Silicon microchannel heat sinks: theories and phenomena
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Berlin [u.a.]
Springer
2004
|
| Schriftenreihe: | Microtechnology and MEMS
Physics and astronomy online library |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | IX, 140 S. Ill., graph. Darst. |
| ISBN: | 3540401814 |
Internformat
MARC
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| 100 | 1 | |a Zhang, Lian |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Silicon microchannel heat sinks |b theories and phenomena |c L. Zhang, K.E. Goodson, T.W. Kenny |
| 264 | 1 | |a Berlin [u.a.] |b Springer |c 2004 | |
| 300 | |a IX, 140 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
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| 700 | 1 | |a Goodson, Kenneth E. |e Verfasser |4 aut | |
| 700 | 1 | |a Kenny, Thomas William |e Verfasser |4 aut | |
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Datensatz im Suchindex
| _version_ | 1804130375855767552 |
|---|---|
| adam_text | CONTENTS 1
INTRODUCTION..................................................................
.............................1 1.1 OVERVIEW: MOORE*S LAW AND IC
COOLING..............................................1 1.2
ELECTROOSMOTIC MICRO
COOLERS..............................................................7
1.2.1 ELECTROOSMOTIC PUMPS
................................................................8 1.2.2
TWO-PHASE MICROCHANNEL HEAT
SINKS..........................................9 1.3 SCOPE OF THE
BOOK..............................................................................10
2 TWO-PHASE MICROCHANNEL HEAT SINKS: PROBLEMS AND CHALLENGES
..........13 2.1 BACKGROUND: FORCED CONVECTIVE INTERNAL
FLOW...................................13 2.1.1 INTERNAL FLOW IN
MACROSCALE CHANNELS ......................................13 2.1.2
TWO-PHASE FLOW IN MICROCHANNELS
...........................................14 2.2 AN INSTRUMENTED
MICROCHANNEL HEAT SINK ..........................................16
2.2.1 INSTRUMENTED HEAT SINK
DESIGN.................................................16 2.2.2 DEVICE
FABRICATION
...................................................................18
2.3 EXPERIMENTAL RESULTS
.........................................................................20
2.3.1 EXPERIMENTAL
SYSTEM................................................................20
2.3.2 THERMOMETER
CALIBRATION..........................................................22
2.3.3 SINGLE-PHASE FORCED CONVECTIVE
COOLING..................................24 2.3.4 TWO-PHASE FORCED
CONVECTIVE COOLING.....................................25 2.4 PROBLEMS
AND CHALLENGES
...................................................................30 3
A THERMAL EXPERIMENTAL SYSTEM WITH FREESTANDING MICROCHANNELS.....33
3.1 THERMAL ISOLATION OF MICROCHANNELS*DESIGN CONCEPT
.......................33 3.2 HEAT DISTRIBUTION*THERMAL RESISTANCE
MODEL...................................35 3.3 THERMOMETRY*WALL
TEMPERATURE MEASUREMENT................................38 3.3.1 DOPED
SILICON RESISTOR AS BOTH HEATER AND THERMOMETERS ........38 3.3.2
ALUMINUM HEATERS AND DOPED SILICON THERMOMETERS ...............40 3.3.3
DOPED POLY SILICON HEATERS AND THERMOMETERS.........................42
3.3.4 OTHER
THERMOMETRY..................................................................43
3.4 EXPERIMENTAL AND DATA ACQUISITION
SYSTEMS.......................................45 3.4.1 EXPERIMENTAL
SYSTEM CONFIGURATION .........................................45 3.4.2
DATA ACQUISITION SYSTEM CONFIGURATION
....................................47 3.5 FABRICATION OF INSTRUMENTED
SINGLE-CHANNEL DEVICES...........................52 VIII CONTENTS
