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  1. 1
    The development and characterization of a Cu-pillar flip-chip package for mm-wave applications

    The development and characterization of a Cu-pillar flip-chip package for mm-wave applications by Cao, Zhibo

    Published 2024
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    Thesis Electronic eBook Interlibrary loan Place Request


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  2. 2
    The development and characterization of a Cu-pillar flip-chip package for mm-wave applications

    The development and characterization of a Cu-pillar flip-chip package for mm-wave applications by Cao, Zhibo

    Published 2024
    Get full text
    Thesis Book Interlibrary loan Place Request


    Saved in:

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