Beth Keser

Beth Keser is an American electronics engineer specializing in electronic packaging, and especially wafer-level packaging. She is head of Packaging & Systems Technology for Intel, and president of the International Microelectronics and Packaging Society. Provided by Wikipedia
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  1. 1
    Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package

    Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package

    Published 2022
    Other Authors: “…Keser, Beth…”
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  2. 2
    Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package

    Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package

    Published 2022
    Other Authors: “…Keser, Beth 1971-…”
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  3. 3
    Advances in embedded and fan-out wafer-level packaging technologies

    Advances in embedded and fan-out wafer-level packaging technologies

    Published 2019
    Other Authors: “…Keser, Beth 1971-…”
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