Verfügbarkeit: HDP 2000 proceedings

HDP 2000 proceedings: [Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.]

Gespeichert in:

Bibliographische Detailangaben
Körperschaften:	HDP User Group International (VerfasserIn), International Microelectronics and Packaging Society (VerfasserIn)
Format:	Elektronisch Software E-Book
Sprache:	English
Veröffentlicht:	IMAPS Deutschland 2000
Schlagworte:	Konferenzschrift
Online-Zugang:	Inhaltsverzeichnis
Beschreibung:	1 CD-ROM 12 cm

Internformat

MARC


LEADER	00000nmm a2200000 c 4500
001	BV014790222
003	DE-604
005	00000000000000.0
006	a \|\|\|\| 10\|\|\|
007	co\|uuu---uuuuu
008	021010s2000 \|\|\|\| q\|\|u\| \|\|\|\|\|\|eng d
035			\|a (OCoLC)633384013
035			\|a (DE-599)BVBBV014790222
040			\|a DE-604 \|b ger \|e rakwb
041	0		\|a eng
049			\|a DE-91
110	2		\|a HDP User Group International \|e Verfasser \|0 (DE-588)5230597-1 \|4 aut
245	1	0	\|a HDP 2000 proceedings \|b [Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.]
264		1	\|b IMAPS Deutschland \|c 2000
300			\|a 1 CD-ROM \|c 12 cm
337			\|b c \|2 rdamedia
338			\|b cd \|2 rdacarrier
655		7	\|0 (DE-588)1071861417 \|a Konferenzschrift \|2 gnd-content
710	2		\|a International Microelectronics and Packaging Society \|e Verfasser \|0 (DE-588)5256499-X \|4 aut
710	2		\|a HDP User Group International \|e Sonstige \|0 (DE-588)5230597-1 \|4 oth
710	2	2	\|a International Microelectronics and Packaging Society \|0 (DE-588)5256499-X \|4 aut \|t IMAPS 2000 proceedings
856	4	2	\|m Digitalisierung TU Muenchen \|q application/pdf \|u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010010796&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA \|3 Inhaltsverzeichnis
999			\|a oai:aleph.bib-bvb.de:BVB01-010010796
249			\|a IMAPS 2000 proceedings \|c Sponsored by IMAPS

