Advances in applied materials and electronics engineering III: selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China
Gespeichert in:
Körperschaft: | |
---|---|
Weitere Verfasser: | , , |
Format: | Elektronisch Tagungsbericht E-Book |
Sprache: | English |
Veröffentlicht: |
Durnten-Zurich
Trans Tech Publications Ltd.
2014
|
Schriftenreihe: | Advanced materials research
905 |
Schlagworte: | |
Online-Zugang: | FAW01 FAW02 |
Beschreibung: | Print version record |
Beschreibung: | 1 online resource (789 pages) illustrations (some color) |
ISBN: | 9783038264392 3038264393 3038350583 9783038350583 |
Internformat
MARC
LEADER | 00000nmm a2200000zcb4500 | ||
---|---|---|---|
001 | BV043781036 | ||
003 | DE-604 | ||
005 | 20180129 | ||
006 | a |||| 10||| | ||
007 | cr|uuu---uuuuu | ||
008 | 160920s2014 |||| o||u| ||||||eng d | ||
020 | |a 9783038264392 |9 978-3-03826-439-2 | ||
020 | |a 3038264393 |9 3-03826-439-3 | ||
020 | |a 3038350583 |9 3-03835-058-3 | ||
020 | |a 9783038350583 |9 978-3-03835-058-3 | ||
035 | |a (ZDB-4-EBA)ocn879664358 | ||
035 | |a (OCoLC)879664358 | ||
035 | |a (DE-599)BVBBV043781036 | ||
040 | |a DE-604 |b ger |e rda | ||
041 | 0 | |a eng | |
049 | |a DE-1046 |a DE-1047 | ||
082 | 0 | |a 621.381 |2 23 | |
111 | 2 | |a International Conference on Applied Materials and Electronics Engineering |n 3 |d 2014 |c Hongkong |j Verfasser |0 (DE-588)1053309503 |4 aut | |
245 | 1 | 0 | |a Advances in applied materials and electronics engineering III |b selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China |c edited by Brendan Gan, Y. Gan and Y. Yu |
264 | 1 | |a Durnten-Zurich |b Trans Tech Publications Ltd. |c 2014 | |
264 | 4 | |c © 2014 | |
300 | |a 1 online resource (789 pages) |b illustrations (some color) | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 1 | |a Advanced materials research |v v. 905 | |
500 | |a Print version record | ||
505 | 8 | |a Collection of selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China. The 161 papers are grouped as follows: Chapter 1: Nanoscience and Nanotechnology,Chapter 2: Materials Science and Processing,Chapter 3: Building and Construction: Materials, Planning and Design, Chapter 4: Environmental Research, Chapter 5: Power and Electronic Engineering,Chapter 6: Control Systems and Engineering,Chapter 7: Monitoring and Data Processing,Chapter 8: Communications and Networking,Chapter 9: Information System and Computer,Chapter 10: Management and Education. Keyword: Material Science and Technology; Nanoscience and Nanotechnology; Environmental Engineering and Materials Science; Civil Engineering and Materials Science; Chemical and Materials Engineering Over 150 papers discuss nanoscience and nanotechnology; materials science and processing; building and construction: materials, planning, and design; environmental research; power and electronic engineering; control systems and engineering; monitoring and data processing; communications and networking; information systems and computers; and management and education. Among specific topics are determining parameters for accurate dimension in wire electrical discharge machining, dynamic properties of silicate-grouted sand at low stress level, a semi-fuzzy logic signal optimization model of an isolated over-saturated intersection, and a snap-stabilizing wave algorithm with multiple initiators in arbitrary networks | |
650 | 7 | |a TECHNOLOGY & ENGINEERING / Mechanical |2 bisacsh | |
650 | 7 | |a Electronics / Materials |2 fast | |
650 | 7 | |a Materials science |2 fast | |
650 | 4 | |a Electronics |x Materials |v Congresses |a Materials science |v Congresses | |
655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
700 | 1 | |a Gan, Brendan |4 edt | |
700 | 1 | |a Gan, Y. |4 edt | |
700 | 1 | |a Yu, Y. |4 edt | |
776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |a Advances in applied materials and electronics engineering iii |
830 | 0 | |a Advanced materials research |v 905 |w (DE-604)BV035441301 |9 905 | |
912 | |a ZDB-4-EBA | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-029192096 | ||
966 | e | |u http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=773233 |l FAW01 |p ZDB-4-EBA |q FAW_PDA_EBA |x Aggregator |3 Volltext | |
966 | e | |u http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=773233 |l FAW02 |p ZDB-4-EBA |q FAW_PDA_EBA |x Aggregator |3 Volltext |
Datensatz im Suchindex
_version_ | 1804176611323412480 |
---|---|
any_adam_object | |
author2 | Gan, Brendan Gan, Y. Yu, Y. |
author2_role | edt edt edt |
author2_variant | b g bg y g yg y y yy |
author_corporate | International Conference on Applied Materials and Electronics Engineering Hongkong |
author_corporate_role | aut |
