Mechanics of flexible and stretchable electronics:
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[2025]
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| Beschreibung: | xiv, 482 Seiten Illustrationen 25 cm, 666 g |
| ISBN: | 3527352198 9783527352197 |
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| 245 | 1 | 0 | |a Mechanics of flexible and stretchable electronics |c edited by Yong Zhu and Nanshu Lu |
| 264 | 1 | |a Weinheim, Germany |b WILEY VCH |c [2025] | |
| 300 | |a xiv, 482 Seiten |b Illustrationen |c 25 cm, 666 g | ||
| 336 | |b txt |2 rdacontent | ||
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| 653 | |a EEB0: Electronic Materials | ||
| 653 | |a EEB0: Elektronische Materialien | ||
| 653 | |a Electrical & Electronics Engineering | ||
| 653 | |a Electronic Materials | ||
| 653 | |a Elektronische Materialien | ||
| 653 | |a Elektrotechnik u. Elektronik | ||
| 653 | |a Festkörpermechanik | ||
| 653 | |a Flexible electronics | ||
| 653 | |a ME40: Festkörpermechanik | ||
| 653 | |a ME40: Solid Mechanics | ||
| 653 | |a MS40: Electronic Materials | ||
| 653 | |a MS40: Elektronische Materialien | ||
| 653 | |a Maschinenbau | ||
| 653 | |a Materials Science | ||
| 653 | |a Materialwissenschaften | ||
| 653 | |a Mechanical Engineering | ||
| 653 | |a Solid Mechanics | ||
| 653 | |a architecture material | ||
| 653 | |a bio-electronic adhesive | ||
| 653 | |a composite | ||
| 653 | |a hydrogel | ||
| 653 | |a kirigami | ||
| 653 | |a liquid metal | ||
| 653 | |a nanomaterial | ||
| 653 | |a organic semiconductor | ||
| 653 | |a origami | ||
| 653 | |a rigid electronics | ||
| 653 | |a soft robot | ||
| 653 | |a stretchable electronics | ||
| 653 | |a wearable health monitoring | ||
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| 776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe |t Mechanics of Flexible and Stretchable Electronics |b 1. Auflage |d Weinheim : Wiley-VCH, 2024 |h Online-Ressource, 499 Seiten |
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Datensatz im Suchindex
| _version_ | 1818186755136815104 |
|---|---|
| adam_text |
CONTENTS
PREFACE
XIII
PART!
MATERIALS
1
1
EXTREME
MECHANICS
OF
HYDROGELS
TOWARD
IN
SITU
HYDROGEL
BIOELECTRONICS
3
TSZ
H.
WONG,
XUANHE
ZHAO,
AND
SHOOTING
LIN
1.1
1.2
1.2.1
1.2.2
1.2.3
1.2.4
1.3
1.3.1
1.3.2
1.4
1.4.1
1.4.2
1.5
1.5.1
1.5.2
1.5.3
1.6
INTRODUCTION
3
EXTREME
PROPERTIES
OF
HYDROGELS
BY
POLYMER
NETWORK
DESIGN