Datensatz im Suchindex

_version_	1804129568739557376
adam_text	Proceedings Internati« Lal Symposium on oelectronics [ynes Convention Center Boston, Massachusetts Sponsored by IMAPS International Microelectronics And Packaging Society Table of Contents ■^ Emerging Technologies ^ Paper titles designated by ■■ were selected by the Emerging Technologies Subcommittee as representing the most important and innovative new developments within their respective areas of technology. Session WAI Chip Scale Packaging Session Chairs: Theodore Tessier, Micro Systems Engineering, Inc. Charles Bauer, TechLead Corporation 001 Strategy for Characterizing and Minimizing Effects of Tensile Stress in CSP s as Induced by Board Flexure Ian R. Harvey, David Turner, Jim Ortowski, Bourns Electronics; Chris Herbert, Bourns Electronics - Ireland 009 Reliability and Failure Analysis of CSP under Bending Cycling Test T.C. Huang, D.P. Lai, S.H. Ho, Jo Lee, P. J. Zheng, J.G. Hwang, J.D. Wu, Advanced Semiconductor Engineering, Inc. 015 Corrosion Studies of mBGA Package Tae-Gyeong Chung, Sang -Но Ahn, Shin Kim, Seyong Oh, Samsung Electronics Co. 021 Single and Multiple Laser Solder Ball Placement and Reflow for Wafer Level CSP Thomas Oppert, Thorsten Teutsch, Elke Zakel, Рас Tech — Packaging Technologies GmbH; Ghassem Azdasht, Smart Рас GmbH 028 Flip Chip Ball Grid Array Packaging for RFICs C.P. Hung, Larry Wu, С. Т. Chiu, J. S. Hsieh, J.J. Lee, Advanced Semiconductor Engineering, Inc. Session WA2 RF, Microwave and Wireless Session Chairs: Aicha Elshabini, University of Arkansas John Gipprich, Northrop Grumman Corporation 034 A Successful Thick-Film Implementation of a 10 GHz Phase Locked Oscillator Module Donald J Delzer, Tektronix, Inc.; Len Roland, Majtek Components Corporation 040 BGA Reliability of Multilayer Ceramic Integrated Circuit (MCIC) Devices Chia-Yu Fu, Rong-Fong Huang, Motorola 046 A Novel Low Cost T/R Module MMIC Protection Scheme William R. Kritzlet, Gary Yan, Lockheed Martin NE&SS; Thomas Górzyca, Renato Guido, General Electric 051 Antenna-Integrated Millimeter Wave Transmis¬ sion Module Technology Koki Kitaoka, Naoki Sakota, Noriko Kakimoto, Hiroshi Matsubara, Atsushi Yamada, Eiji Suemastu, Hiroya Sato, Sharp Corporation 057 Substrate Characterization: Simulation and Measurement at High Microwave Frequencies Charles E. Free, ZhengrongTian, Middlesex Univer¬ sity; Peter Barnwell, Heraeus Inc. 062 * Development of Power Amplifier Modules ■with Embedded Passives for LMR (Land Mobile Radio) by using LTCC-M Technology S.D. Park, I.T. Kim, J.D. Yu, H. Park, K.C. Ahn, KR. Kim, M.S. Yang, J.D. Mun, Daewoo Electronics Co., Ltd.; S.S. Kong, Orion Electronic Co. Ltd.; B.C. Lee, M. Electronics Session WA3 Polymeric Materials for Packaging Session Chairs: Bill Petefish, W.L. Gore & Associates, Inc. Charles Brown, Motorola 068 The Effects of Temperature and Aging on Young s Moduli of Polymeric Based Flexible Substrates Ron Li, Jinbao Jiao, Motorola Inc. 074 Low-cost, High Throughput, Large Area Meniscus Coating for MCM-D and MCM-I. Substrates Swapan Bhattacharya, Sachin Bhatevara, Hector Morales, Sherlon Kauffman, Edward Kamen, Gary S. May, Georgia Institute of Technology 080 Benzocyclobutene (BCB) Based Polymer with Enhanced Toughness Ying-HungSo,Jang-Hi Im, Jack Hetzner, James Curphy, Britton Kaliszewski,John Blackson, Michelle Patterson, The Dow Chemical Company; Philip Garrou, Dan Scheck, The Dow Chemical Company @ MCNC; Kaoru Ohba, Hideki Akimoto, Masahiko Kohno, Dow Chemical Japan Limited; Albert Achen, Dow Europe 087 Effects of Processing Parameters on the Perfor¬ mance of Epoxy Encapsulant Materials Christine Naito, Michael Todd, Dexter Corporation Table of Contents 094 Electron Beam and Variable Frequency Micro¬ wave Processing for Rapid Curing of Polymer Dielectrics Paul A. Kohl, Kimberly Farnsworth, Rahul Manepalli, Sue Ann Bidstrup-AUen, Georgia Institute of Technol¬ ogy Session WA4 Interconnect and Substrate Solutions for Power Packaging Session Chairs: Dave Kellerman, Materials Solutions Corporation Doug Hopkins, Energy Systems Institute 099 Investigation of Wirebonds on Insulated-Metal Substrate for Multichip Power Module Applica¬ tions W. L. Ng, S. S. Ang, T. Thach, В. Ivy, F. Barlow, A. Elshabini, К. С Burgers, K.J. Olejrúczak, W. D. Brown, University of Arkansas 105 Stress and Strain Simulation of Power MOSFET Solder Attachment on Different Substrates R.K. Shiue, P.C. Chang, National Dong Hwa Univer¬ sity; W.D. Zhuang, Scnsitron Semiconductor 112 Selective Solders in the Sealing of Automotive Electronics Richard E. Phelan, Scientific Sealing Technology 118 The Use of Thick Print Copper and Silver Conductors for Power Applications David K. Anderson, DuPont і Technologies; John Oleksyn, Martin Batson, John Cocker, DuPont (UK) Limited 123 Embedded Power-an Integration Packaging Technology for IPEMs Zhenxian Liang, Fred C. Lee, G.Q. Lu, Virginia Tech. 134 Nondestructive Wirebond Evaluation using Laser Acoustic Signals