3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Cham
Springer International Publishing
2022
Cham Springer |
| Ausgabe: | 1st ed. 2022 |
| Schlagworte: | |
| Online-Zugang: | BTU01 FAB01 FAW01 FHA01 FHD01 FHI01 FHM01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 HTW01 TUM01 UBY01 UER01 Volltext |
| Beschreibung: | 1 Online-Ressource (XXV, 395 p. 102 illus., 100 illus. in color) |
| ISBN: | 9783030982294 |
| DOI: | 10.1007/978-3-030-98229-4 |
Internformat
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Datensatz im Suchindex
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| author | Bamberg, Lennart Joseph, Jan Moritz García-Ortiz, Alberto Pionteck, Thilo |
| author_facet | Bamberg, Lennart Joseph, Jan Moritz García-Ortiz, Alberto Pionteck, Thilo |
| author_role | aut aut aut aut |
| author_sort | Bamberg, Lennart |
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| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
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| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| discipline_str_mv | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| doi_str_mv | 10.1007/978-3-030-98229-4 |
| edition | 1st ed. 2022 |
| format | Electronic eBook |
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| illustrated | Not Illustrated |
| index_date | 2024-07-03T20:08:31Z |
| indexdate | 2024-08-01T10:34:22Z |
| institution | BVB |
| isbn | 9783030982294 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-033687546 |
| oclc_num | 1335409135 |
| open_access_boolean | |
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| physical | 1 Online-Ressource (XXV, 395 p. 102 illus., 100 illus. in color) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2022 |
| publishDate | 2022 |
| publishDateSearch | 2022 |
| publishDateSort | 2022 |
| publisher | Springer International Publishing Springer |
| record_format | marc |
| spellingShingle | Bamberg, Lennart Joseph, Jan Moritz García-Ortiz, Alberto Pionteck, Thilo 3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization Electronic Circuits and Systems Embedded Systems Processor Architectures Electronic circuits Embedded computer systems Microprocessors Computer architecture |
| title | 3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization |
| title_auth | 3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization |
| title_exact_search | 3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization |
| title_exact_search_txtP | 3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization |
| title_full | 3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization by Lennart Bamberg, Jan Moritz Joseph, Alberto García-Ortiz, Thilo Pionteck |
| title_fullStr | 3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization by Lennart Bamberg, Jan Moritz Joseph, Alberto García-Ortiz, Thilo Pionteck |
| title_full_unstemmed | 3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization by Lennart Bamberg, Jan Moritz Joseph, Alberto García-Ortiz, Thilo Pionteck |
| title_short | 3D Interconnect Architectures for Heterogeneous Technologies |
| title_sort | 3d interconnect architectures for heterogeneous technologies modeling and optimization |
| title_sub | Modeling and Optimization |
| topic | Electronic Circuits and Systems Embedded Systems Processor Architectures Electronic circuits Embedded computer systems Microprocessors Computer architecture |
| topic_facet | Electronic Circuits and Systems Embedded Systems Processor Architectures Electronic circuits Embedded computer systems Microprocessors Computer architecture |
| url | https://doi.org/10.1007/978-3-030-98229-4 |
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