System design using high density packaging and multi chip modules:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Mikrofilm Buch |
| Sprache: | English |
| Veröffentlicht: |
2000
|
| Ausgabe: | [Mikrofiche-Ausg.] |
| Schlagworte: | |
| Beschreibung: | Zürich, Techn. Hochsch., Diss., 2000. - Mikrofiche-Ausg.: 2 Mikrofiches : 24x |
| Beschreibung: | X, 142 S. Ill., graph. Darst. |
Internformat
MARC
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| 100 | 1 | |a Hirt, Etienne |e Verfasser |4 aut | |
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| 300 | |a X, 142 S. |b Ill., graph. Darst. | ||
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| 500 | |a Zürich, Techn. Hochsch., Diss., 2000. - Mikrofiche-Ausg.: 2 Mikrofiches : 24x | ||
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| 650 | 0 | 7 | |a Partitionierung |0 (DE-588)4139496-3 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Multichiptechnik |0 (DE-588)4267925-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Substrat |g Mikroelektronik |0 (DE-588)4229622-5 |2 gnd |9 rswk-swf |
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Datensatz im Suchindex
| _version_ | 1804128099039707136 |
|---|---|
| any_adam_object | |
| author | Hirt, Etienne |
| author_facet | Hirt, Etienne |
| author_role | aut |
| author_sort | Hirt, Etienne |
| author_variant | e h eh |
| building | Verbundindex |
| bvnumber | BV013325056 |
| classification_tum | ELT 272d |
| ctrlnum | (OCoLC)633480832 (DE-599)BVBBV013325056 |
| discipline | Elektrotechnik |
| edition | [Mikrofiche-Ausg.] |
| format | Microfilm Book |
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| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| id | DE-604.BV013325056 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:43:51Z |
| institution | BVB |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009087427 |
| oclc_num | 633480832 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | X, 142 S. Ill., graph. Darst. |
| publishDate | 2000 |
| publishDateSearch | 2000 |
| publishDateSort | 2000 |
| record_format | marc |
| spelling | Hirt, Etienne Verfasser aut System design using high density packaging and multi chip modules presented by Etienne Ramon Hirt-Schnurrenberger [Mikrofiche-Ausg.] 2000 X, 142 S. Ill., graph. Darst. txt rdacontent h rdamedia he rdacarrier Zürich, Techn. Hochsch., Diss., 2000. - Mikrofiche-Ausg.: 2 Mikrofiches : 24x Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf Platzierung Mikroelektronik (DE-588)4197293-4 gnd rswk-swf Partitionierung (DE-588)4139496-3 gnd rswk-swf Multichiptechnik (DE-588)4267925-4 gnd rswk-swf Substrat Mikroelektronik (DE-588)4229622-5 gnd rswk-swf (DE-588)4113937-9 Hochschulschrift gnd-content Multichiptechnik (DE-588)4267925-4 s Platzierung Mikroelektronik (DE-588)4197293-4 s Partitionierung (DE-588)4139496-3 s Substrat Mikroelektronik (DE-588)4229622-5 s Verbindungstechnik (DE-588)4129183-9 s DE-604 |
| spellingShingle | Hirt, Etienne System design using high density packaging and multi chip modules Verbindungstechnik (DE-588)4129183-9 gnd Platzierung Mikroelektronik (DE-588)4197293-4 gnd Partitionierung (DE-588)4139496-3 gnd Multichiptechnik (DE-588)4267925-4 gnd Substrat Mikroelektronik (DE-588)4229622-5 gnd |
| subject_GND | (DE-588)4129183-9 (DE-588)4197293-4 (DE-588)4139496-3 (DE-588)4267925-4 (DE-588)4229622-5 (DE-588)4113937-9 |
| title | System design using high density packaging and multi chip modules |
| title_auth | System design using high density packaging and multi chip modules |
| title_exact_search | System design using high density packaging and multi chip modules |
| title_full | System design using high density packaging and multi chip modules presented by Etienne Ramon Hirt-Schnurrenberger |
| title_fullStr | System design using high density packaging and multi chip modules presented by Etienne Ramon Hirt-Schnurrenberger |
| title_full_unstemmed | System design using high density packaging and multi chip modules presented by Etienne Ramon Hirt-Schnurrenberger |
| title_short | System design using high density packaging and multi chip modules |
| title_sort | system design using high density packaging and multi chip modules |
| topic | Verbindungstechnik (DE-588)4129183-9 gnd Platzierung Mikroelektronik (DE-588)4197293-4 gnd Partitionierung (DE-588)4139496-3 gnd Multichiptechnik (DE-588)4267925-4 gnd Substrat Mikroelektronik (DE-588)4229622-5 gnd |
| topic_facet | Verbindungstechnik Platzierung Mikroelektronik Partitionierung Multichiptechnik Substrat Mikroelektronik Hochschulschrift |
| work_keys_str_mv | AT hirtetienne systemdesignusinghighdensitypackagingandmultichipmodules |