5
ELASTIC
MODULUS
6
FRACTURE
TOUGHNESS
8
FATIGUE
THRESHOLD
11
MASS
TRANSPORT
12
STRETCHABLE
HYDROGEL
CONDUCTORS
14
MULTISCALE
ORTHOGONAL
DESIGN
14
IMPLEMENTATIONS
OF
THE
ORTHOGONAL
DESIGN
15
ELECTROCHEMICAL
HYDROGEL
BIOSENSORS
18
SELECTIVE
TRANSPORT
DESIGN
OF
HYDROGELS
19
ELECTROCHEMICAL
DESIGN
OF
HYDROGEL-2D
MATERIAL
INTERFACES
20
FLEXIBLE
HYDROGEL
BIOBATTERY
20
MECHANICAL
ENERGY
HARVESTER
21
CHEMICAL
ENERGY
HARVESTERS
22
THERMAL
ENERGY
HARVESTERS
23
CONCLUDING
REMARKS
23
ACKNOWLEDGMENTS
24
REFERENCES
25
2
MULTISCALE
MECHANICS
OF
METAL
NANOWIRE-BASED
STRETCHABLE
ELECTRONICS
37
SHUANG
WU
AND
YONG
ZHU
2.1
2.2
INTRODUCTION
37
METAL
NW-BASED
FLEXIBLE
AND
STRETCHABLE
ELECTRONICS
38
VI
CONTENTS
2.3
2.3.1
2.3.2
2.3.3
2.3.4
2.4
2.4.1
2.4.2
2.4.3
2.4.4
2.5
2.5.1
MECHANICS
OF
INDIVIDUAL
NWS
39
OVERVIEW
OF
MECHANICS
OF
METAL
NWS
40
MECHANICS
OF
SINGLE-CRYSTALLINE
METAL
NWS
40
MECHANICS
OF
BI-TWINNED
METAL
NWS
42
MECHANICS
OF
PENTA-TWINNED
METAL
NWS
43
INTERFACIAL
MECHANICS
OF
THE
NW-POLYMER
INTERFACE
45
CLASSIC
THEORY
OF
SHEAR-LAG
ANALYSIS
45
SHEAR-LAG
ANALYSIS
CONSIDERING
BONDING
MECHANISMS
46
FRACTURE
OF
NWS
DUE
TO
SHEAR
STRESS
TRANSFER
49
ELASTOPLASTIC
ANALYSIS
OF
METAL
NWS
51
MECHANICAL
DESIGN
OF
STRETCHABLE
STRUCTURES
54
BUCKLE-DELAMINATION
ENABLED
STRETCHABLE
SILVER
NANOWIRE
CONDUCTORS
54
2.5.2
A
HIGHLY
SENSITIVE,
STRETCHABLE,
AND
ROBUST
STRAIN
SENSOR
BASED
ON
CRACK
ADVANCING
AND
OPENING
55
2.6
CONCLUDING
REMARKS
58
ACKNOWLEDGMENTS
59
REFERENCES
60
3
LIQUID
METAL-BASED
ELECTRONICS
69
CARMEL
MAJIDI
3.1
3.1.1
3.1.2
3.2
3.2.1
3.2.1.1
3.2.1.2
3.2.2
3.2.3
3.2.4
3.3
3.3.1
3.3.2
3.3.3
3.3.3.1
3.3.3.2
3.3.3.3
3.4
INTRODUCTION
69
GA-BASED
LIQUID
METALS
69
RELEVANT
LITERATURE
71
LM
ARCHITECTURES
71
MICROFLUIDIC
LM
CHANNELS
71
PRINTING-BASED
DEPOSITION
METHODS
72
DIRECT
LM
CASTING
73
LM-COATED
THIN-FILM
METAL
TRACES
73
LM-POLYMER
COMPOSITES
74
PRINTABLE
LM-BASED
INKS
76
MECHANICS
AND
MODELING
76
MICROFLUIDIC
LM
STRAIN
GAUGE
76
MICROFLUIDIC
LM
PRESSURE
SENSOR
77
LM-POLYMER
COMPOSITES
79
ELECTRICAL
PERMITTIVITY
AND
THERMAL
CONDUCTIVITY
79
ELECTROMECHANICAL
COUPLING
79
EFFECTIVE
YOUNG
'
S
MODULUS
80
OPEN
CHALLENGES
AND
FUTURE
DIRECTIONS
81
REFERENCES
82
4
MECHANICS
OF
TWO-DIMENSIONAL
MATERIALS
87
OLUGBENGA
OGUNBIYI
AND
YINGCHAO
YANG
4.1
4.2
INTRODUCTION
87
NANOINDENTATION
METHOD
90
CONTENTS
VII
4.3
4.3.1
4.3.2
4.3.2.1
4.3.2.2
4.3.2.3
4.3.2.4
4.3.2.5
4.3.2.6
4.4
4.4.1
4.5
4.5.1
4.5.1.1
4.5.1.2
4.5.2
4.5.3
4.5.3.1