B. M. Romenesko, H. K. Charles, Jr., J . A. Cristion, The Johns Hopkins University/A PL; B. K. Siu, Simpex Technologies, Inc. 139 ROBOCOTS: A Program to Assure Robust Packaging of Commercial-Off-The-Shelf (COTS) Integrated Circuits John K. Hagge, Rockwell Collins 150 A Design of Experiments for a Tape Casting Process Cynthia Berry, Deborah Partlow, Theodore Vasilow, Stephen Gurkovich, Alex Bailey, Northrop Grumman Corporation 156 Variation Maps Sezai Dogdu, Yu See Loi, Andrea Electronics Corpora¬ tion; Daryl L. Santos, Binghamton University; Raymond Chan, Antonio Precise Products Manufac¬ tory Ltd. 160 Robust Assembly Technology for Surface Mount Leadless Ceramic Components on Organic Circuit Boards Deployed in an Outside-Plant Wireless Base-Station System Robert W. Kotlowitz, Hamid R. Falaki, Lucent Technologies 166 New Process Monitoring Strategies for Large Area Panel Processing Didier Cottet, Michael Scheffler, Gerhard Troestcr, ΕΤΗ Zurich Session WP1 Ball Grid Array Technology Session Chairs: Philip Garrou, Dow Chemical Company Scott Popelar, 1С Interconnect Session WA5 Quality Advances in Packaging Technology- Session Chairs: Donald Havas, Visteon Elaine Savage, Teltech 172 ! 178 128 An Analysis of Semiconductor Package by X-ray CT Instrument \| Tsumoru Takado, Hiroshi Arita, Yasuhide Ohno, j Kumamoto University; Shuhei Ohnishi, Akira \| Hirakimoto, Shimadzu Corporation I • A Micromachined Ball Grid Array Test Socket for Fine-Pitch Interconnect B. Huang, S. S. Ang, E. V. Porter, F. Barlow, Q. Qiao, M. H. Gordon, W. F. Schmidt, W. D. Brown, Λ. Eishabini, University of Arkansas/HiDEC * Monolith Package - A Novel FBGA using 3-D TLC Process and the New Assembly by Printing Method Osamu Shimada, Kazuhisa Suzuki, Yoshiaki Wakashima, Toshimasa Nagoshi, Naoki Fukutomi, Hitachi Chemical Co., Ltd. XH Table of Contents 184 Flow Properties of Underfill Materials in Flip-Chip Packaging Jinlin Wang, Intel Corporation 190 Hollow Packaging Technology Employing Photosensitive Adhesive Resins Takuo Funaya, Naoji Senba, Koji Matsui, NEC Corporation Session WP2 High Density Packaging Session Chairs: Rajen Chanchani, Sandia National Laboratories Andy Strandjord, 1С Interconnect 196 Electroless Nickel/Gold Plating on Copper Based Semiconductors Andrew J.G. Strandjord, Scott F. Popelář, Curt A. Erickson, 1С Interconnect 202 Next Generation Ceramic Multilayer System R.J. Bacher, Y.L. Wang, M.A. Skurski, J.C. Crumpton, K.M. Nair, DuPont (Technologies 208 * Thin Chip Integration (TCI-Modules) - A Novel Technique for Manufacturing Three Dimensional IC-Packages M. Toepper, K. Scherpinski, H.-P. Spoerle, C. Landesberger, O. Ehrmann, H. Reichl, Fraunhofer IZM 212 · Advanced Multilayer Polyimide Substrate Utilizing UV Laser Microvia Technology Scott Corbett, Jeff Strole, Ben Ross, Philjordan, Joe Ketterl, Thayer Hughes, MicroSound Systems, Inc. 217 Does Low Cost Large Panel Processing mean Low Performance? Michael Scheffler, Didier Cottet, Gerhard Troester, ΕΤΗ Zurich Session WP3 Τ animated Interconnects Session Chairs: Roupen Keusseyan, DuPont Electronic Materials Bruce Romenesko, The Johns Hopkins University/ APL 223 Low СТЕ Cast-Polyimide Substrate for Tape Packages Applications Akira Tokumitsu, Makota Yamasaki, Nippon Steel Chemical Co., LTD. 229 High Density Interconnect Substrates using Multilayer Thin Film Technology on Laminate Substrates (MCM-SL/D) Eric Beyne, Rita Van Hoof, Tomas Webers, IMF.C; Francois Lechleiter, Technopuce; Stéphanie Rossi, CIMULEC; Marianni Di Ianni, Bull Italy; Andreas Ostmann, TUBcrliti 235 Multi Layer Substrate with Low Coefficent o[ Thermal Expansion Kei Nakamura, Masayuki Kaneto, Yasushi lnouc, Takuji Okeyui, Kiyoshi Miyake, Shinya Oota, Nieto Denko Corporation 241 Advanced Three-Dimensional Packaging Technol¬ ogy for High-Density CCD Micro-Camera System Module Hiroshi Yamada, Takashi Togasaki, Takashi Tcrui, Masanobu Kimura, Kazushige Ooi, Hajime Sudo, Toshiba Corporation 247 On the Reliability and Failure of PBGA Intercon¬ nects under Bending Cyclic Test S.H. Ho, PJ. Zheng.J.D. Wu, S.C. Hung, Advanced Semiconductor Engineering, Inc. Session WP4 Design Solutions for High Energy Packaging Session Chairs: Dave Kellerman, Materials Solutions Corporation Doug Hopkins, Energy Systems Institute 253 New Hybrids High-Reliability AC-DC Convert¬ ers for Halogen Lamps Janusz J. Gondek, Michal Wachta, Private Institute of Electronic Engineering; Marek Korpak, Janusz Pawelczyk, Wiesław Zaraska, R & D Center for Hybrid Microelectronics and Resistors; Jan Косої, Technical School of Communications 257 Optimizing Thermal Performance for Design of Advanced Power Electronics Assembly G. Xiong, University of Kentucky; C.