author_facet | Gan, Brendan Gan, Y. Yu, Y. International Conference on Applied Materials and Electronics Engineering Hongkong |
author_sort | International Conference on Applied Materials and Electronics Engineering Hongkong |
building | Verbundindex |
bvnumber | BV043781036 |
collection | ZDB-4-EBA |
contents | Collection of selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China. The 161 papers are grouped as follows: Chapter 1: Nanoscience and Nanotechnology,Chapter 2: Materials Science and Processing,Chapter 3: Building and Construction: Materials, Planning and Design, Chapter 4: Environmental Research, Chapter 5: Power and Electronic Engineering,Chapter 6: Control Systems and Engineering,Chapter 7: Monitoring and Data Processing,Chapter 8: Communications and Networking,Chapter 9: Information System and Computer,Chapter 10: Management and Education. Keyword: Material Science and Technology; Nanoscience and Nanotechnology; Environmental Engineering and Materials Science; Civil Engineering and Materials Science; Chemical and Materials Engineering Over 150 papers discuss nanoscience and nanotechnology; materials science and processing; building and construction: materials, planning, and design; environmental research; power and electronic engineering; control systems and engineering; monitoring and data processing; communications and networking; information systems and computers; and management and education. Among specific topics are determining parameters for accurate dimension in wire electrical discharge machining, dynamic properties of silicate-grouted sand at low stress level, a semi-fuzzy logic signal optimization model of an isolated over-saturated intersection, and a snap-stabilizing wave algorithm with multiple initiators in arbitrary networks |
ctrlnum | (ZDB-4-EBA)ocn879664358 (OCoLC)879664358 (DE-599)BVBBV043781036 |
dewey-full | 621.381 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381 |
dewey-search | 621.381 |
dewey-sort | 3621.381 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic Conference Proceeding eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03958nmm a2200529zcb4500</leader><controlfield tag="001">BV043781036</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20180129 </controlfield><controlfield tag="006">a |||| 10||| </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">160920s2014 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038264392</subfield><subfield code="9">978-3-03826-439-2</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3038264393</subfield><subfield code="9">3-03826-439-3</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3038350583</subfield><subfield code="9">3-03835-058-3</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038350583</subfield><subfield code="9">978-3-03835-058-3</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-4-EBA)ocn879664358</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)879664358</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV043781036</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1046</subfield><subfield code="a">DE-1047</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="111" ind1="2" ind2=" "><subfield code="a">International Conference on Applied Materials and Electronics Engineering</subfield><subfield code="n">3</subfield><subfield code="d">2014</subfield><subfield code="c">Hongkong</subfield><subfield code="j">Verfasser</subfield><subfield code="0">(DE-588)1053309503</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advances in applied materials and electronics engineering III</subfield><subfield code="b">selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China</subfield><subfield code="c">edited by Brendan Gan, Y. Gan and Y. Yu</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Durnten-Zurich</subfield><subfield code="b">Trans Tech Publications Ltd.</subfield><subfield code="c">2014</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2014</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (789 pages)</subfield><subfield code="b">illustrations (some color)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Advanced materials research</subfield><subfield code="v">v. 905</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Print version record</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Collection of selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China. The 161 papers are grouped as follows: Chapter 1: Nanoscience and Nanotechnology,Chapter 2: Materials Science and Processing,Chapter 3: Building and Construction: Materials, Planning and Design, Chapter 4: Environmental Research, Chapter 5: Power and Electronic Engineering,Chapter 6: Control Systems and Engineering,Chapter 7: Monitoring and Data Processing,Chapter 8: Communications and