4.5.3.2
4.5.3.3
4.5.3.4
4.6
4.7
4.7.1
4.7.2
4.8
4.9
4.10
4.10.1
4.10.2
AFM-ENABLED
NANOINDENTATION
93
SETUP
OF
AFM-ENABLED
NANOINDENTATION
93
MECHANICAL
TESTING
OF
2D
MATERIALS
95
MECHANICAL
TESTING
OF
GRAPHENE
95
MECHANICAL
TESTING
OF
GRAPHENE
OXIDE
(GO)
101
MECHANICAL
TESTING
OF
MOS
2
103
MECHANICAL
TESTING
OFWSE
2
103
MECHANICAL
TESTING
OF
H-BN
105
MECHANICAL
TESTING
OF
BLACK
PHOSPHOR
(BP)
107
IN
SITU
INDENTATION
IN
SEM
108
RAMAN
SPECTROSCOPY
110
MICRO-/NANO-MECHANICAL
DEVICES
111
CATEGORY
OF
MICROMECHANICAL
DEVICES
111
THERMAL
ACTUATED
MICROMECHANICAL
DEVICES
111
MICROMECHANICAL
DEVICES
WITH
PUSH-PULL
MECHANISM
112
DEVELOPMENT
OF
THE
"
DRY-TRANSFER
"
TECHNIQUE
113
MECHANICAL
TESTING
OF
2D
MATERIALS
115
MECHANICAL
TESTING
OF
GRAPHENE
115
MECHANICAL
TESTING
OF
REBAR
GRAPHENE
117
MECHANICAL
TESTING
OF
MOSE
2
117
MECHANICAL
TESTING
OF
H-BN
118
PIEZOELECTRIC
TUBE-DRIVEN
TESTING
IN
TEM
120
BULGE
TESTING
121
DEPRESSURIZE
INSIDE
AND
FORM
A
CONCAVE
DEFLECTION
IN
FILM
121
DEPRESSURIZE
OUTSIDE
AND
FORM
A
CONVEX
DEFLECTION
IN
FILM
122
ELECTROSTATIC
FORCE
TRIGGERED
DRUM
STRUCTURE
124
PHONON
DISPERSION
MEASUREMENT
125
SUMMARY
126
MECHANICAL
TESTING
TECHNIQUES
126
MECHANICAL
PROPERTIES
OF
2D
MATERIALS
127
DISCLOSURE
STATEMENT
128
REFERENCES
128
5
MECHANICS
OF
FLEXIBLE
AND
STRETCHABLE
ORGANIC
ELECTRONICS
139
ABDULLAH
AL
SHAFE
AND
BRENDAN
T.
O'CONNOR
5.1
5.2
5.2.1
5.2.2
5.2.3
5.3
5.3.1
5.3.2
5.3.3
INTRODUCTION
139
MECHANICAL
CHARACTERIZATION
METHODS
140
TENSILE
TESTS
141
FRACTURE
TOUGHNESS
143
THERMOMECHANICAL
BEHAVIOR
143
MATERIAL
DESIGN
145
MOLECULAR
WEIGHT
145
BACKBONE
AND
SIDE-CHAIN
DESIGN
146
REGIOREGULARITY
AND
CRYSTALLINITY
147
VIII
CONTENTS
5.3.4
5.3.5
5.3.6
5.3.7
5.4
5.4.1
5.4.2
5.4.3
5.4.4
5.4.5
5.5
5.6
BLOCK
COPOLYMERS
WITH
FLEXIBLE
AND
STRETCHABLE
LINKERS
148
CROSSLINKING
AND
HYDROGEN
BONDING
148
ADDITIVES
AND
BLENDS
150
ORGANIC
PHOTOVOLTAIC
CONSIDERATIONS
152
DEVICE
DESIGN
153
NEUTRAL
AXIS
AND
ULTRATHIN
DEVICES
153
FILM
THICKNESS
153
ELECTRODES
AND
INTERLAYERS
155
INTERFACES
155
STRETCHABLE
DEVICE
ARCHITECTURE
156
APPLICATIONS
156
CONCLUSION
159
ACKNOWLEDGMENTS
159
REFERENCES
160
PART
II
DESIGN
AND
MANUFACTURING
171
6
STRUCTURAL
DESIGN
OF
FLEXIBLE
AND
STRETCHABLE
ELECTRONICS
173
ZHAOQIAN
XIE,
ZICHEN
ZHAO,
AND
RAUDEL
AVILA
6.1
6.2
6.2.1
6.2.2
6.2.2.1
6.2.2.2
6.2.2.3
6.3
6.3.1
6.3.2
6.3.3
6.4
6.4.1
6.4.2
INTRODUCTION
173
DESIGN
OF
PLANAR
STRETCHABLE
AND
FLEXIBLE
STRUCTURES
174
WAVE/WRINKLE
STRUCTURE