-L. Chen, D. Kehl, Rockwell Science Center 264 Power Chip Interconnection: From Wire Bonding to Area Bonding Xingsheng Liu, Guo-Quan Lu, Virginia Tech 270 Integrated Power-Thermal Management tor High Performance Integrated Circuits Tsorng-Dih Yuan, Bor Zen Hong, Howard H. Then. Li-Kong Wong, IBM Corporation Table of Contents Session THAI Environment-Friendly Packaging Technology in Japan (Japanese Translated Session) Session Chairs: Charles Bauer, TechLead Corporation Yuzo Shimada, NEC Corporation 275 Environment Friendly Technology for Mobile Machines Kazuhisa Tsunoi, Kcnji Iketaki, Fujitsu Ltd. 281 Development of Halogen/Antimony Free Multilayer PWB Materials for Notebook PC (Halogen-Free FR-4 and Halogen-Free RSC) Tetsuaki Suzuki, Toshiba Chemical Corporation 287 New Flip-Chip Bonding Technology NSD (Non Conductive Film Stud-Bump Direct Interconnec¬ tion) Method using Resin Encapsulation Sheet Kazuto Nishida, Hidenobu Nishikawa, Kazumichi Shimizu, Hiroyuki Otani, Matsushita Electric Industrial Co., Ltd.; Hideo Koguchi, Nagaoka University of Technology 293 Reliability of Solder Paste and Solder Pre-Coating Technology by Lead-Free Sn-Zn Base Solder Alloy Takekazu Sakai, Hitoshi Ami ta, Yoshinori Shibuya, Tadatoshi Kurozumi, Shunsuke Nagasaki, Takashi Shoji, Showa Denko K.K. 303 Mechanism and Prevention of Lift-Off in Lead- Free Soldering Katsuaki Suganuma, Osaka University 308 Reliability of Pb-free Solder Joints of Surface- mounted LSI Packages after Flow-soldering Tetuya Nakatsuka, Koji Serizawa, Tasao Soga, Hanae Shimokawa, Asao Nishimura, Hitachi, Ltd. 314 Lead Free Soldering Technology for Mobile Equipment YasunoriTanaka.JunichiTakahashi, Kazuyuki Kawashima, NEC Corporation Session ΊΉΑ2 Thick Film and Polymer Thick Film Technology Session Chairs: Harry Kellzi, Teledyne Electronic Technologies Richard Sigliano, Kyocera America, Inc. 320 Novel Method of Ensuring Printed Ink Thickness Leia Wesselmann, University of California at San Diego; Ken Kuang, Kyocera America Inc. 325 Through-hole Plugs and Thermal Vias John C. Crumpton, Victoria E. Cofield, Rudolph J . Bacher, DuPont ; Technologies 330 Thick Film on Stainless Steel; Applications, Methods and Processes M. Ed Ellis, Fred Richter, Delphi-Delco Electonics Systems; Mary E. Levitsky, Heraeus Inc. 335 The Ultimate Thick Film Gold Composition P.J. OUivier, R. J. Bacher, J. C Crumpton, DuPont ; Technologies 340 Extending Gold Thick Film Technology through Materials and Process Development Meg Tredinnick, David Malanga, Chuck Sabo, Heraeus Circuit Materials Division 346 New Feasibilities for Multilayer Boards Polymer- Thick-Film Technology on Silicone Polymer Substrates Gernot Bischoff, Gert Winkler, Ilmenau Technical University; Hubert Landeck, KEW Konzeptentwicklung GmbH 351 ■* Evaluation of Carbon-Filled Polymer Compos¬ ites for Future Base Substrate and Integral Resistor Applications P. Markondeya Raj, Ken-ichi Shinotani, Himanshu Agarwal, George E. White, Rao R. Tummala, Georgia Institute of Technology XIV Table of Contents Session ΊΉΑ3 Thermal Management I Session Chairs: Matt Gordon, University of Arkansas Tarak Railkar, Conexant Corporation 357 Thermal Characterization of Flip-Chip BGA H.N. Chen, C.T. Wu, P.J. Lin, S.C. Hung, Advanced Semiconductor Engineering, Inc. 362 Transient Plane Source Technique for Measuring Thermal Properties of Silicone Materials used in Electronic Assemblies Craig Dixon, Mathis Instruments Ltd.; Michael R. Strong, S. Mark Zhang, Dow Corning Corporation 371 Thermal Simulation of a Unique Ultra-Thin Semiconductor Packaging Architecture for Improved Power Dissipation Alex Pike, Steve Jacobs, Mike Sickmiller, ELO Technologies, Inc. 375 Thermal Performance Comparison of a Micropro¬ cessor using Phase Change Materials in Various Configurations Paul Gauché, Sarang Shidore, Flomerics Inc. 381 Computational Modeling and Simulation of Thermal Effects in a New Design of a Small Form- Factor Pluggable (SEP) System Ryszard Pryputniewicz, Worcester Polytechnic Institute, Steven A. Weiler, Sam R. Shaw, William L. Herb, Tyco Electronics Corporation Session ΤΉΑ4 Modeling and Simulation Session Chairs: Luu Nguyen, National Semiconductor Corporation Rajen Chanchani, Sandia National Laboratories 387 Modeling and Charaterization of High-Speed Serial Link Interconnection Media Dennis Miller, Alok Tripathi, Intel Corporation 392 Microwave-Frequency Model and High-Density Design of Multiple Line Grid Array (MLGA) Package Joungho Kim, Seungyoung Ahn, Joon-Woo Lee, Jonghoon Kim, Woongwhan Ryu, KAIST; Young-Soo Kim, Hyun Seok Choi, Byung Hun Kum, Chong K. Yoon, GLOTECH Inc. 398 * Virtual Thermo-Mechanical Prototyping of Electronic Packaging using Philips Optimization Strategy J.Janssen, G.Q. Zhang, J. Bisschop, Z.N. Liang, F. Kuper, R. Schravendeel, Philips; LJ. Ernst, Delft University of Technology 406 Numerical Modeling of Frequency Dependent Effects Encountered in Digital Interconnects Fethi Bellaminc, Newbridge Networks 409 Over GHz Digital Packaging Technology Yoshihiro Nabe, Hisayoshi Wada, Shoji Uegaki, Shigeto Takeda, Masahiro Fukui, Kyocera Corporation 414 Design Considerations for Multilevel Spiral Inductors in RFICs R. D. Lutz, V. K. Tripathi, Α. Weisshaar, Oregon State University Session THA5: Sensors and MEMS I Session Chairs: David Galipeau, South