Showing 1 - 13 results of 13 for search 'Lau, John H.', query time: 0.04s Refine Results
In addition to media from the THWS, media from other Bavarian libraries are also displayed.
These are marked with the "Interlibrary loan" label and can be ordered by clicking on them.
  1. 1
    Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

    Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by Lau, John H.

    Published 2024
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  2. 2
    Semiconductor Advanced Packaging

    Semiconductor Advanced Packaging by Lau, John H.

    Published 2021
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  3. 3
    Assembly and Reliability of Lead-Free Solder Joints

    Assembly and Reliability of Lead-Free Solder Joints by Lau, John H., Lee, Ning-Cheng

    Published 2020
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  4. 4
    Fan-Out Wafer-Level Packaging

    Fan-Out Wafer-Level Packaging by Lau, John H.

    Published 2018
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  5. 5
    Chiplet Design and Heterogeneous Integration Packaging

    Chiplet Design and Heterogeneous Integration Packaging by Lau, John H.

    Published 2023
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  6. 6
    Heterogeneous Integrations

    Heterogeneous Integrations by Lau, John H.

    Published 2019
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  7. 7
    Flip chip technologies

    Flip chip technologies by Lau, John H.

    Published 1996
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  8. 8
    Reliability of RoHS-Compliant 2D and 3D IC interconnects

    Reliability of RoHS-Compliant 2D and 3D IC interconnects by Lau, John H.

    Published 2011
    Indexes
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  9. 9
    Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies

    Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies by Lau, John H.

    Published 2000
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  10. 10
    Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

    Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies by Lau, John H., Pao, Yi-Hsin

    Published 1997
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  11. 11
    Assembly and reliability of lead-free solder joints

    Assembly and reliability of lead-free solder joints by Lau, John H., Lee, Ning-Cheng

    Published 2020
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  12. 12
    Solder Joint Reliability Theory and Applications

    Solder Joint Reliability Theory and Applications

    Published 1991
    Other Authors: “…Lau, John H.…”
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  13. 13
    Thermal Stress and Strain in Microelectronics Packaging

    Thermal Stress and Strain in Microelectronics Packaging

    Published 1993
    Other Authors: “…Lau, John H.…”
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