DESIGN
174
ISLAND-BRIDGE
STRUCTURE
DESIGN
177
STRAIGHT
INTERCONNECTING
ISLAND-BRIDGE
STRUCTURE
178
SERPENTINE
INTERCONNECTING
ISLAND-BRIDGE
STRUCTURE
180
FRACTAL-INSPIRED
INTERCONNECTING
ISLAND-BRIDGE
STRUCTURE
186
DESIGN
OF
THREE-DIMENSIONAL
FLEXIBLE
ELECTRONIC
STRUCTURES
189
HELICAL
DESIGN
189
ORIGAMI-INSPIRED
DESIGN
190
KIRIGAMI-INSPIRED
DESIGN
192
DESIGN
OF
PROTECTIVE
STRUCTURES
FOR
FLEXIBLE
ELECTRONIC
DEVICES
193
STRAIN
LIMITED
STRUCTURE
DESIGN
193
STRAIN
ISOLATION
STRUCTURE
DESIGN
195
REFERENCES
202
7
LASER-BASED
FABRICATION
PROCESS
DEVELOPMENT
FOR
FLEXIBLE
AND
STRETCHABLE
ELECTRONICS
207
JUNG
JAE
PARK,
MINWOO
KIM,
AND
SEUNG
HWAN
KO
7.1
7.2
7.3
7.4
INTRODUCTION
207
REPRESENTATIVE
LASER-BASED
FABRICATION
PROCESS
208
APPLICATIONS
BASED
ON
LASER
FABRICATION
211
PERSPECTIVES
AND
CONCLUSION
225
AUTHOR
CONTRIBUTIONS
226
REFERENCES
226
CONTENTS
IX
8
ELECTROSPINNING
MANUFACTURING
OF
STRETCHABLE
ELECTRONICS
235
YINHUI
LI,
KAN
LI,
YUNLEI
ZHOU,
AND
YONGAN
HUANG
8.1
8.2
8.2.1
8.2.2
8.3
8.3.1
8.3.2
8.4
8.4.1
8.4.2
8.4.3
8.5
BACKGROUND
235
HIGH-PRECISION
MANUFACTURING
236
INKJET PRINTING
236
EHD
PRINTING
239
ELECTROSPINNING
STRETCHABLE
STRUCTURE
243
STRETCHABLE
NANOFIBER
MATS
243
STRETCHABLE
YARNS
AND
FABRICS
244
APPLICATION
IN
STRETCHABLE
ELECTRONICS
247
STRAIN
AND
PRESSURE
SENSOR
247
ORGANIC
FIELD-EFFECT
TRANSISTORS
248
OPTOELECTRONIC
DEVICES
252
CONCLUSIONS
254
REFERENCES
254
9
MECHANICS-GUIDED
3D
ASSEMBLY
OF
FLEXIBLE
ELECTRONICS
265
GUOQUAN
LUO,
JIANZHONG
ZHAO,
XU
CHENG,
AND
YIHUI
ZHANG
9.1
9.2
9.2.1
9.2.1.1
9.2.1.2
9.2.1.3
9.2.2
9.2.2.1
9.2.2.2
9.2.3
9.2.3.1
9.2.3.2
9.3
9.3.1
9.3.1.1
9.3.1.2
9.3.1.3
9.3.1.4
9.3.2
9.3.2.1
9.3.2.2
9.3.3
9.3.3.1
9.3.3.2
9.4
9.4.1
INTRODUCTION
265
DESIGN
STRATEGIES
OF
MECHANICS-GUIDED
ASSEMBLY
266
2D
PRECURSOR
DESIGNS
267
ORIGAMI/KIRIGAMI
DESIGN
STRATEGY
267
MULTILAYER
AND
MULTILEVEL
DESIGN
STRATEGY
267
DESIGN
STRATEGY
BASED
ON
SPATIAL
STIFFNESS
CONTROL
269
ELASTOMER
SUBSTRATE
DESIGNS
270
ENGINEERED
PLANAR
SUBSTRATE
DESIGN
STRATEGY
270
CURVILINEAR
SUBSTRATE
DESIGN
STRATEGY
272
STRATEGY
OF
LOADING
CONDITIONS
272
MECHANICAL
LOADING
STRATEGY
272
ELECTRIC/MAGNE
TIC-FIELD
ASSISTED
LOADING
STRATEGY
274
MECHANICS
MODELING
AND
ANALYSES
OF
THE
3D
ASSEMBLY
275
BUCKLING
ANALYSIS
OF
2D
PRECURSORS
275
STRAIGHT
RIBBONS
275
HELICAL
STRUCTURES
277
FRAME
STRUCTURES
278
2D
CURVED
RIBBONS
278
INTERFACIAL
ADHESION
IN
THE
MECHANICS-GUIDED
ASSEMBLY
279
DESIGN
DIAGRAMS
OF
DELAMINATION