Dakota State University Ajay Malshe, University of Arkansas 420 Acoustic Wave Sensors in a Hybrid Microelec¬ tronic Package Samuel Mark Borowski, Stuart M. Wentworth, Auburn University 426 * Investigation of MEMS Microengines Rotating at 360,000 rpm Gordon C. Brown, Ryszard J. Pryputniewicz, Worces¬ ter Polytechnic Institute 432 Investigating Polymer Thick-Films on Silicon for the Implementation of Hybrid Microsystems Thomas V. Papakostas, Neil M. White, University or Southampton 438 ■» PLD and LCVD of Discrete and Microhotplate Tin Oxide Sensors D.R. Owens, J.K. Lumpp, University of Kentucky 443 * ACES Characterization of Surface Micromachined Microfluidic Devices Ryszard Pryputniewicz, Gordon С Brown, Cosme Furlong, EmüyJ. Pryputniewicz, Worcester Polytech¬ nic Institute; Paul Galambos, Sandia National Laborato - ries Table of Contents Session ΊΉΡ1 Flip Chip Technology Session Chairs: Andrew Strandjord, 1С Interconnect Usama Abdali, Conexant Systems 449 ■· IMS - Injection Molded Soldering David Danovitch, IBM Canada; Peter A. Gruber, IBM Thomas J . Watson Research Center 454 Stencil Printing Holds High Promise for Wafer Bumping Jon Roberts, Cookson Performance Solutions 460 Design Consideration for a Bump Bonding Yusuke Watanabe, Denso Corporation 465 Flip Chip on Laminate Reliability - Accelerated Testing and Failure Analysis Michael Roesch, Hewlett-Packard Company; Robert W. Teichner, Teichner Consulting; Rod Martens, FormFactor Inc. 471 Factors Affecting Board Level Reliability in Solder Ball Array Packages Charles Williams, Gary Morrison, Texas Instruments, Inc. 477 Flip Chip Reliability Modeling Based on Solder Fatigue as Applied to Flip Chip on Laminate Assemblies Scott Popelář, 1С Interconnect; Micheal Roesch, Hewlett-Packard Company Session THP2 Integrated Passives Session Chairs: Bob Heistand, AVX Corporation Ronjensen, Honeywell 484 Integral Passives in Multi-dielectric Substrate Lin-Kun Wu, Bin-Chyi Tseng, National Chiao Tung University; Li-Chun Iiao, Industrial Technology Research Institute 489 Integral Capacitors Built as an Embedded Layer in Printed Wiring Boards Joseph P. Dougherty, Tim Klinger, Dick Brenneman, Paul Moses, Maria Klimkiewicz, Penn State University 495 ■· Ni-Zn-Cu Ferrite Embedded into Low Tem¬ perature Co-fired Ceramic Substrates Shen-Li Fu, Lih-Shan Chen, Chi-Shiung His, i-Shou University 500 High-Q Spiral Inductors for High Performance Integrated RF Front-End Sub-Systems P. Pieters, K. Vaesen, G. Carchon, S. Brebels, W. De Raedt, E. Beyne, R.P. Mertens, IMEC Session THP3 Thermal Management II Session Chairs: Ajay Malshe, University of Arkansas Vijaya Gumaste, National Semiconductor 506 Thermal Management of IC s using Heat Sinks Incorporating Phase Change Materials (PCM), Cont d Maurice Marongiu, MJM Engineering Co.; M.K. Berhe, G.S. Fallon, Fluent Inc. 512 Investigation of Packaged Miniature Heat Pipe for Notebook PC Cooling Seok Hwan Moon, Gunn Hwang, Tae Goo Choy, ETRI ; Kwang Soo Kim, Apack Co., Korea 518 Low Cost and High Effective Thermal Manage¬ ment using PBGA MCM Package S.G. Kim, D.E. Chung, J.H. Woo, S.W. Lim, In-Tech Wave Co.; C.K. Lee, LG Information & Commnicatioos Ltd. 524 Thermal Limit of Enhanced BGA Package Jack G. Hwang, Hung-Nan Chen, Lin-Wei Lee, Chang-Chi Lee, Advanced Semiconductor Engineer¬ ing, Inc. 530 A Design Approach to Thermal Characterization of Forced Convection Systems using Superposi¬ tion in CFD Paul Gauché, Flomerics Inc. 536 A Parametric Study of the Next Generation Axxion Computer Chassis Danny Castillo, Axxion Group Corp.; Karl Jacobson, Flomerics Inc. Table of Contents Session ΊΉΡ4 Lead-Free Developments and New Inorganic Materials Session Chairs: Herb Neuhaus, Nano Pierce Technologies, Inc. Luu Nguyen, National Semiconductor Corporation 541 Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects Ning-Cheng Lee, Indium Corporation of America 551 Lead Free Solders for Area Array Packaging E. Jung, J. Kloeser, R. Aschenbrenner, H. Reichl, Fraunhofer IZM; Ch. Kallmayer, P. Coslcina, Techni¬ cal University of Berlin 558 Lead-Free Soldering: An Overview and Compari¬ son of the Viable Solutions Karl Seelig, David Suraski, AIM, Inc. 564 Manufacturing of Low Cost Smart Labels Michael E. Wernle, NanoPierce Card Technologies GmbH Session THP5 Sensors and MEMS Π Session Chairs: Dave Galipeau, South Dakota State University Dick Gehman, Honeywell, Inc. 569 !