Three-dimensional integrated circuit design:
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, a...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Cambridge, MA
Morgan Kaufmann is an imprint of Elsevier
[2017]
|
| Ausgabe: | Second edition |
| Schlagworte: | |
| Online-Zugang: | FLA01 Volltext |
| Zusammenfassung: | Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVsElectrical modeling and closed-form expressions of through silicon viasSubstrate noise coupling in heterogeneous 3-D ICsDesign of 3-D ICs with inductive linksSynchronization in 3-D ICsVariation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 online resource (l, 718 Seiten) |
| ISBN: | 9780124104846 0124104843 |
Internformat
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Datensatz im Suchindex
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| any_adam_object | |
| author | Pavlidis, Vasilis F. 1976- Savidis, Ioannis Frian, Eby G. |
| author_facet | Pavlidis, Vasilis F. 1976- Savidis, Ioannis Frian, Eby G. |
| author_role | aut aut aut |
| author_sort | Pavlidis, Vasilis F. 1976- |
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| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | Second edition |
| format | Electronic eBook |
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| id | DE-604.BV045131388 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:09:35Z |
| institution | BVB |
| isbn | 9780124104846 0124104843 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030521383 |
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| spelling | Pavlidis, Vasilis F. 1976- Verfasser aut Three-dimensional integrated circuit design Vasilis F. Pavlidis, Ioannis Savidis, Eby G. Friedman Second edition Cambridge, MA Morgan Kaufmann is an imprint of Elsevier [2017] 1 online resource (l, 718 Seiten) txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVsElectrical modeling and closed-form expressions of through silicon viasSubstrate noise coupling in heterogeneous 3-D ICsDesign of 3-D ICs with inductive linksSynchronization in 3-D ICsVariation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires TECHNOLOGY & ENGINEERING / Electronics / Circuits / General bisacsh TECHNOLOGY & ENGINEERING / Electronics / Circuits / Integrated bisacsh Three-dimensional integrated circuits Design and construction Dreidimensionale Integration (DE-588)4218841-6 gnd rswk-swf Konstruktion (DE-588)4032231-2 gnd rswk-swf Schaltungsentwurf (DE-588)4179389-4 gnd rswk-swf Design (DE-588)4011510-0 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 s Dreidimensionale Integration (DE-588)4218841-6 s Konstruktion (DE-588)4032231-2 s 1\p DE-604 Design (DE-588)4011510-0 s 2\p DE-604 Schaltungsentwurf (DE-588)4179389-4 s 3\p DE-604 Savidis, Ioannis aut Frian, Eby G. aut Erscheint auch als Druck-Ausgabe 9780124105010 http://www.sciencedirect.com/science/book/9780124105010 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 3\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Pavlidis, Vasilis F. 1976- Savidis, Ioannis Frian, Eby G. Three-dimensional integrated circuit design TECHNOLOGY & ENGINEERING / Electronics / Circuits / General bisacsh TECHNOLOGY & ENGINEERING / Electronics / Circuits / Integrated bisacsh Three-dimensional integrated circuits Design and construction Dreidimensionale Integration (DE-588)4218841-6 gnd Konstruktion (DE-588)4032231-2 gnd Schaltungsentwurf (DE-588)4179389-4 gnd Design (DE-588)4011510-0 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| subject_GND | (DE-588)4218841-6 (DE-588)4032231-2 (DE-588)4179389-4 (DE-588)4011510-0 (DE-588)4027242-4 |
| title | Three-dimensional integrated circuit design |
| title_auth | Three-dimensional integrated circuit design |
| title_exact_search | Three-dimensional integrated circuit design |
| title_full | Three-dimensional integrated circuit design Vasilis F. Pavlidis, Ioannis Savidis, Eby G. Friedman |
| title_fullStr | Three-dimensional integrated circuit design Vasilis F. Pavlidis, Ioannis Savidis, Eby G. Friedman |
| title_full_unstemmed | Three-dimensional integrated circuit design Vasilis F. Pavlidis, Ioannis Savidis, Eby G. Friedman |
| title_short | Three-dimensional integrated circuit design |
| title_sort | three dimensional integrated circuit design |
| topic | TECHNOLOGY & ENGINEERING / Electronics / Circuits / General bisacsh TECHNOLOGY & ENGINEERING / Electronics / Circuits / Integrated bisacsh Three-dimensional integrated circuits Design and construction Dreidimensionale Integration (DE-588)4218841-6 gnd Konstruktion (DE-588)4032231-2 gnd Schaltungsentwurf (DE-588)4179389-4 gnd Design (DE-588)4011510-0 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| topic_facet | TECHNOLOGY & ENGINEERING / Electronics / Circuits / General TECHNOLOGY & ENGINEERING / Electronics / Circuits / Integrated Three-dimensional integrated circuits Design and construction Dreidimensionale Integration Konstruktion Schaltungsentwurf Design Integrierte Schaltung |
| url | http://www.sciencedirect.com/science/book/9780124105010 |
| work_keys_str_mv | AT pavlidisvasilisf threedimensionalintegratedcircuitdesign AT savidisioannis threedimensionalintegratedcircuitdesign AT frianebyg threedimensionalintegratedcircuitdesign |