Networking,Chapter 9: Information System and Computer,Chapter 10: Management and Education. Keyword: Material Science and Technology; Nanoscience and Nanotechnology; Environmental Engineering and Materials Science; Civil Engineering and Materials Science; Chemical and Materials Engineering Over 150 papers discuss nanoscience and nanotechnology; materials science and processing; building and construction: materials, planning, and design; environmental research; power and electronic engineering; control systems and engineering; monitoring and data processing; communications and networking; information systems and computers; and management and education. Among specific topics are determining parameters for accurate dimension in wire electrical discharge machining, dynamic properties of silicate-grouted sand at low stress level, a semi-fuzzy logic signal optimization model of an isolated over-saturated intersection, and a snap-stabilizing wave algorithm with multiple initiators in arbitrary networks</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Mechanical</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronics / Materials</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Materials science</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield><subfield code="x">Materials</subfield><subfield code="v">Congresses</subfield><subfield code="a">Materials science</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Gan, Brendan</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Gan, Y.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Yu, Y.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="a">Advances in applied materials and electronics engineering iii</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Advanced materials research</subfield><subfield code="v">905</subfield><subfield code="w">(DE-604)BV035441301</subfield><subfield code="9">905</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-EBA</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-029192096</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=773233</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FAW_PDA_EBA</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=773233</subfield><subfield code="l">FAW02</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FAW_PDA_EBA</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
genre | (DE-588)1071861417 Konferenzschrift gnd-content |
genre_facet | Konferenzschrift |
id | DE-604.BV043781036 |
illustrated | Illustrated |
indexdate | 2024-07-10T07:34:56Z |
institution | BVB |
institution_GND | (DE-588)1053309503 |
isbn | 9783038264392 3038264393 3038350583 9783038350583 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029192096 |
oclc_num | 879664358 |
open_access_boolean | |
owner | DE-1046 DE-1047 |
owner_facet | DE-1046 DE-1047 |
physical | 1 online resource (789 pages) illustrations (some color) |
psigel | ZDB-4-EBA ZDB-4-EBA FAW_PDA_EBA |
publishDate | 2014 |
publishDateSearch | 2014 |
publishDateSort | 2014 |
publisher | Trans Tech Publications Ltd. |
record_format | marc |
series | Advanced materials research |
series2 | Advanced materials research |
spelling | International Conference on Applied Materials and Electronics Engineering 3 2014 Hongkong Verfasser (DE-588)1053309503 aut Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China edited by Brendan Gan, Y. Gan and Y. Yu Durnten-Zurich Trans Tech Publications Ltd. 2014 © 2014 1 online resource (789 pages) illustrations (some color) txt rdacontent c rdamedia cr rdacarrier Advanced materials research v. 905 Print version record Collection of selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China. The 161 papers are grouped as follows: Chapter 1: Nanoscience and Nanotechnology,Chapter 2: Materials Science and Processing,Chapter 3: Building and Construction: Materials, Planning and Design, Chapter 4: Environmental Research, Chapter 5: Power and Electronic Engineering,Chapter 6: Control Systems and Engineering,Chapter 7: Monitoring and Data Processing,Chapter 8: Communications and Networking,Chapter 9: Information System and Computer,Chapter 10: Management and Education. Keyword: Material Science and Technology; Nanoscience and Nanotechnology; Environmental Engineering and Materials Science; Civil Engineering and Materials Science; Chemical and Materials Engineering Over 150 papers discuss nanoscience and nanotechnology; materials science and processing; building and construction: materials, planning, and design; environmental research; power and electronic engineering; control systems and engineering; monitoring and data processing; communications and networking; information systems and computers; and management and education. Among specific topics are determining