4 MEASUREMENTS AND MODELING OF TWO-PHASE FLOW IN MICROCHANNELS .....55
4.1 REVIEW OF PREVIOUS
RESEARCH.............................................................55
4.2 DESIGN PARAMETERS OF TEST DEVICES
....................................................56 4.3 TWO-PHASE
FLOW
MEASUREMENTS.........................................................59
4.3.1 MEASUREMENT ERROR ANALYSIS
....................................................59 4.3.2
MULTI-CHANNEL DEVICE
MEASUREMENTS........................................59 4.3.3
SINGLE-CHANNEL DEVICE
MEASUREMENTS.......................................62 4.3.4 FLOW
PATTERNS
...........................................................................65
4.4 MODELING OF TWO-PHASE INTERNAL FLOW
...............................................66 4.4.1 HEAT LOSS
ESTIMATION
...............................................................66 4.4.2
ONE-DIMENSIONAL FINITE VOLUME MODEL FOR TWO-PHASE INTERNAL
FLOW....................................................68 4.5
DISCUSSION
.........................................................................................70
5 BOILING REGIMES AND TRANSIENT SIGNALS ASSOCIATED WITH THE PHASE
CHANGE ..........................................................73
5.1 BACKGROUND: BOILING REGIMES IN LARGE AND SMALL
CHANNELS...............73 5.1.1 NUCLEATE BOILING IN LARGE, HORIZONTAL
TUBES ............................73 5.1.2 BOILING IN
MICROCHANNELS*PREVIOUS RESEARCH..........................73 5.2 DESIGN
PARAMETERS OF TEST DEVICES
....................................................75 5.3 VISUALIZATION
OF NUCLEATE BOILING IN MICROCHANNELS ...........................77 5.3.1
BUBBLE NUCLEATION IN MICROCHANNELS
........................................78 5.3.2 TWO-PHASE FLOW REGIMES
IN MICROCHANNELS.............................80 5.4 TRANSIENT
CHARACTERISTICS OF THE TWO-PHASE FLOW................................84
5.4.1 TRANSIENT PRESSURE FLUCTUATIONS DURING THE PHASE CHANGE.........84
5.4.2 PRESSURE DROP DURING THE PHASE
CHANGE...................................91 5.4.3 TRANSIENT WALL
SUPERHEAT DURING THE PHASE CHANGE..................93 5.5 DISCUSSION
.........................................................................................93
6 ENHANCED NUCLEATE BOILING IN MICROCHANNELS
........................................95 6.1 BACKGROUND: BUBBLE
NUCLEATION IN MICROCHANNELS .............................95 6.1.1
*EVAPORATING SPACE* HYPOTHESIS
..............................................95 6.1.2 HETEROGENEOUS
NUCLEATION ON A SOLID SURFACE ...........................96 6.2
ENHANCED-WALL MICROCHANNEL TEST DEVICES
........................................98 6.2.1 NUCLEATION SITES IN
PLAIN-WALL CHANNELS....................................98 6.2.2 DESIGN
PARAMETERS OF TEST DEVICES...........................................99
6.3 PHASE CHANGE IN SILICON CHANNELS WITH PLAIN WALLS
......................... 102 6.3.1 PLASMA ETCH INDUCED SURFACE
ROUGHNESS ................................ 102 6.3.2 PLASMA ETCHED
SILICON CHANNELS WITH DI WATER ...................... 103 6.3.3 PLASMA
ETCHED SILICON CHANNELS WITH SURFACTANT..................... 106 6.3.4
BOILING REGIME CHART FOR PLAIN-WALL CHANNELS........................ 108
6.4 PHASE CHANGE IN SILICON CHANNELS WITH ENHANCED WALLS
.................. 110 6.4.1 NUCLEATION ON THE ENHANCED
SURFACE....................................... 110 6.4.2 WALL
TEMPERATURE MEASUREMENT DURING THE PHASE CHANGE ..... 111 6.4.3 BOILING
REGIME CHART FOR ENHANCED-WALL CHANNELS................. 115 6.5
DISCUSSION
.......................................................................................
116 CONTENTS IX 7
CONCLUSIONS...................................................................