* A Modular, Direct-Chip-Attach MEMS Pack¬ age: Architecture and Processing Jordan Neysmith, Daniel F. Baldwin, Georgia Institute ofTechnology 574 ■ Measuring and Modeling of Shape Memory Effects in SMAs for Development of Microactuators Shivananda P. Mizar, Ryszard Pryputniewicz, Worces¬ ter Polytechnic Institute 580 Effects of Packaging Process Steps on the Func¬ tionality of MEMS Devices: Investigation of Electrical Interconnection on Lubricated MEMS AjayP. Malshe, Sushila Singh, Keith Hankins,Jedediah J. Young, B. S. Park , S. N. Yedavc, W. D. Brown, University of Arkansas 586 · Suitability of an Epoxy Seal for a MEMS Package Josh Jacobs, Josh Malone, Texas Instruments 592 Die Recovery for Prototype Applications R. Tumminelli, M. O Sullivan, E. Ayers, R. Sutherland, D. Gay, T. Marinis, Draper Laboratory 598 MEMS Packaging Issues and Materials Ken Gilleo, Cookson Electronics Session FAI Novel Manufacturing Processes Session Chairs: Ken Kuang, Kyocera America, Inc. Nicole Cavanah, Rockwell International 605 Developing and Benchmarking Lead-Free Pro¬ cesses Alan Rae, Ronald Lasky, Joe Belmonte, Jim McLenaghan, Dan Gosselin, Cookson Electronics Inc. 611 Lead-Free Soldering for CSP: The Impact of Higher Temperature SMT Assembly Processing Vem Solberg, Tessera, Inc. 617 On the Effect of Manufacturing Process on Mechanical Integrity of Multi Chip Modules used in Cellular Phone Applications A. R. Langari, H. Hashemi, M. S. Dadkhah, Conexant Systems Inc.; W. L. Morris, K. L. Rugg, Rockwell Science Center 623 A New Manufacturing Process for High Volume Production of Ceramic Column Grid Array Modules Louis Achard, Isabel De Sousa, IBM Canada 628 KDG, Repair, and Module Testing Influences on MCM Yield and Cost H. K. Charles, Jr., W. E. Barnhart, The Johns Hopkins University Session FA2 LTCC Advancements Session Chairs: John Menaugh, DuPont Michael Ehlert, National Semiconductor 636 Pb-Free Resistor for Pb-Free LTCC System Masashi Fukaya, SMI-ED Ogaki Ceramics Inc.; Chiaki Higuchi, Tanaka Kikinzoku Kogyo K.K. XVII Table of Contents 642 Integration Techniques for MMICs and Chip Devices in LTCC Multichip Modules for Radio Frequencies R. Kulke, W. Simon, M. Rittweger, I. Wolff, IMST GmbH; S. Baker, R. Powell, M. Harrison, Marconi Caswell Ltd. 648 Novel Lamination Technique of Manufacture Ceramic Multilayer Devices Andreas Rooscn, University of Erlangen-Nuremberg 654 Low Loss Tape Materials System for 10 to 40 GHz Application D.I. Amey, M.A. Smith, SJ. Horowitz, P.C. Donahue, C.R. Needes, DuPont Microcircuit Materials; M.Y. Keating, E.I. DuPont Central Research & Develop¬ ment 659 An Investigation of the Properties of LTCC Materials and Compatible Conductors for their use in Wireless Applications Peter Barnwell, Weiming Zang, Jeff Lebowitz, Heraeus Circuit Materials Division; Kinzy Jones, Nigel MacDonald, Florida International University; Charles Free, Zhengrong Tian, Middlesex University 665 LTCC Ceramic Components on Printed Wiring Boards - The Issues and Potential Solutions Yong S. Cho, Christopher R. Needes, Kenneth E. Souders, Kenneth W. Hang, Paul C. Dooohue, Andrew R. Niblett, Dan I. Amey, DuPont і Technolo¬ gies 669 Chemical, Structural and Mechanical Properties of the LTCC Tapes W. Kinzy Jones, Yanquin Liu, Brooks Larsen, Peng Wang, Marc Zampino, Florida International University Scion FA3 Wirebonding Session Chairs: Lee Levine, Kulicke & Soffa Industries, Inc. Tom Green, National Training Center for Microelectronics 675 Substrate and Assembly Manufacturing Key Enablers to Achieve Finer Pitch Wire Bonded Ball Grid Arrays Sheila Chopin, Lois Yong, Motorola Inc.; Rick Chiu, Jack Kuo, Advanced Semiconductor Engineering 681 Gold Ribbon Bonding for Microelectronic Inter¬ connection: A Designed Experiment to Evaluate Process Opportunities Christina M. Conway, Nicole L. Cavanah, Rockwell Collins, Inc. 688 Investigation into the Au Wire Bonding Reliabil¬ ity Issue on Ag-Plated Cu Leads of 1С Packages Chi Fo Tsang, Hui Kim Hui, Institute of Microelec¬ tronics 694 Clad Aluminum Bond Surfaces on Lead-frames for Gold Fine Wire Bonding Philip W. Lees, Technical Materials, Inc. 697 Evaluation of Gas Chemistry Effects on Wire Bond Integrity and Package Interfacial Adhesion in the BGA Package Michael Leoni, Jeannie Miller, Shawn O Connor, Trent A. Thompson, Motorola Semiconductor Products Sector 702 New Wire Bondable Gold Thick Film Conduc¬ tors for LTCC Applications Liang Chai, Ferro Electronics Materials FA4 Flip Chip, Wircbond, Substrate or Interface Reliability Session Chairs: Frank Spexarth, Co-Planar, Inc. Bruce Hultmark, Foranne Manufacturing 706 A High Speed Solution to Blocking Moisture Entry into Plastic Cavity Packages Richard J . Ross, RJR Polymers, Inc. 711 A New In-Situ Strain Measurement Technique for Solder Joint Reliability Prediction Rajendra D. Pendse, Hewlett-Packard / ChipPac; Peng Zhou, Stanford University 716 Via-in-pad Reliability in Mechanical Cycling Fatigue Krishna Jonnalagadda, Motorola Advanced Technology Center 722 Reliability of Lead Free BGA Packages Swaminath Prasad, Flynn Carson, G.S. Kim, J.S. Lee, T.S. Jeong, Y.S. Kim, ChipPAC, Incorporated Table of Contents 727 Fine Pitch Probing and Wire Bonding and Reliability of Multi-Layer Copper Interconnect Structures Lei Mercado, Robert Radkc, Matthew Ruston, Tu Anh Tran, Bill Williams, Lois Yong, Motorola Semiconduc¬ tor Products Sector; Audi Chen, Scott Chen, Advanced Semiconductor Engineering, Inc. (ASE-CL) 733 The Correct Model for, and Use of, Hast Nihal Sinnadurai, ATTAC Session FA5 Adhesives and Encapsulants Session Chairs: Michael