parameters for accurate dimension in wire electrical discharge machining, dynamic properties of silicate-grouted sand at low stress level, a semi-fuzzy logic signal optimization model of an isolated over-saturated intersection, and a snap-stabilizing wave algorithm with multiple initiators in arbitrary networks TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronics / Materials fast Materials science fast Electronics Materials Congresses Materials science Congresses (DE-588)1071861417 Konferenzschrift gnd-content Gan, Brendan edt Gan, Y. edt Yu, Y. edt Erscheint auch als Druck-Ausgabe Advances in applied materials and electronics engineering iii Advanced materials research 905 (DE-604)BV035441301 905 |
spellingShingle | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China Advanced materials research Collection of selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China. The 161 papers are grouped as follows: Chapter 1: Nanoscience and Nanotechnology,Chapter 2: Materials Science and Processing,Chapter 3: Building and Construction: Materials, Planning and Design, Chapter 4: Environmental Research, Chapter 5: Power and Electronic Engineering,Chapter 6: Control Systems and Engineering,Chapter 7: Monitoring and Data Processing,Chapter 8: Communications and Networking,Chapter 9: Information System and Computer,Chapter 10: Management and Education. Keyword: Material Science and Technology; Nanoscience and Nanotechnology; Environmental Engineering and Materials Science; Civil Engineering and Materials Science; Chemical and Materials Engineering Over 150 papers discuss nanoscience and nanotechnology; materials science and processing; building and construction: materials, planning, and design; environmental research; power and electronic engineering; control systems and engineering; monitoring and data processing; communications and networking; information systems and computers; and management and education. Among specific topics are determining parameters for accurate dimension in wire electrical discharge machining, dynamic properties of silicate-grouted sand at low stress level, a semi-fuzzy logic signal optimization model of an isolated over-saturated intersection, and a snap-stabilizing wave algorithm with multiple initiators in arbitrary networks TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronics / Materials fast Materials science fast Electronics Materials Congresses Materials science Congresses |
subject_GND | (DE-588)1071861417 |
title | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China |
title_auth | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China |
title_exact_search | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China |
title_full | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China edited by Brendan Gan, Y. Gan and Y. Yu |
title_fullStr | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China edited by Brendan Gan, Y. Gan and Y. Yu |
title_full_unstemmed | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China edited by Brendan Gan, Y. Gan and Y. Yu |
title_short | Advances in applied materials and electronics engineering III |
title_sort | advances in applied materials and electronics engineering iii selected peer reviewed papers from the 2014 3rd international conference on applied materials and electronics engineering amee 2014 april 26 27 2014 hong kong china |
title_sub | selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China |
topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronics / Materials fast Materials science fast Electronics Materials Congresses Materials science Congresses |
topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Electronics / Materials Materials science Electronics Materials Congresses Materials science Congresses Konferenzschrift |
volume_link | (DE-604)BV035441301 |
work_keys_str_mv | AT internationalconferenceonappliedmaterialsandelectronicsengineeringhongkong advancesinappliedmaterialsandelectronicsengineeringiiiselectedpeerreviewedpapersfromthe20143rdinternationalconferenceonappliedmaterialsandelectronicsengineeringamee2014april26272014hongkongchina AT ganbrendan advancesinappliedmaterialsandelectronicsengineeringiiiselectedpeerreviewedpapersfromthe20143rdinternationalconferenceonappliedmaterialsandelectronicsengineeringamee2014april26272014hongkongchina AT gany advancesinappliedmaterialsandelectronicsengineeringiiiselectedpeerreviewedpapersfromthe20143rdinternationalconferenceonappliedmaterialsandelectronicsengineeringamee2014april26272014hongkongchina AT yuy advancesinappliedmaterialsandelectronicsengineeringiiiselectedpeerreviewedpapersfromthe20143rdinternationalconferenceonappliedmaterialsandelectronicsengineeringamee2014april26272014hongkongchina |