STATES
279
CONTROLLED
INTERFACE
DELAMINATION
281
LOADING-PATH
CONTROLLED
ASSEMBLY
282
RECONFIGURABLE
CROSS-SHAPED
STRUCTURES
282
RECONFIGURABLE
STRUCTURES
HARNESSING
INTERFACE
MECHANICS
282
APPLICATIONS
OF
3D
FLEXIBLE
ELECTRONICS
284
FLEXIBLE
SENSORS
284
CONTENTS
9.4.2
9.4.3
9.4.4
9.5
TUNABLE
ELECTROMAGNETIC
DEVICES
284
BIOMEDICAL
DEVICES
286
FLEXIBLE
ROBOTICS
286
CONCLUDING
REMARKS
287
REFERENCES
288
10
HARNESSING
WRINKLING
AND
BUCKLING
INSTABILITIES
FOR
STRETCHABLE
DEVICES
AND
HEALTHCARE
293
YAO
ZHAO,
FANGJIE
QI,
HAOZE
SUN,
YANBIN
LI,
HAITAO
QING,
AND
JIE
YIN
10.1
10.2
10.2.1
10.2.2
10.2.2.1
10.2.2.2
10.2.2.3
10.2.2.4
10.2.2.5
10.3
10.3.1
10.3.2
10.3.3
10.4
10.4.1
10.4.2
10.5
INTRODUCTION
293
STRUCTURAL
DESIGNS
AND
MECHANICS
294
STRUCTURAL
DESIGNS
FOR
BUCKLING-ENABLED
STRETCHABILITY
294
MECHANICS
OF
WRINKLING
AND
BUCKLING
296
COMPRESSION-INDUCED
WRINKLING
297
COMPRESSION-INDUCED
CONSTRAINED
BUCKLE-DELAMINATION
298
COMPRESSION-INDUCED
SPONTANEOUS
BUCKLE-DELAMINATION
298
TENSION-INDUCED
BUCKLING
IN
SERPENTINE
STRUCTURES
299
TENSION-INDUCED
BUCKLING
IN
KIRIGAMI
STRUCTURES
300
APPLICATIONS
IN
STRETCHABLE
DEVICES
300
STRETCHABLE
SENSORS
300
STRETCHABLE
BATTERIES
302
OTHER
STRETCHABLE
ELECTRONICS
304
APPLICATIONS
IN
HEALTHCARE
306
BIOSENSORS
306
BIOLOGICAL
INTERFACES
308
CONCLUSION
AND
OUTLOOK
311
ACKNOWLEDGMENTS
311
REFERENCES
311
PART
III
APPLICATIONS
319
11
SPHERICAL
INDENTATION
BEHAVIOR
OF
SOFT
ELECTRONICS
321
CHANGXIAN
WANG,
ZEQUN
CUI,
AND
XIAODONG
CHEN
11.1
11.1.1
11.1.2
11.1.3
11.2
SPHERICAL
INDENTATION
OF
THE
SEMI-INFINITE
SOLID
321
GENERAL
SOLUTION
FOR
ELASTIC
SOLID
WITH
DISPLACEMENT
FUNCTION
321
INDENTATION
BEHAVIOR
OF
REVOLUTION
INDENTER
325
INDENTATION
BEHAVIOR
OF
SPHERICAL
INDENTER
327
APPLICATIONS
IN
A
FORCE-SOFTNESS
BIMODAL
SENSOR
ARRAY
FOR
HUMAN
BODY
FEATURE
IDENTIFICATION
328
11.2.1
11.2.1.1
11.2.1.2
11.2.2
11.2.3
DESIGN
OF
THE
SPHERICAL
INDENTER-BASED
FORCE-SOFTNESS
SENSOR
329
THE
FIRST
STAGE
331
THE
SECOND
STAGE
332
INTEGRATION
OF
THE
FORCE-SOFTNESS
SENSOR
ARRAY:
TACTILE
GLOVE
334
APPLICATIONS
IN
BODY
FEATURE
IDENTIFICATION
336
CONTENTS
XI
11.3
APPLICATIONS
IN
A
SELF-LOCKED
YOUNG
'
S
MODULUS
SENSOR
FOR
QUANTIFYING
THE
SOFTNESS
OF
SWOLLEN
TISSUES
IN
THE
CLINIC
336
11.3.1
11.3.2
DESIGN
OF
THE
FINGERTIP
MODULUS
SENSOR
337
APPLICATIONS
IN
SOFTNESS
MEASUREMENT
OF
SWOLLEN
TISSUES
IN
THE
CLINIC
340
11.4
CONCLUSIONS
343
REFERENCES
343
12
MECHANICS
OF
WET
ADHESION
345
JIAWEI
YANG
AND
RUOBING