Todd, Dexter Electronics Gordon Dayton, Vishay Vitramon 737 High Reliability Interconnection Technology using Conductive Adhesive Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Minehiro Itagaki, Yoshihiro Bessho, Matsushita Electric Industrial Co., Ltd. 743 Thermal Management Performance and Attach¬ ment Reliability using Urethane Film Adhesives Frank Liotine, Jr., S.M.T. Consulting Company; Joseph F. Vaccaro, Aptek Labs, Incorporated 749 The Effect of Cyanate Ester and Anhydride Hardeners on the Properties of Underfill/ Anisotropie Conductive Paste in the Electronic Applications Zeng Yu Tsung, Wen Tsung Chang, Chingyi Chang, Hsiu-Rong Chang, Yee Fong Chemical & Ind. Co., Ltd.; Yeong Tsyr Hwang, E dale Technology Co., Ltd. 752 Characterization of the Rheological Properties of Epoxy-molding Compound Chingyi Chang, Hsiu-Rong Chang, Yee Fong Chemical & Ind. Co., Ltd.; Yeong Tsyr Hwang, E dale Technology Co., Ltd. 756 Silicone Material Solutions for Enhanced Reliabil¬ ity in Device Packaging Edward J. Benson, Stanton Dent, Dow Corning Corporation; Katsutoshi Mine, Dow Corning Toray Silicones 760 Transfer Molding Encapsulation of Flip Chip Array Packages Louis P. Rector, Shaoqin Gong, Tara R. Miles, Dexter Corporation; Kevin Gaffney, Amkor Technology Interactive Forum (Poster Papers) 768 An Approach to MEM Sensor Array Packaging Joseph W. Soucy, Jason F. Haley, Thomas F. Marinis, Draper Laboratory 772 Robust Process Window for Maintaining Resistor Balance during Production Printing M. Ed Ellis, Delphi-Delco Electonics Systems 778 ·► Non-Destructive Evaluation of CSP Reliability using Scanning Acoustic Microscopy Jim Stradling, Sonix, Inc. 784 Application of Project Management Methodolog) in New Product Introductions at Motorola s Final Assembly Facility Mary McDonald, Rick Nolan, Motorola 788 A Study on Oval Type Solder Ball Land for High Density BGA Package Applications S.J. Kim, S.J. Son, A. Syed, Amkor Technology Inc. 796 Equivalent Circuit Generation in FDTD Package Modeling A. Wien, Α. Lauer, I. Wolff, IMST GmbH 800 Volumetric Flow? Velocity? Configuration? Which One Determines Heat Transfer Efficency in Convection Furnaces Pierre LeMieux, BTU International, Inc. 803 A Microwave Application for State of the Art Multilayer Substrate Technology David J. Nabatian, EMCA-REMEX; Dave Kellerman, Material Solutions; Richard Chick, MIT Lincoln Labs. 808 Bump & Underfill Free Flip-Chip Technology for VLSI/MCM Assembly, Based on Universal Contact Unit Alexander Taran, Vladimir Krivoshapko, Patrick Reilly, Microelectronics Assembly Innovations 814 Computer Aided Design and Fabrication of Thick Film Magnetic Composite Inductors Robert S. Fielder, Virginia Polytechnic Institute and State University 820 Reliability Studies of Anisotropie Conductive Adhesives in Flex to LCD Applications Cameron T. Murray, Peter B. Hogerton, Theary Cheang, Robert L. Rudman, 3M Company XIX Table of Contents 826 ■ New MCM-L Structure Applying Packageless Chip Size Devices and Laser Processed Board Zs. Illyefalvi- Vitéz, J. Pinkola, M. Ruszinkó, P. Bojta, L. Hertel, Budapest University of Technology and Economics 832 At Last! True Printed Circuits on Organic Sub¬ strates - Using a Polymer/Metal Material to Print Solderable Conductors David JJ Lowrie, Balvinder Chowdhary, Mike G. Firmstone, Multicore Solders Ltd.; Hugh Craig, SVT Inc. 836 Analysis of a Film Adhesive for Thermal Manage¬ ment Applications Andrew Collins, Paul Morganelli, Emerson & Cuming; Delbert Friesen, Ablestik Laboratories 842 Mechanical Components in LTCC Torsten Thelemann, Heiko Thust, Technical Univer¬ sity of Ilmenau; Uwe Partsch, Fraunhofer Institute for Ceramic Technologies and Sintered Materials 846 Thermal Conductivity and Resistance Measure¬ ments of Three-Layer Composites with Solders Chia-Pin Chiu, Jim Maveety, Lise Varner, Intel Corporation 852 Liquid Crys talline Polymer Circuit Materials : Setting New Standards in Stability of Dielectric Properties Michael St. Lawrence, Rogers Corporation 857 Nonlinear Fracture Mechanics Analysis of Wafer Level Chip Scale Package Solder Joints with Cracks John H. Lau, Stephen H. Pan, Chris Chang, Express Packaging Systems, Inc. 866 Creep Behaviors of Flip Chip on Board with 96.5Sn-3.5Ag and 100 in Lead-Free Solder Joints John H. Lau, Stephen H. Pan, Express Packaging Systems, Inc. 874 * Computational and Experimental Approach to Thermal Management in Microelectronics and Packaging Cosme Furlong, RyszardJ. Pryputniewicz, Worcester Polytechnic Institute Appendix 881 Organizational Members 884 Index of Authors XX
any_adam_object	1
author_corporate	HDP User Group International International Microelectronics and Packaging Society International Microelectronics and Packaging Society
author_corporate_role	aut aut aut
author_facet	HDP User Group International International Microelectronics and Packaging Society International Microelectronics and Packaging Society
author_sort	HDP User Group International
building	Verbundindex
