ; Volume 3 |z 9789814579780 |
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Datensatz im Suchindex
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---|---|
any_adam_object | |
author2 | Iyengar, Madhusudan Geisler, Karl J. L. Sammakia, Bahgat |
author2_role | edt edt edt |
author2_variant | m i mi k j l g kjl kjlg b s bs |
author_facet | Iyengar, Madhusudan Geisler, Karl J. L. Sammakia, Bahgat |
building | Verbundindex |
bvnumber | BV045345541 |
collection | ZDB-4-ENC |
contents | To celebrate Professor Avi Bar-Cohen''s 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of |
ctrlnum | (ZDB-4-ENC)ocn893672993 (OCoLC)893672993 (DE-599)BVBBV045345541 |
dewey-full | 621.38 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.38 |
dewey-search | 621.38 |
dewey-sort | 3621.38 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic eBook |
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id | DE-604.BV045345541 |
illustrated | Illustrated |
indexdate | 2024-07-10T08:15:33Z |
institution | BVB |
isbn | 9789814579797 9814579793 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030732244 |
oclc_num | 893672993 |
open_access_boolean | |
physical | 1 online resource (471 pages) illustrations (some color) |
psigel | ZDB-4-ENC |
publishDate | 2015 |
publishDateSearch | 2015 |
publishDateSort | 2015 |
publisher | World Scientific Publishing Company |
record_format | marc |
series2 | WSPC series in advanced integration and packaging |
spelling | Cooling of microelectronic and nanoelectronic equipment advances and emerging research Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia, editors Singapore World Scientific Publishing Company 2015 2015 1 online resource (471 pages) illustrations (some color) txt rdacontent c rdamedia cr rdacarrier WSPC series in advanced integration and packaging Volume 3 Print version record To celebrate Professor Avi Bar-Cohen''s 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electric machinery / Cooling fast Microelectronics fast Nanoelectronics fast Electric machinery Cooling Microelectronics Nanoelectronics Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Kühlung (DE-588)4132435-3 gnd rswk-swf Kühlung (DE-588)4132435-3 s Mikroelektronik (DE-588)4039207-7 s 1\p DE-604 Iyengar, Madhusudan edt Geisler, Karl J. L. edt Sammakia, Bahgat edt Erscheint auch als Druck-Ausgabe Cooling of microelectronic and nanoelectronic equipment : advances and emerging research Singapore : World Scientific Publishing Company, 2015 x, 460 pages WSPC series in advanced integration and packaging ; Volume 3 9789814579780 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
spellingShingle | Cooling of microelectronic and nanoelectronic equipment advances and emerging research To celebrate Professor Avi Bar-Cohen''s 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electric machinery / Cooling fast Microelectronics fast Nanoelectronics fast Electric machinery Cooling Microelectronics Nanoelectronics Mikroelektronik (DE-588)4039207-7 gnd Kühlung (DE-588)4132435-3 gnd |
subject_GND | (DE-588)4039207-7 (DE-588)4132435-3 |
title | Cooling of microelectronic and nanoelectronic equipment advances and emerging research |
title_auth | Cooling of microelectronic and nanoelectronic equipment advances and emerging research |
title_exact_search | Cooling of microelectronic and nanoelectronic equipment advances and emerging research |
title_full | Cooling of microelectronic and nanoelectronic equipment advances and emerging research Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia, editors |
title_fullStr | Cooling of microelectronic and nanoelectronic equipment advances and emerging research Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia, editors |
title_full_unstemmed | Cooling of microelectronic and nanoelectronic equipment advances and emerging research Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia, editors |
title_short | Cooling of microelectronic and nanoelectronic equipment |
title_sort | cooling of microelectronic and nanoelectronic equipment advances and emerging research |
title_sub | advances and emerging research |
topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electric machinery / Cooling fast Microelectronics fast Nanoelectronics fast Electric machinery Cooling Microelectronics Nanoelectronics Mikroelektronik (DE-588)4039207-7 gnd Kühlung (DE-588)4132435-3 gnd |
topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Electric machinery / Cooling Microelectronics Nanoelectronics Electric machinery Cooling Microelectronics Nanoelectronics Mikroelektronik Kühlung |
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