BAI
12.1
12.2
12.3
12.3.1
12.3.1.1
12.3.1.2
12.3.1.3
12.3.1.4
12.3.1.5
12.3.1.6
12.3.1.7
12.3.1.8
12.3.1.9
12.3.2
12.3.3
12.4
12.5
12.5.1
12.5.2
12.5.3
12.5.4
12.5.5
12.6
INTRODUCTION
345
CHARACTERIZATION
OF
ADHESION
346
GENERAL
PRINCIPLES
FOR
STRONG
WET
ADHESION
347
CHEMISTRY
OF
BONDS
349
STATIC
COVALENT
BONDS
349
DYNAMIC
COVALENT
BONDS
349
IONIC
BONDS
349
HYDROGEN
BONDS
350
HYDROPHOBIC
INTERACTION
350
X-N
STACK
351
DIPOLE-DIPOLE
INTERACTION
351
HOST-GUEST
INTERACTION
351
CATECHOL
CHEMISTRY
351
TOPOLOGY
OF
CONNECTION
351
MECHANICS
OF
DISSIPATION
352
METHODS
FOR
STRONG
WET
ADHESION
354
MECHANICS
OF
WET
INTERFACES
357
ADHESIVE
FAILURE
AND
COHESIVE
FAILURE
357
FRACTOCOHESIVE
LENGTH
AND
SIZE-DEPENDENCY
358
RATE
DEPENDENCY
359
FATIGUE
360
STRETCHABLE
ADHESION
361
SUMMARY
AND
OUTLOOK
362
REFERENCES
363
13
ELECTROMECHANICS
OF
SOFT
RESISTIVE
AND
CAPACITIVE
TACTILE
SENSORS
373
ZHENGJIE
LI,
SANGJUN
KIM,
ZHELIANG
WANG,
ZHENGTAO
ZHU,
AND
NANSHU
LU
13.1
13.1.1
13.1.2
13.2
13.2.1
13.2.2
INTRODUCTION
373
OVERVIEW
OF
TACTILE
SENSORS
373
BOTTLENECKS
OF
SOFT
RESISTIVE
AND
CAPACITIVE
TACTILE
SENSORS
376
RESISTIVE
TACTILE
SENSORS
378
INTRODUCTION OF
RESISTIVE
TACTILE
SENSORS
378
RESISTIVE
TACTILE
SENSORS
BASED
ON
MICROSTRUCTURED
CONTACT
379
XII
L
CONTENTS
INDEX
473
13.2.3
RESISTIVE
TACTILE
SENSORS
BASED
ON
BULK
CONDUCTIVE
NANOCOMPOSITES
385
13.2.4
13.2.5
13.3
13.3.1
13.3.2
13.3.3
13.3.4
13.4
13.4.1
13.4.2
13.5
13.5.1
13.5.2
RESISTIVE
TACTILE
SENSORS
BASED
ON
POROUS
CONDUCTIVE
MATERIALS
392
STRETCHABLE
RESISTIVE
TACTILE
SENSORS
397
CAPACITIVE
TACTILE
SENSORS
399
INTRODUCTION
OF
CAPACITIVE
TACTILE
SENSORS
399
CAPACITIVE
TACTILE
SENSORS
WITH
ENGINEERED
DIELECTRICS
401
CAPACITIVE
TACTILE
SENSORS
WITH
ENGINEERED
ELECTRODES
408
STRETCHABLE
CAPACITIVE
TACTILE
SENSORS
413
RESISTIVE-CAPACITIVE
HYBRID
RESPONSE
TACTILE
SENSORS
415
FLEXIBLE
HYBRID
RESPONSE
TACTILE
SENSORS
415
STRETCHABLE
HYBRID
RESPONSE
TACTILE
SENSORS
417
CONCLUSION
AND
OUTLOOK
418
SUMMARY
OF
THE
EXISTING
ACHIEVEMENTS
418
REMAINING
CHALLENGES
AND
FUTURE
PROSPECTS
419
ACKNOWLEDGMENTS
420
REFERENCES
420
14
ACTIVE
MECHANICAL
HAPTICS
CONSTRUCTED
WITH
CURVED
ORIGAMI
431
ZHUANG
ZHANG
AND
HANGING
JIANG
14.1
14.2
14.3
14.3.1
14.3.2
14.3.3
14.4
14.5
14.6
14.7
14.8
14.9
INTRODUCTION
431
STIFFNESS
TUNING
VIA
CURVED
ORIGAMI
432
THEORETICAL
MODELING
AND
ANALYSIS
OF
CURVED
ORIGAMI
434
GEOMETRIC
MODELING
434
MECHANICS
MODELING
436
ACTIVE
TUNING
437
CLOSED-LOOP
DESIGN
AND
