Fundamentals of lead-free solder interconnect technology: from microstructures to reliability
Gespeichert in:
Weitere Verfasser: | |
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Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
New York, NY [u.a.]
Springer
2015
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Schlagworte: | |
Online-Zugang: | BHS01 BTU01 FAB01 FAW01 FHA01 FHI01 FHN01 FHR01 FKE01 FRO01 FWS01 FWS02 UBY01 Volltext |
Beschreibung: | 1 Online-Ressource |
ISBN: | 9781461492665 |
DOI: | 10.1007/978-1-4614-9266-5 |
Internformat
MARC
LEADER | 00000nmm a2200000 c 4500 | ||
---|---|---|---|
001 | BV042225532 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 141205s2015 |||| o||u| ||||||eng d | ||
020 | |a 9781461492665 |c Online |9 978-1-4614-9266-5 | ||
024 | 7 | |a 10.1007/978-1-4614-9266-5 |2 doi | |
035 | |a (OCoLC)897554157 | ||
035 | |a (DE-599)BSZ420320415 | ||
040 | |a DE-604 |b ger | ||
041 | 0 | |a eng | |
049 | |a DE-634 |a DE-Aug4 |a DE-1043 |a DE-1046 |a DE-859 |a DE-92 |a DE-898 |a DE-863 |a DE-862 |a DE-573 |a DE-B768 |a DE-861 |a DE-706 | ||
050 | 0 | |a TK7800-8360 | |
050 | 0 | |a TK7874-7874.9 | |
082 | 0 | |a 621.381 | |
084 | |a ZN 4125 |0 (DE-625)157354: |2 rvk | ||
245 | 1 | 0 | |a Fundamentals of lead-free solder interconnect technology |b from microstructures to reliability |c Tae-Kyu Lee ... |
264 | 1 | |a New York, NY [u.a.] |b Springer |c 2015 | |
300 | |a 1 Online-Ressource | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
650 | 4 | |a Ingenieurwissenschaften | |
650 | 4 | |a Electronics | |
650 | 4 | |a Systems engineering | |
650 | 4 | |a Optical materials | |
650 | 4 | |a Engineering | |
700 | 1 | |a Lee, Tae-Kyu |4 edt | |
776 | 0 | 8 | |i Erscheint auch als |n Druckausgabe |z 978-1-4614-9265-8 |
856 | 4 | 0 | |u https://doi.org/10.1007/978-1-4614-9266-5 |x Verlag |3 Volltext |
912 | |a ZDB-2-ENG | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-027663946 | ||
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l BHS01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l BTU01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l FAB01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l FAW01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l FHA01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l FHI01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l FHN01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l FHR01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l FKE01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l FRO01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l FWS01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l FWS02 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-1-4614-9266-5 |l UBY01 |p ZDB-2-ENG |x Verlag |3 Volltext |
Datensatz im Suchindex
DE-BY-FWS_katkey | 541462 |
---|---|
_version_ | 1806179182665793536 |
any_adam_object | |
author2 | Lee, Tae-Kyu |
author2_role | edt |
author2_variant | t k l tkl |
author_facet | Lee, Tae-Kyu |
building | Verbundindex |
bvnumber | BV042225532 |
callnumber-first | T - Technology |
callnumber-label | TK7800-8360 |
callnumber-raw | TK7800-8360 TK7874-7874.9 |
callnumber-search | TK7800-8360 TK7874-7874.9 |
callnumber-sort | TK 47800 48360 |
callnumber-subject | TK - Electrical and Nuclear Engineering |
classification_rvk | ZN 4125 |
collection | ZDB-2-ENG |
ctrlnum | (OCoLC)897554157 (DE-599)BSZ420320415 |
dewey-full | 621.381 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381 |
dewey-search | 621.381 |
dewey-sort | 3621.381 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
doi_str_mv | 10.1007/978-1-4614-9266-5 |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02600nmm a2200565 c 4500</leader><controlfield tag="001">BV042225532</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">141205s2015 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781461492665</subfield><subfield code="c">Online</subfield><subfield code="9">978-1-4614-9266-5</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-1-4614-9266-5</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)897554157</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BSZ420320415</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-634</subfield><subfield code="a">DE-Aug4</subfield><subfield code="a">DE-1043</subfield><subfield code="a">DE-1046</subfield><subfield code="a">DE-859</subfield><subfield code="a">DE-92</subfield><subfield code="a">DE-898</subfield><subfield code="a">DE-863</subfield><subfield code="a">DE-862</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-B768</subfield><subfield code="a">DE-861</subfield><subfield code="a">DE-706</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7800-8360</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7874-7874.9</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4125</subfield><subfield code="0">(DE-625)157354:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Fundamentals of lead-free solder interconnect technology</subfield><subfield code="b">from microstructures to reliability</subfield><subfield code="c">Tae-Kyu Lee ...</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">New York, NY [u.a.]</subfield><subfield code="b">Springer</subfield><subfield code="c">2015</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Ingenieurwissenschaften</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Systems engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lee, Tae-Kyu</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druckausgabe</subfield><subfield code="z">978-1-4614-9265-8</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-027663946</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">BHS01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">FAB01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">FHA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">FHR01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">FKE01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">FRO01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">FWS01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">FWS02</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-9266-5</subfield><subfield code="l">UBY01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
id | DE-604.BV042225532 |
illustrated | Not Illustrated |
indexdate | 2024-08-01T12:04:56Z |
institution | BVB |
isbn | 9781461492665 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027663946 |
oclc_num | 897554157 |
open_access_boolean | |
owner | DE-634 DE-Aug4 DE-1043 DE-1046 DE-859 DE-92 DE-898 DE-BY-UBR DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-573 DE-B768 DE-861 DE-706 |
owner_facet | DE-634 DE-Aug4 DE-1043 DE-1046 DE-859 DE-92 DE-898 DE-BY-UBR DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-573 DE-B768 DE-861 DE-706 |
physical | 1 Online-Ressource |
psigel | ZDB-2-ENG |
publishDate | 2015 |
publishDateSearch | 2015 |
publishDateSort | 2015 |
publisher | Springer |
record_format | marc |
spellingShingle | Fundamentals of lead-free solder interconnect technology from microstructures to reliability Ingenieurwissenschaften Electronics Systems engineering Optical materials Engineering |
title | Fundamentals of lead-free solder interconnect technology from microstructures to reliability |
title_auth | Fundamentals of lead-free solder interconnect technology from microstructures to reliability |
title_exact_search | Fundamentals of lead-free solder interconnect technology from microstructures to reliability |
title_full | Fundamentals of lead-free solder interconnect technology from microstructures to reliability Tae-Kyu Lee ... |
title_fullStr | Fundamentals of lead-free solder interconnect technology from microstructures to reliability Tae-Kyu Lee ... |
title_full_unstemmed | Fundamentals of lead-free solder interconnect technology from microstructures to reliability Tae-Kyu Lee ... |
title_short | Fundamentals of lead-free solder interconnect technology |
title_sort | fundamentals of lead free solder interconnect technology from microstructures to reliability |
title_sub | from microstructures to reliability |
topic | Ingenieurwissenschaften Electronics Systems engineering Optical materials Engineering |
topic_facet | Ingenieurwissenschaften Electronics Systems engineering Optical materials Engineering |
url | https://doi.org/10.1007/978-1-4614-9266-5 |
work_keys_str_mv | AT leetaekyu fundamentalsofleadfreesolderinterconnecttechnologyfrommicrostructurestoreliability |