bvnumber	BV014790222
ctrlnum	(OCoLC)633384013 (DE-599)BVBBV014790222
format	Electronic Software eBook
fullrecord	<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01401nmm a2200313 c 4500</leader><controlfield tag="001">BV014790222</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="006">a \|\|\|\| 10\|\|\| </controlfield><controlfield tag="007">co\|uuu---uuuuu</controlfield><controlfield tag="008">021010s2000 \|\|\|\| q\|\|u\| \|\|\|\|\|\|eng d</controlfield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)633384013</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV014790222</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-91</subfield></datafield><datafield tag="110" ind1="2" ind2=" "><subfield code="a">HDP User Group International</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)5230597-1</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">HDP 2000 proceedings</subfield><subfield code="b">[Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.]</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="b">IMAPS Deutschland</subfield><subfield code="c">2000</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 CD-ROM</subfield><subfield code="c">12 cm</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cd</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">International Microelectronics and Packaging Society</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)5256499-X</subfield><subfield code="4">aut</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">HDP User Group International</subfield><subfield code="e">Sonstige</subfield><subfield code="0">(DE-588)5230597-1</subfield><subfield code="4">oth</subfield></datafield><datafield tag="710" ind1="2" ind2="2"><subfield code="a">International Microelectronics and Packaging Society</subfield><subfield code="0">(DE-588)5256499-X</subfield><subfield code="4">aut</subfield><subfield code="t">IMAPS 2000 proceedings</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Digitalisierung TU Muenchen</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010010796&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-010010796</subfield></datafield><datafield tag="249" ind1=" " ind2=" "><subfield code="a">IMAPS 2000 proceedings</subfield><subfield code="c">Sponsored by IMAPS</subfield></datafield></record></collection>
genre	(DE-588)1071861417 Konferenzschrift gnd-content
genre_facet	Konferenzschrift
id	DE-604.BV014790222
illustrated	Not Illustrated
indexdate	2024-07-09T19:07:13Z
institution	BVB
institution_GND	(DE-588)5230597-1 (DE-588)5256499-X
language	English
oai_aleph_id	oai:aleph.bib-bvb.de:BVB01-010010796
oclc_num	633384013
open_access_boolean
owner	DE-91 DE-BY-TUM
owner_facet	DE-91 DE-BY-TUM
physical	1 CD-ROM 12 cm
publishDate	2000
publishDateSearch	2000
publishDateSort	2000
publisher	IMAPS Deutschland
record_format	marc
spelling	HDP User Group International Verfasser (DE-588)5230597-1 aut HDP 2000 proceedings [Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.] IMAPS Deutschland 2000 1 CD-ROM 12 cm c rdamedia cd rdacarrier (DE-588)1071861417 Konferenzschrift gnd-content International Microelectronics and Packaging Society Verfasser (DE-588)5256499-X aut HDP User Group International Sonstige (DE-588)5230597-1 oth International Microelectronics and Packaging Society (DE-588)5256499-X aut IMAPS 2000 proceedings Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010010796&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis IMAPS 2000 proceedings Sponsored by IMAPS
spellingShingle	HDP 2000 proceedings [Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.]
subject_GND	(DE-588)1071861417
title	HDP 2000 proceedings [Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.]
title_alt	IMAPS 2000 proceedings
title_auth	HDP 2000 proceedings [Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.]
title_exact_search	HDP 2000 proceedings [Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.]
title_full	HDP 2000 proceedings [Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.]
title_fullStr	HDP 2000 proceedings [Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.]
title_full_unstemmed	HDP 2000 proceedings [Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.]
title_short	HDP 2000 proceedings
title_sort	hdp 2000 proceedings sept 20 22 2000 hynes convention center boston mass
title_sub	[Sept. 20 - 22, 2000, Hynes Convention Center, Boston, Mass.]
topic_facet	Konferenzschrift
url	http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010010796&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA
work_keys_str_mv	AT hdpusergroupinternational hdp2000proceedingssept20222000hynesconventioncenterbostonmass AT internationalmicroelectronicsandpackagingsociety hdp2000proceedingssept20222000hynesconventioncenterbostonmass

Verfügbarkeit

Es ist kein Print-Exemplar vorhanden.

Fernleihe Bestellen Achtung: Nicht im THWS-Bestand! Inhaltsverzeichnis

MARC

Datensatz im Suchindex

Es ist kein Print-Exemplar vorhanden.

Ähnliche Einträge