SYSTEM
INTEGRATION
OF
ORIGAMI
438
IN-HAND
HAPTIC
DEVICE
440
STIFFNESS
PERCEPTION
VIA
ACTIVE
PRESSING
443
BODY-CENTERED
STEPPING
DEVICE
444
WHOLE-BODY
STIFFNESS
PERCEPTIONS
447
DISCUSSION
448
REFERENCES
450
15
MECHANICS
OF
TRANSIENT
ELECTRONICS
453
ANKAN
DUTTA
AND
HUANYU
CHENG
15.1
15.2
15.3
15.4
15.5
INTRODUCTION
453
HYDROLYSIS
OF
SEMICONDUCTING
MATERIALS
455
MODEL
OF
REACTIVE
DIFFUSION
FOR
TRANSIENT
MATERIALS
457
DISSOLUTION
OF
THE
DEVICE
WITH
BI-LAYERED
STRUCTURES
461
CONCLUSION
467
ACKNOWLEDGMENTS
468
REFERENCES
468 |
| any_adam_object | 1 |
| author2 | Zhu, Yong Lu, Nanshu |
| author2_role | edt edt |
| author2_variant | y z yz n l nl |
| author_GND | (DE-588)1345710801 (DE-588)1348727454 |
| author_facet | Zhu, Yong Lu, Nanshu |
| building | Verbundindex |
| bvnumber | BV050080601 |
| ctrlnum | (DE-599)DNB1325416045 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV050080601 |
| illustrated | Illustrated |
| indexdate | 2024-12-11T23:00:10Z |
| institution | BVB |
| institution_GND | (DE-588)16179388-5 |
| isbn | 3527352198 9783527352197 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-035417851 |
| open_access_boolean | |
| owner | DE-29T |
| owner_facet | DE-29T |
| physical | xiv, 482 Seiten Illustrationen 25 cm, 666 g |
| publishDate | 2025 |
| publishDateSearch | 2024 |
| publishDateSort | 2024 |
| publisher | WILEY VCH |
| record_format | marc |
| spelling | Mechanics of flexible and stretchable electronics edited by Yong Zhu and Nanshu Lu Weinheim, Germany WILEY VCH [2025] xiv, 482 Seiten Illustrationen 25 cm, 666 g txt rdacontent n rdamedia nc rdacarrier Biegsamkeit (DE-588)7633500-8 gnd rswk-swf Dehngrenze (DE-588)4149003-4 gnd rswk-swf Elektronisches Gerät (DE-588)4127635-8 gnd rswk-swf Elastischer Werkstoff (DE-588)4151686-2 gnd rswk-swf EEB0: Electronic Materials EEB0: Elektronische Materialien Electrical & Electronics Engineering Electronic Materials Elektronische Materialien Elektrotechnik u. Elektronik Festkörpermechanik Flexible electronics ME40: Festkörpermechanik ME40: Solid Mechanics MS40: Electronic Materials MS40: Elektronische Materialien Maschinenbau Materials Science Materialwissenschaften Mechanical Engineering Solid Mechanics architecture material bio-electronic adhesive composite hydrogel kirigami liquid metal nanomaterial organic semiconductor origami rigid electronics soft robot stretchable electronics wearable health monitoring Biegsamkeit (DE-588)7633500-8 