.........................119 7.1 PHASE CHANGE IN SUB-150 µ M DIAMETER
MICROCHANNELS....................119 7.1.1 BUBBLE NUCLEATION
MECHANISMS..............................................119 7.1.2
TWO-PHASE FLOW REGIMES IN MICROCHANNELS ...........................120
7.1.3 TRANSIENT CHARACTERISTICS
........................................................121 7.1.4
TWO-PHASE HEAT TRANSFER MODEL FOR SUB-100 µ M CHANNELS ....121 7.1.5
GENERAL DESIGN RULES FOR TWO-PHASE MICROCHANNEL HEAT SINKS
.......................................................122 7.2 A SAMPLE
DESIGN OF A TWO-PHASE MICROCHANNEL HEAT SINK ..............123 7.3
FUTURE
STUDIES..................................................................................124
APPENDIX A: PROCESS FLOW CHART FOR SINGLE-CHANNEL DEVICES WITH COMBINED
HEATER AND THERMOMETERS ...........................127 APPENDIX B:
PROCESS FLOW CHART FOR SINGLE-CHANNEL DEVICES WITH SEPARATE HEATER AND
THERMOMETERS..............................129 REFERENCES
.....................................................................................................131
INDEX..............................................................................................................139
|
| any_adam_object | 1 |
| author | Zhang, Lian Goodson, Kenneth E. Kenny, Thomas William |
| author_facet | Zhang, Lian Goodson, Kenneth E. Kenny, Thomas William |
| author_role | aut aut aut |
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| dewey-search | 621.381/044 |
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| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
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| spelling | Zhang, Lian Verfasser aut Silicon microchannel heat sinks theories and phenomena L. Zhang, K.E. Goodson, T.W. Kenny Berlin [u.a.] Springer 2004 IX, 140 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Microtechnology and MEMS Physics and astronomy online library Heat sinks (Electronics) Heat Transmission Semiconductors Cooling Temperaturmessung (DE-588)4133187-4 gnd rswk-swf System-on-Chip (DE-588)4740357-3 gnd rswk-swf Wärmeübertragung (DE-588)4064211-2 gnd rswk-swf Halbleitertechnologie (DE-588)4158814-9 gnd rswk-swf Kühlkörper (DE-588)4584443-4 gnd rswk-swf Siliciumbauelement (DE-588)4181368-6 gnd rswk-swf System-on-Chip (DE-588)4740357-3 s Siliciumbauelement (DE-588)4181368-6 s Halbleitertechnologie (DE-588)4158814-9 s Kühlkörper (DE-588)4584443-4 s Wärmeübertragung (DE-588)4064211-2 s Temperaturmessung (DE-588)4133187-4 s DE-604 Goodson, Kenneth E. Verfasser aut Kenny, Thomas William Verfasser aut SWB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010601402&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Zhang, Lian Goodson, Kenneth E. Kenny, Thomas William Silicon microchannel heat sinks theories and phenomena Heat sinks (Electronics) Heat Transmission Semiconductors Cooling Temperaturmessung (DE-588)4133187-4 gnd System-on-Chip (DE-588)4740357-3 gnd Wärmeübertragung (DE-588)4064211-2 gnd Halbleitertechnologie (DE-588)4158814-9 gnd Kühlkörper (DE-588)4584443-4 gnd Siliciumbauelement (DE-588)4181368-6 gnd |
| subject_GND | (DE-588)4133187-4 (DE-588)4740357-3 (DE-588)4064211-2 (DE-588)4158814-9 (DE-588)4584443-4 (DE-588)4181368-6 |
| title | Silicon microchannel heat sinks theories and phenomena |
| title_auth | Silicon microchannel heat sinks theories and phenomena |
| title_exact_search | Silicon microchannel heat sinks theories and phenomena |
| title_full | Silicon microchannel heat sinks theories and phenomena L. Zhang, K.E. Goodson, T.W. Kenny |
| title_fullStr | Silicon microchannel heat sinks theories and phenomena L. Zhang, K.E. Goodson, T.W. Kenny |
| title_full_unstemmed | Silicon microchannel heat sinks theories and phenomena L. Zhang, K.E. Goodson, T.W. Kenny |
| title_short | Silicon microchannel heat sinks |
| title_sort | silicon microchannel heat sinks theories and phenomena |
| title_sub | theories and phenomena |
| topic | Heat sinks (Electronics) Heat Transmission Semiconductors Cooling Temperaturmessung (DE-588)4133187-4 gnd System-on-Chip (DE-588)4740357-3 gnd Wärmeübertragung (DE-588)4064211-2 gnd Halbleitertechnologie (DE-588)4158814-9 gnd Kühlkörper (DE-588)4584443-4 gnd Siliciumbauelement (DE-588)4181368-6 gnd |
| topic_facet | Heat sinks (Electronics) Heat Transmission Semiconductors Cooling Temperaturmessung System-on-Chip Wärmeübertragung Halbleitertechnologie Kühlkörper Siliciumbauelement |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010601402&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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