s Dehngrenze (DE-588)4149003-4 s Elastischer Werkstoff (DE-588)4151686-2 s Elektronisches Gerät (DE-588)4127635-8 s DE-604 Zhu, Yong (DE-588)1345710801 edt Lu, Nanshu (DE-588)1348727454 edt Wiley-VCH (DE-588)16179388-5 pbl Erscheint auch als Online-Ausgabe Mechanics of Flexible and Stretchable Electronics 1. Auflage Weinheim : Wiley-VCH, 2024 Online-Ressource, 499 Seiten B:DE-101 application/pdf https://d-nb.info/1325416045/04 Inhaltsverzeichnis X:MVB http://www.wiley-vch.de/publish/dt/books/ISBN978-3-527-35219-7/ DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=035417851&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis 1\p dnb 20241107 DE-101 https://d-nb.info/provenance/plan#dnb 2\p dnb 20241107 DE-101 https://d-nb.info/provenance/plan#dnb |
| spellingShingle | Mechanics of flexible and stretchable electronics Biegsamkeit (DE-588)7633500-8 gnd Dehngrenze (DE-588)4149003-4 gnd Elektronisches Gerät (DE-588)4127635-8 gnd Elastischer Werkstoff (DE-588)4151686-2 gnd |
| subject_GND | (DE-588)7633500-8 (DE-588)4149003-4 (DE-588)4127635-8 (DE-588)4151686-2 |
| title | Mechanics of flexible and stretchable electronics |
| title_auth | Mechanics of flexible and stretchable electronics |
| title_exact_search | Mechanics of flexible and stretchable electronics |
| title_full | Mechanics of flexible and stretchable electronics edited by Yong Zhu and Nanshu Lu |
| title_fullStr | Mechanics of flexible and stretchable electronics edited by Yong Zhu and Nanshu Lu |
| title_full_unstemmed | Mechanics of flexible and stretchable electronics edited by Yong Zhu and Nanshu Lu |
| title_short | Mechanics of flexible and stretchable electronics |
| title_sort | mechanics of flexible and stretchable electronics |
| topic | Biegsamkeit (DE-588)7633500-8 gnd Dehngrenze (DE-588)4149003-4 gnd Elektronisches Gerät (DE-588)4127635-8 gnd Elastischer Werkstoff (DE-588)4151686-2 gnd |
| topic_facet | Biegsamkeit Dehngrenze Elektronisches Gerät Elastischer Werkstoff |
| url | https://d-nb.info/1325416045/04 http://www.wiley-vch.de/publish/dt/books/ISBN978-3-527-35219-7/ http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=035417851&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT zhuyong mechanicsofflexibleandstretchableelectronics AT lunanshu mechanicsofflexibleandstretchableelectronics AT wileyvch mechanicsofflexibleandstretchableelectronics |
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